AMD FirePro M3900
AMD graphics card specifications and benchmark scores
At a Glance
AMDAMD FirePro M3900 Specifications
GPU Core
Shader units and compute resources
The AMD FirePro M3900 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
FirePro M3900 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the FirePro M3900's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro M3900 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's FirePro M3900 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro M3900's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
FirePro M3900 by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the FirePro M3900, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
FirePro M3900 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the AMD FirePro M3900 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
TeraScale 2 Architecture & Process
Manufacturing and design details
The AMD FirePro M3900 is built on AMD's TeraScale 2 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro M3900 will perform in GPU benchmarks compared to previous generations.
Power & Thermal
TDP and power requirements
Power specifications for the AMD FirePro M3900 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro M3900 to maintain boost clocks without throttling.
FirePro M3900 by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the AMD FirePro M3900 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the AMD FirePro M3900. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
FirePro M3900 Product Information
Release and pricing details
The AMD FirePro M3900 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro M3900 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
About AMD FirePro M3900
The AMD FirePro M3900 is a mobile professional GPU from the FirePro Mobile (Mx900) generation, built on the Seymour chip with TeraScale 2 architecture. TSMC manufactures it on a 40 nm process with 370 million transistors in a 67 mm² die, giving a transistor density of 5.5M / mm². The data pack contains no benchmark entries, no nearest rivals, and an average benchmark score of 0, so the analysis below is grounded in the listed specifications and the database percentile placement of 50.
Who Should Consider It
The FirePro M3900 is not a high-throughput part, and the data reflects that. It has 1024 MB of GDDR3 memory on a 64-bit bus with 14.40 GB/s of bandwidth, 4 ROPs, 8 TMUs, and 160 shading units. The peak rates are 3.000 GPixel/s, 6.000 GTexel/s, and 240.0 GFLOPS FP32. For a user deciding whether this GPU fits a workload, those numbers define a part for low-complexity scenes and modest resolutions.
The memory configuration is the clearest guide. A 64-bit bus and 14.40 GB/s bandwidth cannot feed high-resolution rendering at a high level of detail. The 1024 MB frame buffer is enough for small-to-medium texture sets, but it will be strained by workloads that demand large amounts of video memory. Users with lighter professional visualization tasks, legacy applications, or display-oriented portable workstations are the relevant audience. The API list reinforces this: DirectX 11.2 (11_0) and OpenGL 4.4 are specified, while Vulkan is absent. Software that requires Vulkan should not be paired with this GPU.
The 50th percentile database placement is hard to use as a buying signal because the average benchmark score is 0. In the absence of measured frame-time data, the resolution and settings guidance must come from the fixed specifications. Those specifications point toward low-resolution, low-detail workloads, not high-end 3D rendering.
Ray Tracing and Feature Set
The FACT PACK lists no RT cores and no tensor cores. That means the data provides no ray tracing acceleration and no tensor-core-based AI acceleration. Ray tracing workloads are not supported by any information in the pack.
The feature set is defined by TeraScale 2 and the API list. DirectX support is 11.2 (11_0), and OpenGL support is 4.4. Vulkan support is not listed, so the available graphics APIs in the data are limited to those two. The display outputs are listed as Portable Device Dependent, meaning the actual physical ports and monitor configuration depend on the laptop or mobile workstation implementation rather than on a fixed reference design. The card’s release date of 2010-10-18 and its FirePro Mobile (Mx900) generation place it in a particular era of professional mobile graphics. The shading resources available to those APIs are 160 shading units, 8 TMUs, and 4 ROPs, with corresponding texture and pixel rates of 6.000 GTexel/s and 3.000 GPixel/s.
Benchmark Performance
The benchmark section of the FACT PACK is empty. The benchmarks array contains no entries, the nearestRivals array is empty, and the average benchmark score is 0. As a result, there are no exact percentage deltas to report against any rival GPU. Any claim of being ahead of or behind a competitor by a specific percentage would not be supported by the supplied data.
