RADEON

AMD FirePro S9050

AMD graphics card specifications and benchmark scores

12 GB
VRAM
MHz Boost
225W
TDP
384
Bus Width

At a Glance

AMD
VRAM 12 GB
Shaders 1,792
Bus Width 384-bit
TDP 225W
Memory Type GDDR5
Architecture GCN 1.0
nm
Process 28 nm
Released Aug 2014

AMD FirePro S9050 Specifications

GPU Core

Shader units and compute resources

The AMD FirePro S9050 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
1,792
Shaders
1,792
TMUs
112
ROPs
32
Compute Units
28

FirePro S9050 Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the FirePro S9050's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro S9050 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
900 MHz
Memory Clock
1375 MHz 5.5 Gbps effective
GDDR GDDR 6X 6X

AMD's FirePro S9050 Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro S9050's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
12 GB
VRAM
12,288 MB
Memory Type
GDDR5
VRAM Type
GDDR5
Memory Bus
384 bit
Bus Width
384-bit
Bandwidth
264.0 GB/s

FirePro S9050 by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the FirePro S9050, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
768 KB

FirePro S9050 Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD FirePro S9050 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
3.226 TFLOPS
FP64 (Double)
806.4 GFLOPS (1:4)
Pixel Rate
28.80 GPixel/s
Texture Rate
100.8 GTexel/s

GCN 1.0 Architecture & Process

Manufacturing and design details

The AMD FirePro S9050 is built on AMD's GCN 1.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro S9050 will perform in GPU benchmarks compared to previous generations.

Architecture
GCN 1.0
GPU Name
Tahiti
Process Node
28 nm
Foundry
TSMC
Transistors
4,313 million
Die Size
352 mm²
Density
12.3M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the AMD FirePro S9050 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro S9050 to maintain boost clocks without throttling.

TDP
225 W
TDP
225W
Power Connectors
1x 8-pin
Suggested PSU
550 W

FirePro S9050 by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD FirePro S9050 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Dual-slot
Length
254 mm 10 inches
Height
111 mm 4.4 inches
Bus Interface
PCIe 3.0 x16
Display Outputs
1x DisplayPort 1.2
Display Outputs
1x DisplayPort 1.2

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD FirePro S9050. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
12 (11_1)
DirectX
12 (11_1)
OpenGL
4.6
OpenGL
4.6
Vulkan
1.2.170
Vulkan
1.2.170
OpenCL
2.1 (1.2)
Shader Model
6.5 (5.1)

FirePro S9050 Product Information

Release and pricing details

The AMD FirePro S9050 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro S9050 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Aug 2014
Production
End-of-life
Predecessor
FirePro Terascale
Successor
Radeon Pro GCN

About AMD FirePro S9050

AMD’s FirePro S9050 is a dual-slot GPU from the FirePro Server (Sx000) generation, built around the Tahiti chip in a GCN 1.0 implementation. TSMC produced the chip on a 28 nm process; the die contains 4,313 million transistors across 352 mm², which works out to 12.3M transistors per mm². It was released on 2014-08-06 and is now end-of-life, with FirePro Terascale as the previous generation and Radeon Pro GCN as the next one. The database places it at the 50th percentile of all GPUs, and no benchmark average is populated for it. That percentile is the central performance signal, while the specification sheet’s main asset is a large memory subsystem.

Who Should Consider It

The S9050 is a card for workloads where memory capacity outweighs peak throughput. At the 50th percentile of all GPUs in the database, it sits exactly at the median, so it is not a top-tier performer. Its 12 GB GDDR5 frame buffer is large, and the 384-bit bus delivers 264.0 GB/s of bandwidth. For rendering to large frame buffers or holding sizeable datasets on the GPU, those numbers matter more than the compute peak.

The compute peak is 3.226 TFLOPS FP32, with 100.8 GTexel/s of texture fill and 28.80 GPixel/s of pixel fill. Those figures define the practical ceilings. A texture-heavy workload will press against the 100.8 GTexel/s rate, while a framebuffer-heavy workload will run into the 32 ROPs. At lower output resolutions or with reduced detail settings, those limits are less likely to bind. At high-detail settings with high-resolution output, the 12 GB capacity helps, but the 28.80 GPixel/s pixel rate and 32 ROPs will still constrain fill-intensive work.

The 1,792 shading units give the card a useful compute presence for GCN-era code. This is not a card for chasing high benchmark scores; it is a memory-capacity-oriented niche product. It belongs in a server context, as its own generation name indicates, and it has a single DisplayPort 1.2 output. Buyers or integrators who need 12 GB of VRAM and a simple dual-slot footprint are the natural audience, while those who need leading rasterization throughput should look elsewhere in the database.

