RADEON

AMD Radeon E9171 MCM

AMD graphics card specifications and benchmark scores

4 GB
VRAM
1219
MHz Boost
40W
TDP
128
Bus Width

At a Glance

AMD
VRAM 4 GB
Boost Clock 1,219 MHz
Shaders 512
Bus Width 128-bit
TDP 40W
Memory Type GDDR5
Architecture GCN 4.0
nm
Process 14 nm
Released Oct 2017

AMD Radeon E9171 MCM Specifications

GPU Core

Shader units and compute resources

The AMD Radeon E9171 MCM GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
512
Shaders
512
TMUs
32
ROPs
16
Compute Units
8

E9171 MCM Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the Radeon E9171 MCM's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Radeon E9171 MCM by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

Base Clock
1124 MHz
Base Clock
1,124 MHz
Boost Clock
1219 MHz
Boost Clock
1,219 MHz
Memory Clock
1500 MHz 6 Gbps effective
GDDR GDDR 6X 6X

AMD's Radeon E9171 MCM Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Radeon E9171 MCM's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
4 GB
VRAM
4,096 MB
Memory Type
GDDR5
VRAM Type
GDDR5
Memory Bus
128 bit
Bus Width
128-bit
Bandwidth
96.00 GB/s

Radeon E9171 MCM by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the E9171 MCM, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
512 KB

E9171 MCM Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD Radeon E9171 MCM against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
1,248.3 GFLOPS
FP64 (Double)
78.02 GFLOPS (1:16)
FP16 (Half)
1,248.3 GFLOPS (1:1)
Pixel Rate
19.50 GPixel/s
Texture Rate
39.01 GTexel/s

GCN 4.0 Architecture & Process

Manufacturing and design details

The AMD Radeon E9171 MCM is built on AMD's GCN 4.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the E9171 MCM will perform in GPU benchmarks compared to previous generations.

Architecture
GCN 4.0
GPU Name
Lexa
Process Node
14 nm
Foundry
GlobalFoundries
Transistors
2,200 million
Die Size
103 mm²
Density
21.4M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the AMD Radeon E9171 MCM determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Radeon E9171 MCM to maintain boost clocks without throttling.

TDP
40 W
TDP
40W
Power Connectors
None

Radeon E9171 MCM by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD Radeon E9171 MCM are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
IGP
Bus Interface
PCIe 3.0 x8
Display Outputs
Portable Device Dependent
Display Outputs
Portable Device Dependent

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD Radeon E9171 MCM. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
12 (12_0)
DirectX
12 (12_0)
OpenGL
4.6
OpenGL
4.6
Vulkan
1.3
Vulkan
1.3
OpenCL
2.1
Shader Model
6.7

Radeon E9171 MCM Product Information

Release and pricing details

The AMD Radeon E9171 MCM is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Radeon E9171 MCM by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Oct 2017
Production
End-of-life

About AMD Radeon E9171 MCM

The AMD Radeon E9171 MCM is an embedded-generation GPU using the Lexa chip and GCN 4.0 architecture, fabricated by GlobalFoundries on a 14 nm process with a 103 mm² die and 2,200 million transistors. The FACT PACK lists no benchmark scores, an average benchmark score of 0, and no nearest rivals; its only comparative placement is percentileVsAllGpus: 50. That makes the E9171 MCM a database median GPU, but with no measured scores or rival entries attached to the record.

Benchmark Performance

The FACT PACK contains no entries in its benchmarks list, and the nearestRivals field is empty. Exact percentage deltas against rival products cannot be computed because there are no rival names, scores, or deltaPct values in the record. The only comparative metric is percentileVsAllGpus: 50, which places the E9171 MCM at the 50th percentile of all GPUs tracked in the database. This is a midpoint placement: it ranks above the lower portion of the GPU population and below the upper portion, but the data does not specify which individual GPUs sit on either side.

The raw compute rates are nevertheless itemized. The pipeline contains 512 shading units, 32 texture mapping units, and 16 raster output units. Base clock is 1124 MHz and boost clock is 1219 MHz, yielding a peak pixel rate of 19.50 GPixel/s and a peak texture rate of 39.01 GTexel/s. FP32 throughput is 1,248.3 GFLOPS, and FP16 throughput is identical at 1,248.3 GFLOPS with a 1:1 ratio, so there is no separate FP16 throughput advantage. The silicon data reinforces the same picture: 2,200 million transistors on 103 mm² gives a transistor density of 21.4M / mm², a compact 14 nm design intended for the Embedded (9000) generation. Because the benchmark fields are empty, these specification rates are the only performance-related evidence in the record.

