INTEL

Intel Xeon Phi 7295

Intel processor specifications and benchmark scores

72
Cores
288
Threads
1600
GHz Boost
320W
TDP
πŸ›‘οΈECC Memory

Intel Xeon Phi 7295 Specifications

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Xeon Phi 7295 Core Configuration

Processing cores and threading

The Intel Xeon Phi 7295 features 72 physical cores and 288 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
72
Threads
288
SMP CPUs
1
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Phi 7295 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7295 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7295 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1500 GHz
Boost Clock
1600 GHz
Multiplier
15x
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Intel's Xeon Phi 7295 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7295 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7295's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)
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Knights Mill Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7295 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7295 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Mill
Codename
Knights Mill
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Mill)
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Knights Mill Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7295 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64
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Phi 7295 Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7295 has a TDP (Thermal Design Power) of 320W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
320W
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Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7295 uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7295 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7295 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported
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Xeon Phi 7295 Product Information

Release and pricing details

The Intel Xeon Phi 7295 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7295 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Dec 2017
Market
Server/Workstation

Xeon Phi 7295 Benchmark Scores

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No benchmark data available for this CPU.

About Intel Xeon Phi 7295

At the heart of this processor lies its formidable multi-threading architecture, featuring 72 cores capable of handling 288 simultaneous threads. This immense parallel processing power is central to the design of the Intel Xeon Phi 7295, making it exceptionally suited for highly threaded scientific and analytical workloads. Each core leverages four-way Intel Hyper-Threading to maximize computational throughput on tasks that can be broken into many parallel streams. This design philosophy prioritizes raw parallel performance over single-threaded speed, targeting a specific niche in the high-performance computing landscape. The chip’s capability to manage such a high thread count is its defining characteristic for complex simulations and data analysis.

The processor operates at a base clock of 1.5 GHz, with a maximum turbo frequency reaching 1.6 GHz across all cores under optimal conditions. While these speeds may seem modest compared to consumer CPUs, they are carefully balanced against the chip's 320W TDP and the thermal demands of 72 active cores. This Knights Mill generation part uses a 14nm process to integrate this many cores into a single package, focusing on energy-efficient throughput. The clock speed strategy ensures that the many-core Xeon Phi processor can deliver sustained performance within its substantial power envelope, avoiding thermal throttling in dense server deployments.

  1. Core Configuration: 72 physical cores with 4 threads each, enabling 288 logical processors.
  2. Cache Hierarchy: Features 32KB L1 and 512KB L2 cache per core, utilizing a distributed mesh interconnect without a traditional shared L3 cache.
  3. Power Design: A 320W Thermal Design Power (TDP) rating manages the substantial energy requirements of the many-core design.
  4. Target Workloads: Optimized for highly parallel, floating-point intensive tasks like financial modeling, seismic processing, and scientific simulations.
  5. Platform Integration: Utilizes the Intel Socket 3647 and is designed for scalable deployment in multi-card HPC and AI inference systems.

Primary use cases for this computing solution are specialized, focusing on high-performance computing (HPC) environments where parallelizable, double-precision floating-point performance is critical. Its architecture targets workloads such as seismic analysis, computational fluid dynamics, and deep learning inference where task-level parallelism is high. The 320W power consumption necessitates robust server cooling solutions, positioning it in purpose-built data center racks. Ultimately, the Intel Xeon Phi 7295 chip from Intel serves as a strategic many-core accelerator for specific technical and scientific computing challenges, rather than general-purpose server duties.

The AMD Equivalent of Xeon Phi 7295

Looking for a similar processor from AMD? The AMD Ryzen 5 2500U offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 2500U

AMD β€’ 4 Cores

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