Intel Xeon X7350

Intel Xeon X7350 is an end-of-life server processor from Intel’s Core 2 architecture, built on the Tigerton codename for the Xeon MP line. Released in September 2007, this six-core, six-thread chip was designed for multi-socket server platforms, with a 130W TDP and support for DDR2 and DDR3 memory. The processor carries a launch MSRP of $2301, and its benchmark percentile versus all CPUs sits at 50, indicating a mid-pack standing among all processors ever tested in the database.

Single-Thread vs Multi-Thread Behavior

The Xeon X7350 presents a fundamental asymmetry in its design: six physical cores with no hyper-threading, meaning exactly six threads. With a base clock of 2.93 GHz and no boost clock listed, the processor operates at a fixed frequency. In single-threaded workloads, the chip relies entirely on its per-core efficiency from the 65 nm Core 2 architecture. The 64 KB L1 cache per core and 4 MB L2 per die (the processor uses a dual-die package, hence the 2x 143 mm² die size) provide adequate on-chip data locality, but the lack of any turbo or boost mechanism means single-thread performance is strictly bound to the 2.93 GHz base clock.

Multi-threaded behavior is where the X7350’s server pedigree shows. With six full cores, the processor can handle six concurrent threads without resource contention from simultaneous multi-threading. This is a classic design choice for the Xeon MP segment, where predictable throughput on many threads matters more than peak single-thread speed. The 582 million transistor count, spread across two dies, allows each core to have its own dedicated L1 and share a 4 MB L2 per die, which reduces cross-die communication penalties in multi-threaded scenarios. For real workloads, this means the X7350 excels in parallel server tasks, database queries, virtualization hosts, or compile farms, where six independent threads can execute simultaneously. Conversely, lightly threaded applications that rely on a single fast core will see only the raw 2.93 GHz clock, with no boost headroom to offset the aging architecture.

Power and Thermals

The 130W TDP places the X7350 in the mid-to-high power envelope for its era. This is not an energy-efficient part by modern standards, but for a 2007 six-core server chip, 130W represents a deliberate trade-off between core count and thermal manageability. The 65 nm process node, while mature for its time, generates significant heat per core; however, the dual-die package spreads thermal load across two physical substrates, each measuring 143 mm². This physical separation helps distribute heat more evenly than a single large die would.

Cooling implications are straightforward: the X7350 requires a capable server-grade air cooler or a well-ventilated chassis with directed airflow. The lack of a boost clock means the processor never exceeds its base 2.93 GHz, so peak power draw stays predictable, there is no transient power spike from turbo frequencies. For system integrators, this predictability simplifies power supply and thermal design, as the 130W TDP is a hard ceiling rather than an average. The socket, Intel Socket 604, is a legacy platform, so any cooling solution must match that specific socket’s mounting mechanism. Given the end-of-life status, aftermarket coolers are scarce, and operators should rely on original server heatsinks designed for 130W-class Xeon MPs.

How It Compares

The X7350 has no nearest rivals listed in the benchmark database, which is notable. This absence suggests that the processor’s benchmark scores (average score of 0, with an empty benchmarks array) place it in a standalone category, likely due to its niche Xeon MP positioning and the fact that most comparable processors in the database are either mainstream desktop parts or more recent server chips that do not share its exact class. The 50th percentile ranking among all CPUs indicates that half of all tested processors perform better and half perform worse, but without specific rival data, direct comparisons cannot be quantified.

Given the lack of nearestRivals data, the X7350’s position must be interpreted from its architectural specifications alone. Against later Core 2-based Xeons, the fixed 2.93 GHz clock and six cores would place it below eight-core variants in multi-threaded tests, but above quad-core parts in pure thread count. Against modern server processors with 16 or more cores and significantly higher clocks, the X7350 would fall far behind in both single-thread and multi-thread metrics. Its 50th percentile ranking is likely influenced by the sheer number of low-end or embedded processors in the database, which the X7350 outpaces in raw core count, while newer high-end parts push it below the median from the top.

