RADEON

AMD FirePro V5900

AMD graphics card specifications and benchmark scores

2 GB
VRAM
MHz Boost
75W
TDP
256
Bus Width

At a Glance

AMD
VRAM 2 GB
Shaders 512
Bus Width 256-bit
TDP 75W
Memory Type GDDR5
Architecture TeraScale 3
nm
Process 40 nm
Released May 2011

AMD FirePro V5900 Specifications

FirePro V5900 GPU Core

Shader units and compute resources

The AMD FirePro V5900 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
512
Shaders
512
TMUs
32
ROPs
32
Compute Units
8

FirePro V5900 Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the FirePro V5900's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro V5900 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
600 MHz
Memory Clock
500 MHz 2 Gbps effective
GDDR GDDR 6X 6X

AMD's FirePro V5900 Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro V5900's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
2 GB
VRAM
2,048 MB
Memory Type
GDDR5
VRAM Type
GDDR5
Memory Bus
256 bit
Bus Width
256-bit
Bandwidth
64.00 GB/s

FirePro V5900 by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the FirePro V5900, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
8 KB (per CU)
L2 Cache
512 KB

FirePro V5900 Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD FirePro V5900 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
614.4 GFLOPS
FP64 (Double)
153.6 GFLOPS (1:4)
Pixel Rate
19.20 GPixel/s
Texture Rate
19.20 GTexel/s

TeraScale 3 Architecture & Process

Manufacturing and design details

The AMD FirePro V5900 is built on AMD's TeraScale 3 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro V5900 will perform in GPU benchmarks compared to previous generations.

Architecture
TeraScale 3
GPU Name
Cayman
Process Node
40 nm
Foundry
TSMC
Transistors
2,640 million
Die Size
389 mm²
Density
6.8M / mm²

AMD's FirePro V5900 Power & Thermal

TDP and power requirements

Power specifications for the AMD FirePro V5900 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro V5900 to maintain boost clocks without throttling.

TDP
75 W
TDP
75W
Power Connectors
None
Suggested PSU
250 W

FirePro V5900 by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD FirePro V5900 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Single-slot
Length
229 mm 9 inches
Height
112 mm 4.4 inches
Bus Interface
PCIe 2.0 x16
Display Outputs
1x DVI2x DisplayPort 1.2
Display Outputs
1x DVI2x DisplayPort 1.2

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD FirePro V5900. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
11.2 (11_0)
DirectX
11.2 (11_0)
OpenGL
4.4
OpenGL
4.4
OpenCL
1.2
Shader Model
5.0

FirePro V5900 Product Information

Release and pricing details

The AMD FirePro V5900 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro V5900 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
May 2011
Production
End-of-life
Predecessor
FireGL
Successor
Radeon Pro GCN

FirePro V5900 Benchmark Scores

No benchmark data available for this GPU.

About AMD FirePro V5900

The AMD FirePro V5900 is an end-of-life professional graphics card built on the TeraScale 3 architecture, using the Cayman chip fabricated on a 40 nm process at TSMC. It integrates 2,640 million transistors on a 389 mm² die, resulting in a transistor density of 6.8M per mm². The card occupies the 50th percentile among all GPUs in the database, indicating a median position in overall performance distribution, though its benchmark list is empty.

Memory Subsystem

The V5900 features 2 GB of GDDR5 memory on a 256-bit bus. Memory operates at 500 MHz, translating to 2 Gbps effective and a bandwidth of 64.00 GB/s. For high resolutions, this configuration is constrained. The 2 GB capacity is modest by contemporary standards, and the 64.00 GB/s bandwidth will likely become a bottleneck when handling large textures or high-resolution framebuffers. The 256-bit bus width does provide a reasonable pathway for data, but the effective bandwidth is the limiting factor. At 1080p and below, this may suffice for older titles, but 1440p or 4K would stress the memory subsystem significantly. The 64.00 GB/s figure is a hard ceiling for data transfer, meaning any workload exceeding this rate will experience stalls. The memory clock of 500 MHz is fixed, with no dynamic overclocking mentioned. For professional applications that rely on large datasets, the 2 GB capacity will fill quickly, forcing texture swapping. In contrast, the 256-bit bus width is a positive attribute, allowing for a wider data path than narrower buses of the same generation. However, the effective bandwidth remains the decisive factor for framebuffer throughput.

Ray Tracing and Feature Set

The card has no dedicated ray tracing cores or tensor cores, as these fields are null in the specification. Its feature set relies on the TeraScale 3 architecture. It supports DirectX 11.2 (11_0) and OpenGL 4.4, but no Vulkan support is listed. The compute capabilities are defined by 512 shading units, 32 texture mapping units, and 32 render output units. The pixel rate is 19.20 GPixel/s, and the texture rate is 19.20 GTexel/s. The FP32 performance is 614.4 GFLOPS. This indicates a fixed-function pipeline without the acceleration hardware for modern ray-traced effects. Software-based ray tracing is theoretically possible but would be severely hampered by the lack of dedicated cores and the relatively low FP32 throughput. The absence of tensor cores also precludes any AI-accelerated features. The DirectX 11.2 support with feature level 11_0 means it adheres to the baseline features of that API, without the enhancements of later feature levels. OpenGL 4.4 provides a solid foundation for legacy OpenGL workloads. The lack of Vulkan support is notable, as it restricts the card to older API ecosystems. The 512 shading units are arranged in the TeraScale 3 configuration. The 32 TMUs and 32 ROPs are balanced, as evidenced by the identical pixel and texture rates.

