Intel Xeon Platinum 8276
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Xeon Platinum 8276 Specifications
Xeon Platinum 8276 Core Configuration
Processing cores and threading
The Intel Xeon Platinum 8276 features 28 physical cores and 56 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Platinum 8276 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Xeon Platinum 8276 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Platinum 8276 by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Xeon Platinum 8276 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Platinum 8276 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Platinum 8276's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Cascade Lake Architecture & Process
Manufacturing and design details
The Intel Xeon Platinum 8276 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Platinum 8276 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Cascade Lake Instruction Set Features
Supported CPU instructions and extensions
The Xeon Platinum 8276 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Platinum 8276 Power & Thermal
TDP and power specifications
The Intel Xeon Platinum 8276 has a TDP (Thermal Design Power) of 165W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 3647 Platform & Socket
Compatibility information
The Xeon Platinum 8276 uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 3647 Memory Support
RAM compatibility and speeds
Memory support specifications for the Platinum 8276 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Platinum 8276 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Xeon Platinum 8276 Product Information
Release and pricing details
The Intel Xeon Platinum 8276 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Platinum 8276 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
Xeon Platinum 8276 Benchmark Scores
No benchmark data available for this CPU.
About Intel Xeon Platinum 8276
The Intel Xeon Platinum 8276 is a 28-core, 56-thread processor from Intel, released on 2018-12-10 for the Server/Workstation segment. It is built for Intel Socket 3647 and uses the Cascade Lake architecture, with the codename Cascade Lake-SP. The chip is manufactured on Intel's 14 nm process and integrates 8,000 million transistors. Its base clock is 2.20 GHz, its boost clock is 4.00 GHz, and its TDP is 165. The part number is SRF99CD8069504195501.
Benchmark Performance
The fact pack contains an empty benchmarks array and an avgBenchmarkScore of 0. That means the database has no measured score to analyze for this unit. The only global ranking field is percentileVsAllCpus, which is 50. A 50th percentile placement puts the processor at the median of all CPUs in the database: half of the ranked entries sit above it and half sit below it, though no direct score is present in the record.
Because nearestRivals is empty, there are no rival names, no rival scores, and no deltaPct values to cite. No exact percentage can be computed from this record. The benchmark performance picture is therefore limited to the processor's specification data rather than derived from benchmark results.
On the specification side, the parallel resources are substantial: 28 cores and 56 threads. The base clock of 2.20 GHz and boost clock of 4.00 GHz define the frequency range. The cache hierarchy is documented as 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 38.5 MB of shared L3 cache. These values describe the compute configuration, but without a benchmark score they cannot be converted into a comparative performance figure.
The absence of an avgBenchmarkScore is itself a data point: the value 0 is not a derived performance number, it is the default value stored alongside an empty benchmarks list. One consequence is that the percentileVsAllCpus value of 50 cannot be cross-checked against any listed score. If a user relies on the percentile, they are relying on the database's own ranking system; the fact pack does not expose the underlying score.
Power and Thermals
The only power metric in the fact pack is the TDP of 165. No measured power consumption numbers are included, and no thermal data appear. The 14 nm manufacturing process and the 8,000 million transistor count are the process-level details that accompany this TDP figure. Together, they place the part in a power class that a Socket 3647 server platform must cool. The market segment is Server/Workstation, which is the thermal context implied by the product's intended use.
The integrated graphics field is null, so the processor is not documented with an on-die GPU. That means the thermal load in the record is associated with the CPU proper rather than a graphics block. The fact pack lists no integrated graphics, leaving the CPU cores as the stated compute components.
For cooling tier, the pack does not specify a cooler or heatsink. The available data indicate a 165 TDP part on Intel Socket 3647; the cooling solution is therefore a platform-level decision. In the Server/Workstation segment, the thermal design must accommodate the 165 TDP envelope during boost operation. The 14 nm process is the only process node listed; no other manufacturing detail such as die size is present.
How It Compares
The nearestRivals array is empty. Because of that, this record has no direct comparison to a specific rival processor. There are no names, no scores, no deltaPct values, and therefore no percentage leads or deficits to report. The data instead offers a single broad reference: the 50th percentile versus all CPUs.
No nearest rival is listed, so there is no per-rival paragraph to construct. Against the all-CPU field, the Xeon Platinum 8276 sits exactly at the midpoint. A percentile of 50 is the median placement; it neither flags the processor as a high outlier nor as a low outlier. This comparison is only as strong as the underlying benchmark set, which is empty for this SKU.
If the database had populated benchmark scores, a nearestRivals entry could provide a deltaPct. In this record, that field is an empty list, so any attempt to name a competitor would be unsupported. The empty nearestRivals list distinguishes this record from processors that have nearestRivals entries with deltaPct values. Without such an entry, the data cannot place the Xeon Platinum 8276 ahead of or behind a named competitor.
Platform and Compatibility
The processor uses Intel Socket 3647. Memory support is DDR4, and ECC memory is enabled in the data. The architecture field says Cascade Lake, and the codename field says Cascade Lake-SP. The generation is listed as Xeon Platinum (Cascade Lake-SP). These identifiers define the platform generation.
The part number SRF99CD8069504195501 identifies the exact SKU. The multiplierUnlocked field is false, so the processor is not an unlocked part. The fact pack contains no PCIe information, no memory bus width, and no memory bandwidth, so those compatibility details are absent from this record.
For upgrade path, a system built around this processor must stay on Intel Socket 3647 unless the motherboard is changed. The pack does not list other Socket 3647 processors, so a direct within-socket upgrade cannot be named from the data. The 2018-12-10 release date positions it in the Cascade Lake-SP generation, and any platform compatibility question beyond socket, memory, and ECC would require additional datasheet details.
FAQ
Q: How many cores and threads does the Intel Xeon Platinum 8276 have?
A: It has 28 cores and 56 threads.
Q: What are the base and boost clock speeds?
A: The base clock is 2.20 GHz and the boost clock is 4.00 GHz.
Q: What TDP is listed for this processor?
A: The TDP is 165.
Q: What memory type and ECC support does it have?
A: It supports DDR4 memory and has ECC memory support.
Q: What socket does it use?
A: Intel Socket 3647.
Q: Is the multiplier unlocked?
A: No — the multiplierUnlocked field is false.
The AMD Equivalent of Xeon Platinum 8276
Looking for a similar processor from AMD? The AMD Ryzen 5 3500U offers comparable performance and features in the AMD lineup.
Popular Intel Xeon Platinum 8276 Comparisons
See how the Xeon Platinum 8276 stacks up against similar processors from the same generation and competing brands.
Compare Xeon Platinum 8276 with Other CPUs
Select another CPU to compare specifications and benchmarks side-by-side.
Browse CPUs