AMD FirePro V7900 SDI

AMD FirePro V7900 SDI is a single-slot professional graphics card using the Cayman GPU, built on TSMC's 40 nm process, with 2,640 million transistors on a 389 mm² die. It belongs to the FirePro Terascale (Vx900) generation, was released on 2011-05-23, and is now end-of-life. Its predecessor is FireGL and its successor is Radeon Pro GCN. The board uses a PCIe 2.0 x16 interface, measures 279 mm (11 inches) by 111 mm (4.4 inches), and provides four DisplayPort 1.2 outputs plus one SDI output. The database record contains no benchmark scores, an average benchmark score of 0, an empty nearestRivals list, and a percentileVsAllGpus value of 50; therefore the analysis below is based on the specification fields rather than measured results.

Benchmark Performance

The headline performance field is essentially empty. The FACT PACK lists benchmarks as an empty array, average benchmark score as 0, and nearestRivals as empty. There are therefore no exact deltaPct values to quote, no competitor names to compare, and no score baseline to reference. The only relative metric present is percentileVsAllGpus: 50, meaning the database ranks this GPU at the midpoint of all GPUs. That single rank, however, is not accompanied by any nonzero benchmark result, so it cannot be used to claim a percentage lead or deficit.

What the data does provide is raw throughput ceilings. The Cayman GPU contains 1,280 shading units, 80 texture mapping units, and 32 ROPs. Its FP32 compute is rated at 1.856 TFLOPS, pixel rate at 23.20 GPixel/s, and texture rate at 58.00 GTexel/s. The 40 nm die is 389 mm² with a transistor density of 6.8M / mm². These numbers describe the hardware's theoretical capacity. For workloads that are shader-bound, the 1.856 TFLOPS figure is the relevant scaling point. For fill-rate-bound tasks, the 32 ROPs and 23.20 GPixel/s pixel rate set the limit. The 58.00 GTexel/s texture rate bounds texturing throughput.

Because there are no scores, any statement about actual frame rates or render times would be unsupported. The data permits only specification-level analysis. In short, the benchmark section of this record is not populated, and the 50th percentile is the sole relative reference.

Memory Subsystem

Memory capacity is fixed at 2 GB. The type is GDDR5, connected through a 256-bit bus. The memory clock is 1250 MHz, described as 5 Gbps effective, and total bandwidth is 160.0 GB/s. That bandwidth is the product of the bus width and effective data rate; it is the ceiling for moving textures, shaders, and framebuffer contents between the GPU and VRAM. For higher resolutions, the required framebuffer size scales up, and the 2 GB capacity becomes the first hard limit. If the working set exceeds 2 GB, the card cannot hold it locally. At resolutions or with assets that still fit, 160.0 GB/s is the speed limit for memory transactions.

The 256-bit bus is also the path to the 32 ROPs. Pixel writes flow through those ROPs, with a pixel rate ceiling of 23.20 GPixel/s. The memory system and ROP count together define how quickly color and depth buffers can be updated. The board's four DisplayPort 1.2 outputs and SDI output all share this memory pool. In a multi-display SDI workflow, every surface — desktop, video, overlay — consumes capacity and bandwidth. The data does not include memory benchmarks or resolution tests, so the 2 GB, 256-bit, and 160.0 GB/s values are the only quantitative basis. They point to a card that is proportioned for workstation-class buffer sizes of its era.

Ray Tracing and Feature Set

The RT core and tensor core fields are both null. This card therefore has no dedicated ray tracing hardware and no tensor acceleration resources listed. For APIs, the FACT PACK gives DirectX 11.2 (11_0), OpenGL 4.4, and no Vulkan. The DirectX feature level is 11_0, which means the card exposes that feature level under DirectX 11.2. OpenGL 4.4 is the listed OpenGL API support. Vulkan is absent from the record, so Vulkan-only applications have no listed support.

The execution resources behind these APIs are 1,280 shading units, 80 TMUs, and 32 ROPs on the TeraScale 3 architecture. The architecture is TeraScale 3, and the chip is Cayman. The SDI display output is part of the feature set: one SDI connector sits alongside four DisplayPort 1.2 connectors. This is an output set oriented toward broadcast/link connectivity, not just desktop monitors. The PCIe 2.0 x16 bus interface is the host connection. The absence of RT/tensor cores and Vulkan, combined with DirectX 11.2/OpenGL 4.4 support, describes a card built for the feature expectations of 2011 professional software, not for later API environments. For hardware-accelerated ray tracing or tensor-based workloads, this product does not list the required hardware blocks.

Who Should Consider It

Given the absence of benchmark scores, the decision is driven by specifications and output configuration. This card is for a system that needs one SDI output plus four DisplayPort 1.2 outputs on a single-slot PCIe 2.0 x16 board. The 279 mm board length and 111 mm height fit specific workstation chassis constraints. The 2 GB GDDR5 and 160.0 GB/s bandwidth define the working set. Anyone whose application fits within 2 GB and 160.0 GB/s can consider it; workloads that require more than 2 GB of framebuffer or higher memory bandwidth are outside the card's limits.

The 1.856 TFLOPS FP32 throughput and 32 ROPs set the compute and fill-rate boundaries. Tasks that stay under these ceilings may be usable, but the lack of measured benchmark results means no frame-rate or render-time guarantee can be derived from the database. The 50th percentile rank is the only relative placement, and with no nearest rivals, it cannot be translated into a practical comparison.

End-of-life production status means the card is not being manufactured. Users looking for legacy TeraScale architecture support or FirePro-lineage compatibility may find the match; the predecessor FireGL and successor Radeon Pro GCN bracket it historically. For environments built around OpenGL 4.4 or DirectX 11.2, the API list is appropriate. For users who need Vulkan, hardware ray tracing, or tensor cores, this card does not list support. The SDI output tips the intended market toward video/broadcast output duties rather than general-purpose 3D rendering.

Power and Cooling

The TDP is rated at 150 W. The suggested PSU is 450 W. Power is delivered through a single 6-pin PCIe power connector. The card is single-slot, which matters for dense workstations. Its length is 279 mm (11 inches) and height is 111 mm (4.4 inches); width is not listed in the FACT PACK. The GPU die is 389 mm² with 2,640 million transistors, and the 150 W TDP is the thermal design power figure. A 450 W PSU recommendation and one 6-pin connector are the power-side constraints for building a system around it. The PCIe 2.0 x16 slot provides the host interface. The single-slot form factor limits the available cooling volume; no cooler performance data is included in the record.

FAQ

Q: What chip and architecture does the FirePro V7900 SDI use?

A: It uses the Cayman chip on TeraScale 3 architecture, built by TSMC on a 40 nm process. The die is 389 mm² and contains 2,640 million transistors.

Q: What are the memory specifications?

A: 2 GB GDDR5, 256-bit bus, 1250 MHz memory clock (5 Gbps effective), and 160.0 GB/s bandwidth.

Q: What display outputs are on the card?

A: Four DisplayPort 1.2 outputs and one SDI output.

Q: What API support is listed?

A: DirectX 11.2 (11_0) and OpenGL 4.4 are listed; Vulkan is not. RT cores and tensor cores are also null, so no dedicated ray tracing or tensor hardware is present.

Q: What are the power requirements?

A: TDP is 150 W, suggested PSU is 450 W, and it uses one 6-pin PCIe power connector.

Q: When was it released and what is its production status?

A: Released on 2011-05-23 and marked end-of-life. It belongs to the FirePro Terascale (Vx900) generation; its predecessor is FireGL and its successor is Radeon Pro GCN.