FAQ

Q: Does the Intel Xeon X7350 support hyper-threading?

A: No. It has 6 cores and 6 threads, meaning each core executes exactly one thread with no simultaneous multi-threading.

Q: What is the maximum memory bandwidth of the X7350?

A: The processor supports quad-channel memory with a bandwidth of 21.3 GB/s, using DDR2 or DDR3 memory types.

Q: Is the X7350 multiplier unlocked for overclocking?

A: No, the multiplier is locked. The processor runs at a fixed base clock of 2.93 GHz with no boost clock available.

Q: What socket does the X7350 use?

A: It uses Intel Socket 604, which is specific to the Xeon MP Tigerton platform.

Q: Does the X7350 have integrated graphics?

A: Integrated graphics are available only on certain motherboards as a chipset feature, not as part of the processor itself.

Q: What is the production status of the X7350?

A: The processor is end-of-life, having been released on September 5, 2007.

Benchmark Performance

The benchmark data for the X7350 is notably sparse: an average benchmark score of 0 and an empty benchmarks array. This means no specific test results are available in the fact pack to analyze. The 50th percentile ranking against all CPUs is the only numerical performance indicator. This percentile suggests that the X7350 sits exactly at the median of all processors in the database, which is a surprisingly high ranking for a 2007 six-core chip with no boost clock. However, this ranking likely reflects the database’s composition, many low-power embedded or low-end processors score poorly, pulling the median down to a level where a six-core server chip at 2.93 GHz can match or exceed them.

Without rival deltas, we cannot state precise percentage advantages or disadvantages. The absence of nearestRivals data prevents any comparative analysis beyond the percentile. What the 50th percentile implies is that in mixed workloads, a blend of single-thread and multi-thread tasks, the X7350 performs on par with the typical processor in the database. For its era, six cores at 2.93 GHz was a strong server configuration, but the lack of boost and the aging 65 nm architecture cap its ceiling. The 582 million transistors and dual-die design were advanced for 2007, but they cannot compensate for the clock speed stagnation. In practice, benchmark results would show the X7350 outperforming dual-core and quad-core contemporaries in heavily threaded tests, while falling behind newer processors with higher clocks and more modern instruction sets.

Platform and Compatibility

The X7350 is built for Intel Socket 604, a platform exclusively used by Xeon MP processors. This socket supports the Tigerton architecture, which was designed for multi-socket servers, typically two, four, or eight sockets per motherboard. The processor’s memory controller (integrated on the chipset, not the CPU) supports DDR2 and DDR3 memory in a quad-channel configuration, yielding 21.3 GB/s of bandwidth. ECC memory is supported, which is mandatory for reliable server operation. The platform lacks PCIe support listed in the fact pack, indicating that expansion buses are handled by the chipset rather than integrated into the processor.

The memory bus is quad-channel, which for the time was a high-bandwidth configuration, though 21.3 GB/s is modest by modern standards. The processor uses two dies (2x 143 mm²), each with its own 4 MB L2 cache, totaling 8 MB of L2 across the package. L3 cache is absent, so all cache hierarchy is L1 (64 KB per core) and L2. The architecture, Core 2, is a 64-bit design, but the Xeon MP variant supports multi-socket coherent memory access, which is a key feature for scaling to large server configurations.

Upgrade path is effectively nil. Socket 604 is a legacy platform with no modern processors using it. The X7350 is end-of-life, and its production status confirms that no further iterations of this socket will appear. For existing systems, the upgrade path is limited to other Socket 604 Xeon MPs from the same generation, such as higher-clocked Tigerton variants, but none are listed in the fact pack. The platform’s memory support for both DDR2 and DDR3 is unusual, suggesting the chipset can accommodate either type, but the choice depends on the specific motherboard. The integrated graphics feature is a chipset-level capability, meaning some motherboards with this socket may include a display output, but the processor itself has no iGPU. Overall, the X7350 is a fixed-function server component with no forward compatibility; its value lies solely in legacy systems that require its specific six-core, 130W configuration.