AMD FirePro W6150M
AMD graphics card specifications and benchmark scores
At a Glance
AMDAMD FirePro W6150M Specifications
GPU Core
Shader units and compute resources
The AMD FirePro W6150M GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
FirePro W6150M Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the FirePro W6150M's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro W6150M by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's FirePro W6150M Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro W6150M's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
FirePro W6150M by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the FirePro W6150M, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
FirePro W6150M Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the AMD FirePro W6150M against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
GCN 2.0 Architecture & Process
Manufacturing and design details
The AMD FirePro W6150M is built on AMD's GCN 2.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro W6150M will perform in GPU benchmarks compared to previous generations.
Power & Thermal
TDP and power requirements
Power specifications for the AMD FirePro W6150M determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro W6150M to maintain boost clocks without throttling.
FirePro W6150M by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the AMD FirePro W6150M are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the AMD FirePro W6150M. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
FirePro W6150M Product Information
Release and pricing details
The AMD FirePro W6150M is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro W6150M by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
About AMD FirePro W6150M
The AMD FirePro W6150M is a mobile workstation graphics module built on GCN 2.0 architecture, using the Emerald chip fabricated by TSMC on a 28 nm process. The die contains 2,080 million transistors across 160 mm², for a transistor density of 13.0M per square millimeter. It belongs to the FirePro Mobile (Wx100M) generation, was released on 2015-11-11, and is now marked end-of-life. Its predecessor is the FirePro Mobility line and its successor is the Radeon Pro Mobile series. In the database's all-GPU ranking, it sits at the 50th percentile with an average benchmark score of 0.
Power and Cooling
The data sheet lists no TDP for the FirePro W6150M, so thermal design power is not quantified in this database entry. The absence of a TDP figure means the module's power draw must be inferred from its form factor and connector layout. The card is an MXM Module with a slot width of "MXM Module" and uses an MXM-B (3.0) bus interface. Power connectors are listed as "None", which indicates the module draws its power through the MXM connector rather than requiring auxiliary PCIe power cables. Because the display outputs are "Portable Device Dependent", the host laptop determines how the GPU is fed and cooled. No suggested PSU value is recorded, so a power-supply recommendation cannot be derived from the data. The absence of dedicated power connectors and the MXM form factor imply that the host system's power delivery and cooling design governs the module's operating envelope. The data does not specify a chassis-level cooling or power budget; those parameters reside with the host system design.
How It Compares
The database records no nearest rivals for the FirePro W6150M. The nearestRivals array is empty, so there are no competitor names, scores, or deltaPct values to report. This is an unusual situation for a benchmark entry, as most parts have at least one adjacent competitor recorded. The only positional signal is the percentileVsAllGpus value of 50, which places the card exactly at the median of all GPUs tracked by the database. A 50th percentile means the card outperforms half of the tracked GPU population and trails the other half. Because no rival scores are present, no per-rival percentage deltas can be computed. The absence of benchmark entries (an empty benchmarks array and an average score of 0) further limits direct comparison. The card's position is therefore defined by its median rank rather than by head-to-head measurements. The 50th percentile is a meaningful anchor: it indicates that, in the aggregate distribution of all GPUs, this mobile workstation part is neither a high-end performer nor a low-end entry.
Ray Tracing and Feature Set
The FirePro W6150M lists no RT cores and no tensor cores in its specification, indicating that the GCN 2.0 architecture does not include dedicated ray tracing or tensor acceleration hardware. The feature set is instead defined by the supported APIs: DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170. These API versions are the software interface through which applications reach the hardware. The shading engine consists of 768 shading units, 48 texture mapping units, and 16 raster operation units. Pixel throughput is 17.20 GPixel/s and texture throughput is 51.60 GTexel/s. FP32 compute is rated at 1.651 TFLOPS. With no RT or tensor cores, workloads that rely on dedicated ray tracing or tensor operations have no specialized hardware to offload to. The absence of these units means the GPU's general-purpose shaders must handle such tasks, and the data provides no indication of dedicated acceleration paths. The GCN 2.0 architecture's compute orientation is reflected in the 768 shading units and the 1.651 TFLOPS FP32 figure.
FAQ
Q: How much memory does the FirePro W6150M have and what type is it?
A: It has 4 GB of GDDR5 memory on a 128-bit bus, with a bandwidth of 88.00 GB/s. The memory clock is 1375 MHz, corresponding to 5.5 Gbps effective.
Q: What is the FP32 compute performance?
A: The card delivers 1.651 TFLOPS of FP32 compute throughput, using 768 shading units.
Q: Which graphics APIs are supported?
A: DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170 are listed in the specification.
Q: What is the manufacturing process?
A: The chip is fabricated by TSMC on a 28 nm process, with 2,080 million transistors on a 160 mm² die, giving a density of 13.0M per mm².
Q: What is the production status?
A: The card is end-of-life. It was released on 2015-11-11, with the FirePro Mobility line as its predecessor and the Radeon Pro Mobile series as its successor.
Q: Does the card use external power connectors?
A: No. The power connectors field lists "None", and the module uses an MXM-B (3.0) bus interface with an MXM Module slot width.
Benchmark Performance
The benchmark data for the FirePro W6150M is sparse: the benchmarks array is empty, and the average benchmark score is recorded as 0. The percentileVsAllGpus field places the card at 50, meaning it sits at the median of the database's tracked GPU population. With no rival scores in the nearestRivals array, exact percentage deltas cannot be stated. The 50th percentile is a neutral position — the card is neither in the upper nor lower half of the distribution. Given the empty benchmark array, the average score of 0 is a placeholder rather than a measured result. The compute figures — 1.651 TFLOPS FP32, 17.20 GPixel/s pixel rate, and 51.60 GTexel/s texture rate — provide the only quantitative performance context available. These figures suggest a mid-range mobile workstation part, consistent with its median percentile rank. The pixel rate and texture rate, in particular, define the card's fill-rate ceiling, while the FP32 figure bounds its general compute throughput. Without benchmark entries, these specification-derived rates are the sole basis for performance assessment.
Memory Subsystem
The FirePro W6150M is equipped with 4 GB of GDDR5 memory connected over a 128-bit bus. Memory bandwidth is 88.00 GB/s, derived from a memory clock of 1375 MHz with 5.5 Gbps effective data rate. For high-resolution workloads, the combination of 4 GB capacity and 88.00 GB/s bandwidth is a meaningful constraint. Higher resolutions increase the framebuffer footprint and bandwidth demand; a 128-bit bus limits the rate at which texture and pixel data can move between memory and the 768 shading units. The pixel rate of 17.20 GPixel/s and texture rate of 51.60 GTexel/s indicate the fill-rate ceiling that the memory subsystem must feed. In scenarios with large textures or multi-sample anti-aliasing, the 88.00 GB/s figure becomes the limiting factor, as the GPU's compute and fill rates outpace what the narrow bus can supply. The 4 GB capacity and 128-bit bus width are the only memory configuration figures recorded, and the 88.00 GB/s bandwidth is the resulting data-transfer ceiling. The 128-bit bus width is the structural constraint here; a wider bus would be needed to raise bandwidth, but the data records only this 128-bit configuration.
Detailed benchmark scores and charts for the AMD FirePro W6150M are below.
Benchmark Scores
No benchmark data available for this GPU.
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