Power and Cooling

Power delivery on the S9050 is straightforward. The TDP is 225 W, and the suggested PSU is 550 W. Power is supplied through a single 8-pin connector, and no additional 6-pin connector is listed. This is a modest power layout for a dual-slot card of this class.

The card occupies two expansion slots, so adjacent components need clearance. Its physical length is 254 mm (10 inches) and its height is 111 mm (4.4 inches), which determines the case space required. The cooling arrangement is dual-slot; the fact pack does not specify a cooler size beyond that slot width. The bus interface is PCIe 3.0 x16. The single DisplayPort 1.2 output means there is no multi-display cabling or display-power load to plan around. In a system build, the 225 W TDP and 550 W PSU recommendation should be included in the total power budget. Since the product is end-of-life, the cooling solution is also a long-term maintenance consideration.

Ray Tracing and Feature Set

The S9050 has no dedicated ray tracing or tensor hardware. The fact pack does not list RT cores or tensor cores, so this GPU will not accelerate ray-traced scenes or tensor-based operations in the way later parts would. Its architecture is GCN 1.0, and the supported feature set is reflected in its API list.

The card supports DirectX 12 (11_1), OpenGL 4.6, and Vulkan 1.2.170. DirectX 12 support is at the 11_1 feature level, which means later DirectX 12 feature-level requirements are not covered. Vulkan 1.2.170 provides a specific API version baseline. OpenGL 4.6 covers compatibility with modern OpenGL workloads.

The available processing resources are 1,792 shading units, 112 TMUs, and 32 ROPs. Those resources handle all non-accelerated rendering and compute. The lack of tensor cores means there is no dedicated path for tensor operations; such work would fall back to general-purpose FP32 compute. The lack of RT cores leaves ray-traced effects without hardware acceleration. This is a feature set built for GCN 1.0 compute and rasterization, not for hardware-accelerated ray tracing.

FAQ

Q: What architecture does this card use?

A: It uses the GCN 1.0 architecture with the Tahiti chip, manufactured by TSMC on a 28 nm process. The die measures 352 mm² and contains 4,313 million transistors.

Q: Does the FirePro S9050 support ray tracing?

A: No. The database lists no RT cores and no tensor cores. API support is DirectX 12 (11_1), OpenGL 4.6, and Vulkan 1.2.170.

Q: What power supply is required?

A: The suggested PSU is 550 W. The card has a TDP of 225 W and uses one 8-pin power connector.

Q: How much memory does it have?

A: It has 12 GB of GDDR5 on a 384-bit bus. The memory runs at 1375 MHz, or 5.5 Gbps effective, giving 264.0 GB/s of bandwidth.

Q: Is it still in production?

A: No, it is end-of-life. It was released on 2014-08-06, with FirePro Terascale as its predecessor and Radeon Pro GCN as its successor.

Q: Where does it sit in the benchmark database?

A: It sits at the 50th percentile of all GPUs. Its benchmark score field is not populated, and no nearest rivals are listed.

How It Compares

There are no nearest rival entries for the FirePro S9050. This means there are no rival names, scores, or deltaPct values available for a direct comparison. The only relative position is the database-wide percentile of 50, which is the midpoint of all GPUs in the database. The card should therefore be understood as a median performer.

With no populated average benchmark score, there is no measured performance figure to anchor a head-to-head comparison. The predecessor and successor generations are known — FirePro Terascale and Radeon Pro GCN — but the data does not provide benchmark scores for either. Consequently, the S9050 has no rival-by-rival comparison in this database. Until nearest-rival data is populated, the 50th percentile is the only comparative metric available.

Memory Subsystem

The memory subsystem is the defining specification of the FirePro S9050. It combines 12 GB of GDDR5, a 384-bit bus, and 264.0 GB/s of bandwidth. The memory clock is 1375 MHz, which the data also states as 5.5 Gbps effective. The 384-bit bus is a wide memory interface, and the 12 GB capacity is large enough to hold substantial frame buffers and datasets.

For high-resolution rendering, the capacity helps prevent the GPU from running out of local memory. The bandwidth of 264.0 GB/s, however, caps how quickly data can move across that interface. The pixel rate is 28.80 GPixel/s and the texture rate is 100.8 GTexel/s; together with bandwidth, these numbers define the throughput envelope. A workload can fit its assets in the 12 GB frame buffer, but sustained reads and writes cannot exceed 264.0 GB/s.

The 32 ROPs are the final constraint for framebuffer writes. In memory-bound compute, the wide bus and bandwidth figure are the strongest reasons to consider the card. In compute-bound work, the 3.226 TFLOPS FP32 figure and 1,792 shading units determine the result. The memory subsystem is the most generous part of the S9050’s specification, and it gives the card its clearest purpose.

Detailed benchmark scores and charts for the AMD FirePro S9050 are below.

Benchmark Scores

No benchmark data available for this GPU.

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