INTEL

Intel Xeon Platinum 8253

Intel processor specifications and benchmark scores

16
Cores
32
Threads
3
GHz Boost
125W
TDP
🛡️ECC Memory

Intel Xeon Platinum 8253 Specifications

⚙️

Xeon Platinum 8253 Core Configuration

Processing cores and threading

The Intel Xeon Platinum 8253 features 16 physical cores and 32 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
16
Threads
32
SMP CPUs
8
⏱️

Platinum 8253 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Platinum 8253 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Platinum 8253 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
3 GHz
Multiplier
22x
💾

Intel's Xeon Platinum 8253 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Platinum 8253 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Platinum 8253's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
1 MB (per core)
L3 Cache
22 MB (shared)
🏗️

Cascade Lake Architecture & Process

Manufacturing and design details

The Intel Xeon Platinum 8253 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Platinum 8253 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Cascade Lake
Codename
Cascade Lake-SP
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Platinum (Cascade Lake-SP)
🔢

Cascade Lake Instruction Set Features

Supported CPU instructions and extensions

The Xeon Platinum 8253 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
SHA
AES-NI
F16C
BMI1
BMI2
Intel 64
VT-x
VT-d
DL Boost
🔌

Platinum 8253 Power & Thermal

TDP and power specifications

The Intel Xeon Platinum 8253 has a TDP (Thermal Design Power) of 125W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
125W
🔧

Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Platinum 8253 uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Platinum 8253 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Platinum 8253 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported
📦

Xeon Platinum 8253 Product Information

Release and pricing details

The Intel Xeon Platinum 8253 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Platinum 8253 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Dec 2018
Market
Server/Workstation
Part Number
SRF93CD8069504194601

Xeon Platinum 8253 Benchmark Scores

📊

No benchmark data available for this CPU.

About Intel Xeon Platinum 8253

The Intel Xeon Platinum 8253 from Intel is built on the 14 nm Cascade Lake‑SP process, delivering a balanced mix of core density and power efficiency for demanding workloads. With 16 physical cores and 32 threads, it offers a base clock of 2.20 GHz that can boost to 3.00 GHz under turbo conditions, while a 22 MB shared L3 cache reduces latency for large data sets. The 125 W TDP aligns with the Intel Socket 3647 platform, enabling dense server configurations without excessive thermal headroom. Its design emphasizes AVX‑512 extensions and enhanced security features, making it a solid foundation for modern data‑center architectures.

Although no public benchmark data is available for the Intel Xeon Platinum 8253 from Intel, its architectural specifications suggest strong performance in both single‑threaded and multi‑threaded scenarios. The 3.00 GHz turbo frequency combined with 16 cores translates to an estimated peak FP64 throughput of roughly 1.5 TFLOPS, suitable for scientific computing and AI inference. The 22 MB L3 cache and high memory bandwidth from DDR4‑2666 further improve throughput in memory‑intensive applications. In practice, users can expect consistent latency and predictable scaling across virtualization workloads, thanks to Intel’s hardware‑assisted virtualization extensions.

The Intel Xeon Platinum 8253 from Intel targets the upper‑tier enterprise and hyperscale market segments, where reliability and scalability are non‑negotiable. It fits naturally into rack‑mount and blade servers that demand high core counts without sacrificing power efficiency. Cloud providers and large‑scale HPC clusters benefit from its robust security enclave and support for up to 4 TB of DDR4 memory per socket. Its position within the Xeon Platinum family also guarantees long‑term firmware updates and compatibility with Intel’s ecosystem of management tools.

When pairing the Intel Xeon Platinum 8253 from Intel, consider platforms that maximize its capabilities while maintaining thermal stability. Choose a motherboard that supports dual‑socket configurations and offers at least 8 DIMM slots per CPU for high‑capacity memory. Opt for DDR4‑2666 ECC modules to leverage the full bandwidth and error‑correction benefits. Complement the CPU with these three components for an optimal build:

  1. Supermicro X12DPi‑TNR server board with advanced power delivery.
  2. Corsair Vengeance LPX DDR4‑2666 ECC memory kits (32 GB × 4).
  3. Cooler Master Hyper 212 EVO high‑airflow cooler with 125 W TDP rating.

The AMD Equivalent of Xeon Platinum 8253

Looking for a similar processor from AMD? The AMD Ryzen 5 3500U offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 3500U

AMD • 4 Cores

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