The only comparative field is percentileVsAllGpus, set to 50. Taken at face value, this places the FirePro M3900 at the midpoint of the GPU database. However, that midpoint placement is not tied to a measured benchmark result because the average score is 0. It should be read as a database position, not as evidence of a specific performance level.
What the data does provide is a performance envelope. The FP32 compute rate is 240.0 GFLOPS. The pixel fill rate is 3.000 GPixel/s, driven by 4 ROPs. The texture fill rate is 6.000 GTexel/s, driven by 8 TMUs. Memory bandwidth is 14.40 GB/s. These four ceilings are the concrete performance indicators. They describe a low-power mobile part, but without nearestRivals there is no basis for a percentage-based comparison.
FAQ
Q: What architecture and process node does the AMD FirePro M3900 use?
A: It uses TeraScale 2 architecture with the Seymour chip. TSMC manufactures it on a 40 nm process with 370 million transistors on a 67 mm² die, for a density of 5.5M transistors per mm².
Q: What memory configuration is specified?
A: The GPU has 1024 MB of GDDR3 memory on a 64-bit bus. The memory clock is 900 MHz, or 1800 Mbps effective, and the bandwidth is 14.40 GB/s.
Q: Does it support Vulkan or ray tracing?
A: Vulkan is not listed. The supported APIs in the FACT PACK are DirectX 11.2 (11_0) and OpenGL 4.4. The rtCores and tensorCores fields are null, so no ray tracing or tensor acceleration hardware is specified.
Q: What is the TDP and what power connectors are required?
A: The TDP is 20 W. No power connectors are listed, and no suggested PSU is provided in the FACT PACK.
Q: When was it released and what is its production status?
A: The release date is 2010-10-18. The production status is end-of-life. Its predecessor is FirePro Mobility, and its successor is Radeon Pro Mobile.
Q: What bus interface does it use?
A: It uses PCIe 2.0 x16. The display outputs are listed as Portable Device Dependent, so the physical display connections depend on the host device.
Memory Subsystem
The memory subsystem is built around 1024 MB of GDDR3. The bus width is 64 bit, and the memory clock is 900 MHz with 1800 Mbps effective data rate. That produces 14.40 GB/s of bandwidth. This is a narrow memory configuration, and it sets a hard limit on how much data can be moved into the shading units.
For high-resolution workloads, bandwidth and ROP count are the first constraints. The GPU has 4 ROPs, giving a pixel rate of 3.000 GPixel/s. The 8 TMUs deliver 6.000 GTexel/s, and the 160 shading units deliver 240.0 GFLOPS of FP32 compute. The memory bus is more likely to become a bottleneck than the compute capacity. A 64-bit bus with GDDR3 does not provide the data movement headroom needed for large frame buffers and high-resolution textures.
The 1024 MB capacity is sufficient for smaller textures and lighter scenes. It is not suited to workloads that require extensive texture streaming or very large display surfaces. The data does not list base or boost clocks, so the memory clock of 900 MHz is the sole timing reference in the pack.
Power and Cooling
The TDP is 20 W, which is a low power envelope. The FACT PACK lists no power connectors and no suggested PSU. No slot width is given, and the physical dimensions are also absent, so height, length, and width are not specified. In practice, a 20 W TDP indicates that the card should not demand elaborate cooling. The host portable device’s cooling and power delivery are the relevant factors.
The bus interface is PCIe 2.0 x16, which provides the connection to the rest of the system. Because the display outputs are Portable Device Dependent, the integration is tied to the mobile workstation design rather than to a fixed card layout. The absence of a power connector listing and a suggested PSU means the data does not describe a desktop-style auxiliary power requirement. For a user integrating this GPU, the 20 W TDP and the lack of add-on power connectors are the only power-related facts available.
Detailed benchmark scores and charts for the AMD FirePro M3900 are below.
Benchmark Scores
No benchmark data available for this GPU.
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