Memory Subsystem

The memory subsystem is defined by 4 GB of GDDR5 on a 128-bit bus. Memory clock is 1500 MHz with an effective data rate of 6 Gbps, and total bandwidth is 96.00 GB/s. For high-resolution work, the 128-bit interface and 96.00 GB/s bandwidth are the relevant constraints. A 128-bit bus limits how much data can be moved per memory clock, while 4 GB of VRAM limits the total size of frame buffers and texture working sets. As resolution and render-target size grow, both limits become more prominent: capacity sets a ceiling on what can be stored, and bandwidth sets a ceiling on how quickly that stored data can be fed into the 512 shading units. No memory benchmark is included in the FACT PACK, so the practical impact is inferred from these interface figures.

Who Should Consider It

The E9171 MCM is framed by the data as an embedded product. Its generation is Embedded (9000), its slot width is IGP, and its display outputs are Portable Device Dependent. That means the physical integration and display connectivity belong to the host device rather than to a standalone card. The 40 W TDP and the absence of power connectors support the same conclusion: this is a low-power, integrated-style part for compact systems.

Because no benchmark scores are recorded, a resolution-by-settings recommendation cannot be grounded in measured data. There is no score from which to infer 1080p, 1440p, or 4K settings tiers. What the facts do support is a user profile: systems with a tight power envelope, an embedded or portable form factor, and a modest memory interface. It is a fit for designs where power draw must stay at 40 W and where the host device supplies display outputs. It is not positioned as a high-end desktop GPU by any metric in the record.

How It Compares

The nearestRivals list in the FACT PACK is empty. No rival names, scores, or deltaPct values are available, so a rival-by-rival comparison cannot be constructed. The only comparative data point is percentileVsAllGpus: 50, which places the E9171 MCM at the midpoint of the tracked GPU population. This is a broad ranking, not a measurement against a specific competing product. Without named rivals, the record does not support a statement such as "ahead of product X" or "behind product Y." The 50th percentile position is the only relative information the FACT PACK provides.

FAQ

Q: What architecture and process does the E9171 MCM use?

A: It uses GCN 4.0 architecture with the Lexa chip on GlobalFoundries' 14 nm process. The die is 103 mm² and contains 2,200 million transistors.

Q: What are the clock speeds and peak throughput rates?

A: Base clock is 1124 MHz, boost clock is 1219 MHz, and memory clock is 1500 MHz with 6 Gbps effective. Peak pixel rate is 19.50 GPixel/s, peak texture rate is 39.01 GTexel/s, and FP32 throughput is 1,248.3 GFLOPS. FP16 throughput is also 1,248.3 GFLOPS with a 1:1 ratio.

Q: What memory configuration is listed?

A: The GPU has 4 GB of GDDR5 on a 128-bit bus, with bandwidth of 96.00 GB/s.

Q: Does it include ray tracing or tensor cores?

A: The FACT PACK lists no RT core count and no tensor core count, so no hardware ray tracing or tensor acceleration is recorded for this part.

Q: What APIs does it support?

A: It supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.3.

Q: What is the production status and release date?

A: The production status is End-of-life, and the release date is 2017-10-02.

Power and Cooling

The TDP is 40 W. The power connector field is None, so no auxiliary GPU power connector is listed. The suggested PSU field is not specified in the FACT PACK, so no power supply wattage can be cited. The slot width is IGP, indicating an integrated-style physical footprint rather than a multi-slot expansion card. Cooling details are not enumerated in the record, but the 40 W TDP and IGP slot width are the only power and thermal data points from which to draw. A 40 W part with no listed connectors is defined by its host board's power delivery rather than by an external power input.

Ray Tracing and Feature Set

The RT core and tensor core fields in the FACT PACK are null. Therefore, the record does not claim hardware ray tracing or tensor acceleration. The feature set instead rests on the GCN 4.0 architecture and its listed API support: DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.3. The pipeline consists of 512 shading units, 32 TMUs, and 16 ROPs. The bus interface is PCIe 3.0 x8. Display outputs are Portable Device Dependent, so the actual display feature set is determined by the integrating device, not by a fixed set of connectors on the GPU record.

Detailed benchmark scores and charts for the AMD Radeon E9171 MCM are below.

Benchmark Scores

No benchmark data available for this GPU.

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