AMD FirePro A320

The AMD FirePro A320 is an integrated graphics processor from the TeraScale 3 IGP (Trinity Mobile) generation, built on the Devastator chip. GlobalFoundries manufactures it on a 32 nm process with 1,303 million transistors on a 246 mm² die, resulting in a transistor density of 5.3M / mm². The engine contains 384 shading units, 24 texture mapping units, and 8 ROPs, with an 800 MHz base clock and a 955 MHz boost clock. The release date is listed as 2012-06-05, and the production status is end-of-life. The benchmarks array is empty, the average benchmark score is 0, and the percentile versus all GPUs is 50.

Who Should Consider It

The data describes a part intended for integrated graphics duty rather than a discrete expansion card. The specification shows 384 shaders and 8 ROPs, which is a modest geometry of processing resources. Peak pixel throughput is 7.640 GPixel/s, texture throughput is 22.92 GTexel/s, and FP32 compute is 733.4 GFLOPS. These figures place the practical envelope of the FirePro A320 away from high-detail rendering at large display resolutions. Users who target lower resolutions and conservative graphical settings are the realistic audience for this part; the throughput numbers do not support an expectation of heavy shader workloads or high fill-rate demand.

The 50th percentile database placement is not corroborated by a measured benchmark average. Because the average benchmark score is 0 and the benchmarks array contains no records, this percentile should be treated as a positional field rather than a tested performance result. The feature boundary is also defined by the listed API support: DirectX 11.2 (11_0) and OpenGL 4.4. That indicates a workload target within those API generations. Display outputs are motherboard dependent, so the available display connectivity is determined entirely by the host board rather than by the IGP itself. For a platform that fits the TeraScale 3 integration point, this is a part for lightweight graphics and display output, not for high-end rendering.

Ray Tracing and Feature Set

The RT core and tensor core fields are both null. This means the specification declares no dedicated hardware for ray traversal and no tensor arithmetic hardware. There is no ray tracing acceleration data in the record, and no tensor-based feature set is listed. The functional feature set is therefore confined to the TeraScale 3 pipeline and the API versions present in the data.

API support consists of DirectX 11.2 (11_0) and OpenGL 4.4. The Vulkan field is null, so no Vulkan API level is exposed in this specification. The absence of a Vulkan entry narrows the available software interface relative to parts that list it. The data also does not include an FP16 rate; the only compute throughput given is FP32 at 733.4 GFLOPS. This suggests the shader arithmetic is defined around FP32 processing, with no declared half-precision path.

The fixed-function rendering stages are represented by the pixel rate of 7.640 GPixel/s and the texture rate of 22.92 GTexel/s. These are the maximum output rates for pixel and texture processing. The 24 texture mapping units provide the texture fetch width behind the 22.92 GTexel/s figure, while the 8 ROPs bound back-end pixel writes. Without RT cores, tensor cores, or a Vulkan entry, the feature set is bounded by the TeraScale 3 architecture and the DirectX/OpenGL versions listed.

Memory Subsystem

Memory size, memory type, bus width, and memory clock are all listed as "System Shared." Bandwidth is listed as "System Dependent." This is an integrated part without dedicated VRAM. The framebuffer, textures, and other graphics data must reside in system memory, so the effective memory bandwidth is governed by the host system’s memory configuration. The data does not quantify that bandwidth.

For high resolutions, this has a direct consequence. As display resolution increases, framebuffer size grows, and texture storage pressure rises. A shared-memory IGP must compete with the host CPU for the same system memory resources. There is no dedicated memory bus width in the specification to isolate graphics memory traffic. The pixel rate of 7.640 GPixel/s and the texture rate of 22.92 GTexel/s are engine-level limits; the actual sustained throughput can be lower when the system memory path is also servicing CPU requests. The memory subsystem is therefore one of the most constraining parts of the FirePro A320 specification. Without a fixed bus width or a fixed bandwidth figure, no direct estimate of memory performance can be made from the record.

How It Compares

The nearestRivals array is empty. There are no rival names, no score deltas, and no delta percentage values available for this page. Consequently, the FirePro A320 cannot be placed ahead of or behind any specific named rival from the data. The only comparison fields present are the 50th percentile versus all GPUs and the average benchmark score of 0. Since the benchmarks array is empty, a zero average score does not reflect a measured performance result; it indicates the absence of benchmark samples.

The nearest comparative context is the stated predecessor and successor. The predecessor is TeraScale 2 IGP, and the successor is GCN 2.0 IGP. These are generational positions in AMD’s integrated graphics lineage rather than competitive performance rankings. They establish chronology: the FirePro A320 sits between those two IGP families. But they do not provide the relative performance percentages normally found in nearestRivals entries. Because that list is empty, any claim that the FirePro A320 outperforms or trails a specific rival would have no basis in this record.

Power and Cooling

The listed TDP is 100 W. This is the only thermal power figure in the specification. The slot width field is recorded as "IGP," not as a discrete card slot type. This indicates the part is integrated into the host platform rather than installed as a separate expansion card. No power connectors are listed, and the suggested PSU field is null. The data therefore specifies no auxiliary power connector requirement and makes no power supply recommendation.

The bus interface is PCIe 2.0 x16, but the IGP form factor means that interface is part of the platform design rather than an external card slot. No dimensions are listed, so there is no physical length, height, or width to use for cooler compatibility. Display outputs are motherboard dependent, meaning the output stage is defined by the board. For power and cooling planning, the 100 W TDP is the central figure. It is the only thermal specification in the record that can guide platform-level thermal design, and it is paired with an absence of connector requirements and no suggested PSU.