RADEON

AMD FirePro S7100X

AMD graphics card specifications and benchmark scores

8 GB
VRAM
MHz Boost
100W
TDP
256
Bus Width

At a Glance

AMD
VRAM 8 GB
Shaders 2,048
Bus Width 256-bit
TDP 100W
Memory Type GDDR5
Architecture GCN 3.0
nm
Process 28 nm
Released May 2016

AMD FirePro S7100X Specifications

GPU Core

Shader units and compute resources

The AMD FirePro S7100X GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
2,048
Shaders
2,048
TMUs
128
ROPs
32
Compute Units
32

FirePro S7100X Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the FirePro S7100X's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro S7100X by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
725 MHz
Memory Clock
1250 MHz 5 Gbps effective
GDDR GDDR 6X 6X

AMD's FirePro S7100X Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro S7100X's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
8 GB
VRAM
8,192 MB
Memory Type
GDDR5
VRAM Type
GDDR5
Memory Bus
256 bit
Bus Width
256-bit
Bandwidth
160.0 GB/s

FirePro S7100X by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the FirePro S7100X, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
512 KB

FirePro S7100X Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD FirePro S7100X against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
2.970 TFLOPS
FP64 (Double)
185.6 GFLOPS (1:16)
FP16 (Half)
2.970 TFLOPS (1:1)
Pixel Rate
23.20 GPixel/s
Texture Rate
92.80 GTexel/s

GCN 3.0 Architecture & Process

Manufacturing and design details

The AMD FirePro S7100X is built on AMD's GCN 3.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro S7100X will perform in GPU benchmarks compared to previous generations.

Architecture
GCN 3.0
GPU Name
Amethyst
Process Node
28 nm
Foundry
TSMC
Transistors
5,000 million
Die Size
366 mm²
Density
13.7M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the AMD FirePro S7100X determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro S7100X to maintain boost clocks without throttling.

TDP
100 W
TDP
100W
Power Connectors
None

FirePro S7100X by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD FirePro S7100X are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
MXM Module
Bus Interface
PCIe 3.0 x16
Display Outputs
Portable Device Dependent
Display Outputs
Portable Device Dependent

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD FirePro S7100X. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
12 (12_0)
DirectX
12 (12_0)
OpenGL
4.6
OpenGL
4.6
Vulkan
1.2.170
Vulkan
1.2.170
OpenCL
2.1
Shader Model
6.5

FirePro S7100X Product Information

Release and pricing details

The AMD FirePro S7100X is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro S7100X by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
May 2016
Production
End-of-life
Predecessor
FirePro Mobility
Successor
Radeon Pro Mobile

About AMD FirePro S7100X

The AMD FirePro S7100X is a professional mobile graphics solution from the GCN 3.0 architecture, built on a 28 nm process at TSMC. It is positioned as an end-of-life product, with benchmark data indicating it sits at the 50th percentile among all GPUs, a figure that suggests it offers a balanced, mid-range performance profile for its era. While the database shows no direct benchmark scores or nearest rival comparisons for this specific SKU, the raw specifications provide a clear picture of its intended capabilities within the mobile workstation segment.

Benchmark Performance

The S7100X’s compute potential is anchored by 2048 shading units, which deliver a peak FP32 performance of 2.970 TFLOPS. This figure represents the core throughput for traditional single-precision workloads, which are standard in CAD, simulation, and professional visualization tasks. The data shows that this level of compute is complemented by a texture fill rate of 92.80 GTexel/s and a pixel rate of 23.20 GPixel/s, indicating a design that can handle both complex geometry and high-resolution rasterization simultaneously.

While direct comparative deltas are unavailable for this part, the 50th percentile ranking against all GPUs places it in a specific competitive context. This score is not indicative of a flagship performer, but rather a dependable mid-tier option. In practical terms, the FP32 throughput of 2.970 TFLOPS is the defining metric for raw compute, and it suggests that the card is engineered for sustained professional workloads rather than peak consumer gaming performance. The FP16 performance is identical at 2.970 TFLOPS, with a 1:1 ratio, which indicates that the architecture does not prioritize half-precision acceleration, a feature more common in newer designs.

The absence of nearest rival data means that any percentage-based comparison is impossible. However, the architectural traits—specifically the GCN 3.0 design and the 2048-core count—imply a performance class that would have competed with other mid-range professional solutions of its generation. The data confirms that this is not a low-end part, given the non-trivial transistor count of 5,000 million on a 366 mm² die, but it also lacks the headroom of top-tier components. Users should interpret the 50th percentile as a signal of average standing within the full spectrum of GPUs, not a verdict on its professional application suitability.

Memory Subsystem

The memory configuration is a critical strength for this card. It is equipped with 8 GB of GDDR5 memory, which is a substantial capacity for high-resolution professional work. The memory interface is a 256-bit bus, and the memory clock runs at 1250 MHz, translating to an effective data rate of 5 Gbps. These figures combine to produce a total memory bandwidth of 160.0 GB/s.

