RADEON

AMD FirePro W9100

AMD graphics card specifications and benchmark scores

16 GB
VRAM
MHz Boost
275W
TDP
512
Bus Width

At a Glance

AMD
VRAM 16 GB
Shaders 2,816
Bus Width 512-bit
TDP 275W
Memory Type GDDR5
Architecture GCN 2.0
nm
Process 28 nm
Released Mar 2014

AMD FirePro W9100 Specifications

FirePro W9100 GPU Core

Shader units and compute resources

The AMD FirePro W9100 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
2,816
Shaders
2,816
TMUs
176
ROPs
64
Compute Units
44

FirePro W9100 Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the FirePro W9100's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro W9100 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
930 MHz
Memory Clock
1250 MHz 5 Gbps effective
GDDR GDDR 6X 6X

AMD's FirePro W9100 Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro W9100's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
16 GB
VRAM
16,384 MB
Memory Type
GDDR5
VRAM Type
GDDR5
Memory Bus
512 bit
Bus Width
512-bit
Bandwidth
320.0 GB/s

FirePro W9100 by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the FirePro W9100, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
1024 KB

FirePro W9100 Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD FirePro W9100 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
5.238 TFLOPS
FP64 (Double)
2.619 TFLOPS (1:2)
Pixel Rate
59.52 GPixel/s
Texture Rate
163.7 GTexel/s

GCN 2.0 Architecture & Process

Manufacturing and design details

The AMD FirePro W9100 is built on AMD's GCN 2.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro W9100 will perform in GPU benchmarks compared to previous generations.

Architecture
GCN 2.0
GPU Name
Hawaii
Process Node
28 nm
Foundry
TSMC
Transistors
6,200 million
Die Size
438 mm²
Density
14.2M / mm²

AMD's FirePro W9100 Power & Thermal

TDP and power requirements

Power specifications for the AMD FirePro W9100 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro W9100 to maintain boost clocks without throttling.

TDP
275 W
TDP
275W
Power Connectors
1x 6-pin + 1x 8-pin
Suggested PSU
600 W

FirePro W9100 by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD FirePro W9100 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Dual-slot
Length
275 mm 10.8 inches
Height
111 mm 4.4 inches
Bus Interface
PCIe 3.0 x16
Display Outputs
6x mini-DisplayPort 1.21x S-Video
Display Outputs
6x mini-DisplayPort 1.21x S-Video

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD FirePro W9100. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
12 (12_0)
DirectX
12 (12_0)
OpenGL
4.6
OpenGL
4.6
Vulkan
1.2.170
Vulkan
1.2.170
OpenCL
2.1
Shader Model
6.5

FirePro W9100 Product Information

Release and pricing details

The AMD FirePro W9100 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro W9100 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Mar 2014
Production
End-of-life
Predecessor
FirePro Terascale
Successor
Radeon Pro Polaris

FirePro W9100 Benchmark Scores

No benchmark data available for this GPU.

About AMD FirePro W9100

The AMD FirePro W9100 is a dual-slot card built around the Hawaii chip, using AMD’s GCN 2.0 architecture on TSMC’s 28 nm process. It contains 6,200 million transistors on a 438 mm² die, giving a transistor density of 14.2M per square millimeter, and it belongs to the FirePro GCN (Wx100) generation. The database lists this card as end-of-life, with an aggregate position at the 50th percentile of all GPUs and an average benchmark score of 0; no per-workload benchmark entries and no nearestRivals objects are present in the the benchmark database.

Benchmark Performance

The only direct benchmark data for the FirePro W9100 are the aggregate fields: percentileVsAllGpus is 50, and avgBenchmarkScore is 0. A 50th-percentile placement means the card sits at the median of the tracked GPU distribution in this database, with roughly half the population above and half below. The average benchmark score of 0 is the only numeric score field on record, which makes it impossible to derive per-workload performance or percentage deltas against specific named rivals.

What the the benchmark database does provide are the card’s raw specification rates, which indicate its theoretical throughput ceiling. The FP32 compute rate is 5.238 TFLOPS. Texture fill is 163.7 GTexel/s, and pixel fill is 59.52 GPixel/s. These are not application benchmark scores, but they define the computational limits from which workload performance would be built. The shader array contains 2816 shading units, with 176 texture mapping units and 64 ROPs. In aggregate database terms, the 50th-percentile rank is the only performance signal that can be compared against the broader GPU universe. Without nearestRivals data, any statement about being ahead of or behind a particular competitor by an exact percentage would be unsupported.

The absence of individual benchmark entries does not negate the raw throughput figures. For compute-bound workloads that scale with FP32 throughput, 5.238 TFLOPS positions the card as a capable generational compute part. For rasterization-bound tasks, the 59.52 GPixel/s pixel rate and 163.7 GTexel/s texture rate give a fuller picture of how fast the pipeline can output shaded pixels and filtered textures. Those numbers are fixed silicon characteristics, not variable test results, but they are the only quantitative basis for performance analysis available in the pack.