How It Compares

The nearestRivals array in the database is empty, meaning no direct comparative scores from rival GPUs are recorded for this entry. Consequently, the analysis must rely on the card's absolute percentile and raw specifications. The 50th percentile placement suggests that, within the entire population of GPUs tracked by the database, the V5900 sits exactly at the median. This is a neutral position, indicating it outperforms half of all GPUs while trailing the other half. Without rival scores, specific deltas cannot be computed, but the percentile provides a global context. The absence of rival data also means that any claims about relative performance against specific competitors are unsupported by the database. The card's predecessor is FireGL and its successor is Radeon Pro GCN, but no comparative scores exist for those either. The generation is listed as FirePro Terascale (Vx900), which places it in a specific product lineage. The production status is end-of-life, indicating it is no longer manufactured. The release date is 2011-05-23, which is useful for historical context. The percentile of 50 is a stable indicator, but without benchmark scores, it cannot be refined into a more precise performance ranking.

Who Should Consider It

Given the 2 GB memory capacity and 64.00 GB/s bandwidth, this card is best suited for legacy applications or systems requiring a specific professional feature set rather than raw performance. For gaming at 1080p with reduced texture quality, the V5900 might handle older titles, but modern games would quickly exceed its memory and compute limits. The 614.4 GFLOPS FP32 rate indicates limited compute throughput for GPU-accelerated tasks. The card's single-slot design and low power requirements make it suitable for compact workstations. However, its end-of-life status and lack of modern API support (no Vulkan) restrict its relevance to environments that still rely on DirectX 11 or OpenGL 4.4 workloads. Users with a PCIe 2.0 x16 slot and a 250 W PSU can install it without additional power connectors. The display outputs include 1x DVI and 2x DisplayPort 1.2, which is adequate for multi-monitor setups in legacy contexts. The dimensions of 229 mm in length, 112 mm in height, and 19 mm in width mean it fits in most standard chassis. The 40 nm process node and 2,640 million transistors result in a 389 mm² die, which is relatively large for its power class. This card is not for users seeking high frame rates at 1440p or 4K, as the memory subsystem and compute power are insufficient. It is more appropriate for basic 2D acceleration, legacy professional applications, or as a display adapter for systems that do not require modern features.

Benchmark Performance

The database records an average benchmark score of 0, and the benchmarks array is empty. This means no quantitative performance samples have been captured for the FirePro V5900. The 50th percentile is derived from the overall distribution of all GPUs, but without a specific score, it cannot be used to calculate percentage deltas against rivals. The only measurable performance indicators are the pixel rate, texture rate, and FP32 throughput. The pixel rate of 19.20 GPixel/s and texture rate of 19.20 GTexel/s are numerically identical, suggesting a balanced fillrate configuration given the 32 ROPs and 32 TMUs. The FP32 rate of 614.4 GFLOPS is a baseline for compute tasks. Benchmark results indicate that the card's performance profile is defined by these fixed rates rather than any dynamic clock behavior, as no base or boost clocks are specified. The memory clock is fixed at 500 MHz, reinforcing the static nature of this hardware. The transistor density of 6.8M per mm² is a measure of the manufacturing efficiency of the 40 nm process. The absence of benchmark data means that any performance comparisons must be inferred from these fixed specifications. The 19.20 GPixel/s rate is a direct function of the 32 ROPs and the core clock, though the core clock is not listed. Similarly, the 19.20 GTexel/s rate is tied to the 32 TMUs. The FP32 figure of 614.4 GFLOPS is the aggregate throughput of the 512 shading units. Without a dynamic clock, the card operates at a constant performance level, which is a characteristic of older professional GPUs.

Power and Cooling

The thermal design power is 75 W, which is quite low. The suggested power supply is 250 W. The card requires no external power connectors, drawing all power from the PCIe slot. Its physical dimensions are 229 mm in length, 112 mm in height, and 19 mm in width, fitting a single-slot profile. This low power draw and compact size make it an easy addition to many systems, provided the PSU meets the 250 W recommendation. The cooling solution is not specified in terms of fan size or heatpipe count, but the 75 W TDP suggests a capable air cooler is sufficient. The absence of power connectors simplifies installation in older or budget-oriented workstations. The 40 nm process node and 2,640 million transistors contribute to a die size of 389 mm², yet the power envelope remains modest. The slot width is single-slot, which is beneficial for systems with limited expansion space. The bus interface is PCIe 2.0 x16, which is a standard connection for the era. The card's height of 112 mm and width of 19 mm are within typical ATX specifications. The low TDP also means that the card does not require aggressive cooling, which can reduce noise levels. The suggested PSU of 250 W is a low bar, making the card compatible with many pre-existing power supplies.

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