This bandwidth is sufficient for handling large texture sets and frame buffers at resolutions like 4K. For workloads that are memory-bound, such as shading complex scenes or processing high-resolution imagery, the 160.0 GB/s throughput ensures that the 2048 shading units are not starved for data. The 8 GB capacity is the more significant factor for high-resolution work, as it allows for larger datasets and more complex scenes to reside on the GPU without spilling to system memory. The combination of a 256-bit bus and 5 Gbps effective memory speed is a coherent design that avoids bottlenecks, making the S7100X a robust option for tasks that require both capacity and reasonable speed. The data indicates that while the bandwidth is not class-leading, it is well-matched to the compute capabilities of the card.

Who Should Consider It

Based on the data, the S7100X is best suited for professionals who require a mobile workstation GPU for moderate-to-complex 3D modeling, rendering, and simulation tasks. The 8 GB VRAM capacity is the primary enabler for high-resolution work, allowing users to operate at 4K resolutions with larger textures and more detailed environments without running into memory ceilings. The 50th percentile standing suggests that it is not the optimal choice for extreme, multi-GPU rendering farms or real-time 4K video editing with heavy effects, but rather for individual professionals who need reliable, consistent performance.

The 2.970 TFLOPS FP32 performance is adequate for real-time viewport manipulation in DCC applications and for running standard engineering simulations. Users working with medium-sized assemblies in CAD software or with moderate polygon counts in 3D animation will find the compute power acceptable. The card’s mobile form factor (MXM Module) further specifies that it is intended for laptop or compact workstation builds, not desktop towers. Therefore, it is for those who need professional-grade certification and reliability on the move. It is not for gamers seeking high frame rates, nor is it for data scientists training large neural networks, given the lack of tensor cores and the 1:1 FP16 ratio. The sweet spot is a solo professional performing design, visualization, and light-to-medium rendering on a portable workstation.

How It Compares

The fact pack lists no nearest rivals for the AMD FirePro S7100X, making direct competitive analysis impossible from the provided data. Without specific competitor names, scores, or deltaPct values, any comparison would be speculative. The absence of this data means that the S7100X must be evaluated solely on its own merits. Its specifications—specifically the 8 GB memory and 2048 shading units—place it in a specific hardware class, but the lack of a comparison baseline prevents definitive statements about its standing relative to contemporaries from other manufacturers. The benchmark percentile of 50% is the only global reference point, indicating that it performs better than half of all GPUs in the database, but this is a broad measure that does not isolate its professional market segment.

FAQ

Q: What is the memory bandwidth of the AMD FirePro S7100X?

A: The memory bandwidth is 160.0 GB/s, derived from a 256-bit bus and 5 Gbps effective GDDR5 memory speed.

Q: Does the S7100X support half-precision (FP16) computations?

A: Yes, it supports FP16 at a 1:1 ratio with FP32, meaning the peak FP16 performance is also 2.970 TFLOPS.

Q: What is the physical form factor of this GPU?

A: It is an MXM Module, which is a mobile PCI Express module standard designed for laptops and compact workstations.

Q: What is the pixel fill rate of this card?

A: The pixel rate is 23.20 GPixel/s, which indicates its ability to process pixels for rasterization.

Q: Is this GPU still in production?

A: No, the production status is listed as "End-of-life." It was released on 2016-05-24.

Q: What process node is the chip built on?

A: The chip, codenamed "Amethyst," is built on a 28 nm process at TSMC.

Power and Cooling

The AMD FirePro S7100X has a thermal design power (TDP) of 100 W. This figure is a key indicator of its power consumption and heat generation. For a mobile module, this is a moderate power draw, requiring a robust cooling solution within the laptop chassis to maintain sustained performance. The slot width is listed as "MXM Module," which confirms its size class. Notably, the card requires no external power connectors, as it draws all its power directly from the MXM slot interface. This simplifies installation and is typical for mobile GPUs in this performance bracket. The suggested PSU is not listed, but the 100 W TDP implies that the host system’s power supply must be capable of handling this load, along with the rest of the components. The lack of power connectors does not imply low power draw, but rather that the power delivery is managed through the motherboard’s MXM connector, which is designed to supply up to 100 W in most standards.

Ray Tracing and Feature Set

The S7100X is built on the GCN 3.0 architecture, which predates the inclusion of dedicated ray tracing (RT) cores or tensor cores. The fact pack explicitly lists no data for these features, confirming their absence. Consequently, this GPU does not offer hardware-accelerated ray tracing. Any ray tracing workloads would have to be handled via compute shaders, which would be inefficient compared to dedicated hardware. Similarly, the lack of tensor cores means no hardware acceleration for AI-based features like DLSS or other deep learning inference tasks.

Instead, the feature set is defined by its API support. The card supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170. This is a comprehensive set of modern APIs at the time of its release, ensuring compatibility with a wide range of professional applications that utilize these interfaces. DirectX 12 (12_0) support indicates feature level 12_0, which includes features like conservative rasterization and bindless resources. Vulkan 1.2.170 support offers low-level hardware access, which is beneficial for developers seeking maximum performance. The display outputs are listed as "Portable Device Dependent," meaning they vary based on the specific laptop or workstation implementation. Overall, the feature set is focused on standard rasterization and compute workloads, with no specialized hardware for ray tracing or AI acceleration.

Detailed benchmark scores and charts for the AMD FirePro S7100X are below.

Benchmark Scores

No benchmark data available for this GPU.

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