Memory Subsystem

The FirePro W9100 uses 16 GB of GDDR5 memory. The memory bus is 512 bits wide, and the memory clock is 1250 MHz, with an effective data rate of 5 Gbps. The resulting memory bandwidth is 320.0 GB/s.

That combination of capacity and bandwidth is a notable part of the card’s identity. A 16 GB frame buffer allows large data sets, textures, geometry, render targets, or compute buffers, to remain resident on the card without being continuously swapped over the PCIe bus. The 512-bit bus provides the data path needed to move pixels and texture data between memory and the 2816 shading units. For high-resolution rendering, memory bandwidth often becomes the bottleneck once the frame buffer and texture working set grow; at 320.0 GB/s, the W9100 has a wide pipeline to supply the ROPs and texture units.

The memory subsystem is paired with 64 ROPs, which handle pixel output at up to 59.52 GPixel/s. Texture sampling is rated at 163.7 GTexel/s through the 176 TMUs. The effective memory rate of 5 Gbps is the transfer rate per pin, while the 512-bit interface is what aggregates that into 320.0 GB/s. The interface to the host system is PCIe 3.0 x16, so data that does not fit in 16 GB must cross that link.

Power and Cooling

The FirePro W9100 carries a 275 W TDP. The the benchmark database recommends a 600 W power supply for systems using this card. Power delivery requires one 6-pin PCIe power connector and one 8-pin PCIe power connector, so both cable types must be available from the PSU.

The physical cooler is dual-slot, meaning the card occupies two expansion slots. Board length is 275 mm, or 10.8 inches, and board height is 111 mm, or 4.4 inches. These dimensions affect case selection and clearance around adjacent components. The rear I/O includes six mini-DisplayPort connectors and one S-Video connector, which defines part of the mounting bracket layout. The card uses a PCIe 3.0 x16 bus interface.

Builders should plan around the 600 W recommended PSU figure when selecting a power supply, and should confirm that the chassis has enough length and slot clearance for a 275 mm dual-slot card. The presence of both a 6-pin and an 8-pin connector means older power supplies without an 8-pin PCIe cable may require an adapter, though the the benchmark database does not list adapter compatibility.

How It Compares

The the benchmark database contains no nearestRivals entries for the FirePro W9100. Therefore, it is not possible to write a per-rival comparison with scores and deltaPct values, because no rival names, scores, or percentage differences are supplied. The only comparative position available is the aggregate 50th-percentile rank among all GPUs in the database, with an average benchmark score of 0.

The pack does establish the card’s place in its own product lineage. Its predecessor is listed as FirePro Terascale, and its successor is listed as Radeon Pro Polaris. The W9100 itself sits in the FirePro GCN (Wx100) generation, using the Hawaii chip. That lineage places it between two distinct families, but it does not serve as a performance comparison to those families without benchmark data. In the absence of nearestRivals, any claim that the card beats or loses to a specific competing model by an exact margin would be unsupported by the provided record.

Ray Tracing and Feature Set

The FirePro W9100 is built on GCN 2.0 and does not list dedicated ray tracing cores. The rtCores field is null, and the tensorCores field is also null, which means the card’s feature set contains no specialized hardware blocks for ray traversal or tensor-style matrix operations.

The compute and graphics pipeline is instead built from general-purpose GCN resources: 2816 shading units, 176 texture mapping units, and 64 ROPs. The FP32 throughput is 5.238 TFLOPS, with texture fill at 163.7 GTexel/s and pixel fill at 59.52 GPixel/s. Those resources are what execute shaders, geometry, and compute workloads.

On the API side, the card supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170. These are the software interfaces available to applications. The DirectX 12 support is for the 12_0 feature level. The lack of RT cores and tensor cores means that ray tracing acceleration and tensor-based operations, which appear in some other GPUs, are not present in this card’s hardware specification. Workloads relying on those specialized paths would not have dedicated hardware to offload to; the card would need to handle such work through its GCN compute units and general-purpose API support.

FAQ

Q: What chip and architecture does the AMD FirePro W9100 use?

A: It uses the Hawaii chip with GCN 2.0 architecture, manufactured on TSMC’s 28 nm process. The die size is 438 mm² and contains 6,200 million transistors, giving a transistor density of 14.2M per square millimeter.

Q: How much memory and memory bandwidth does the card have?

A: The card has 16 GB of GDDR5 memory on a 512-bit bus. The memory clock is 1250 MHz, or 5 Gbps effective, which yields 320.0 GB/s of bandwidth.

Q: What power supply and power connectors are required?

A: The recommended power supply is 600 W. The card has a 275 W TDP and requires one 6-pin and one 8-pin PCIe power connector.

Q: Does the card have dedicated ray tracing or tensor cores?

A: No. The the benchmark database lists no RT cores and no tensor cores. The card relies on GCN 2.0 compute resources: 2816 shading units, 176 TMUs, and 64 ROPs.

Q: What graphics APIs does the card support?

A: It supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170.

Q: What are the physical dimensions and display outputs?

A: The card is dual-slot, 275 mm long, and 111 mm tall. It has six mini-DisplayPort connectors and one S-Video connector, and it connects to the system through PCIe 3.0 x16.

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