INTEL

Intel Xeon Phi 7295

Intel processor specifications and benchmark scores

72
Cores
288
Threads
1600
GHz Boost
320W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 72C / 288T
Boost Clock 1600 GHz
Base Clock 1500 GHz
TDP 320W
Architecture Knights Mill
Socket Intel Socket 3647
nm
Process 14 nm
Released Dec 2017

Intel Xeon Phi 7295 Specifications

Xeon Phi 7295 Core Configuration

Processing cores and threading

The Intel Xeon Phi 7295 features 72 physical cores and 288 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
72
Threads
288
SMP CPUs
1

Phi 7295 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7295 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7295 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1500 GHz
Boost Clock
1600 GHz
Multiplier
15x

Intel's Xeon Phi 7295 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7295 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7295's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)

Knights Mill Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7295 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7295 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Mill
Codename
Knights Mill
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Mill)

Knights Mill Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7295 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64

Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7295 has a TDP (Thermal Design Power) of 320W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
320W

Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7295 uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7295 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7295 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported

Product Information

Release and pricing details

The Intel Xeon Phi 7295 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7295 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Dec 2017
Market
Server/Workstation

About Intel Xeon Phi 7295

The Intel Xeon Phi 7295 is a server and workstation processor built on Intel's Knights Mill architecture, released on November 30, 2017. It is manufactured on a 14 nm process with 8,000 million transistors, and it features 72 cores and 288 threads. The base clock is 1500.00 MHz, and the boost clock is 1600.00 MHz. The chip carries a TDP of 320 W, fits the Intel Socket 3647, and supports DDR4 memory with ECC. The L1 cache is 32 KB per core, and the L2 cache is 512 KB per core. In the benchmark database, the processor holds a 50th percentile position among all CPUs, with an average benchmark score of 0. The specifications indicate a processor designed for high-throughput parallel workloads rather than single-thread speed.

Single-Thread vs Multi-Thread Behavior

The base clock of 1500.00 MHz and boost clock of 1600.00 MHz are modest compared to typical desktop processors. This directly limits single-thread performance, as the per-core clock speed is the primary driver for latency-sensitive tasks. The 288 threads across 72 cores implies a high thread-per-core ratio, allowing the processor to handle a large number of concurrent operations. In single-threaded workloads, the low clock will likely result in performance below the median, but the 50th percentile overall suggests that multi-threaded performance compensates for this weakness. The L1 cache of 32 KB per core and L2 cache of 512 KB per core are per-core allocations, meaning each core has a modest amount of cache. The lack of L3 cache data (null) suggests that the architecture relies on per-core caches and the high thread count to keep data close to the execution units.

For real workloads, this split means that single-threaded applications, such as legacy office software or basic serial tasks, will not utilize the processor's strengths. In contrast, multi-threaded workloads like scientific simulations, video rendering, and large-scale data processing can scale across the 288 threads. The 1500.00 MHz base clock is a deliberate trade-off, allowing the 72 cores to operate within the 320 W TDP. The boost clock of 1600.00 MHz provides only a small headroom for short bursts, but the overall design prioritizes throughput over latency. The thread count is a multiple of the core count, indicating a high thread-per-core ratio, which is typical for server processors that rely on parallel execution. The data shows a processor that is heavily skewed toward multi-threaded performance, with single-thread capability being a secondary consideration.

Power and Thermals

The TDP of 320 W places the processor in a high-power class. The 14 nm process with 8,000 transistors is a dense die, and the high core count contributes to the substantial power draw. The 320 W TDP implies that a robust cooling solution is required. The Intel Socket 3647 is a server-grade socket, which typically supports high-end air cooling or liquid cooling loops. The data indicates that the processor is designed for sustained cooling, as the boost clock of 1600.00 MHz is only 100 MHz above the base clock, suggesting limited thermal and power headroom. The processor cannot sustain high clocks for extended periods without exceeding the 320 W envelope. The ECC memory support points to a server environment where reliability and uptime are critical, and the high TDP is a consequence of the massive core count and thread count. The 14 nm process is a mature node, but the 8,000 transistors still generate significant heat. The cooling tier implied is a high-end server cooler, capable of dissipating 320 W of heat. The absence of integrated graphics (null) reduces power consumption, but the core count and threads are the primary drivers of the TDP. The socket 3647 is a large socket, designed to handle the power delivery and thermal requirements of a 320 W processor, indicating that users must plan for a high-capacity cooling system.

Who Should Consider It

The market segment for this processor is Server/Workstation, as indicated in the data. The 288 threads and 72 cores make it an excellent candidate for highly parallelized workloads. Virtualized environments, where multiple virtual machines require dedicated threads, would benefit from the high thread count. The ECC DDR4 memory support is a critical feature for data centers and scientific computing, where data integrity is paramount. The 512 KB L2 cache per core provides a reasonable amount of data for each thread, though the 32 KB L1 cache is modest. The lack of L3 cache data (null) suggests that the architecture is optimized for streaming data rather than large, shared datasets. The 1500.00 MHz base clock means that the processor is not suited for latency-sensitive applications like gaming or typical office software, which rely on high single-core performance. Instead, it is designed for throughput-oriented workloads. The 50th percentile overall indicates that in a mixed workload, it is an average processor, but within its niche of high-thread-count tasks, it is a specialized tool. The release date of November 30, 2017 places it in a specific generation of Intel's Xeon Phi line, which was aimed at high-performance computing. Users with workloads that can scale to 288 threads will find it a strong candidate, while those with single-threaded tasks will not see its value. The ECC support and high thread count make it a fit for reliability-focused environments, such as financial modeling, scientific research, and large-scale data analytics.

How It Compares

The nearestRivals list is empty in the provided data, so there are no direct rival scores to compare against. The only positional reference is the percentileVsAllCpus value of 50, which places the processor at the exact median of all CPUs in the database. This means that in the aggregate benchmark score, it is an average processor. However, this median position is achieved with a highly unusual configuration: 72 cores and 288 threads at a low 1500.00 MHz base clock. Most CPUs in the database likely have fewer cores but higher clock speeds. The average benchmark score of 0 is consistent with the 50th percentile, indicating a median performance level. The absence of rival data means that a direct comparison to specific competitors is not possible from the provided information. The processor's architecture (Knights Mill) is a specialized design, and its position at the 50th percentile suggests that while it is not a top-tier performer, it is also not a bottom-tier part. The 320 W TDP and 14 nm process place it in a specific power/performance tier, but without rival scores, the comparison is limited to the global percentile. The data indicates that it is a median processor, but with a performance profile that is heavily skewed toward multi-threaded workloads. The empty nearestRivals list also means that the benchmark results do not include any direct comparisons, so the 50th percentile is the only reference point for its standing.

FAQ

Q: What is the core and thread count of the Intel Xeon Phi 7295?

A: It has 72 cores and 288 threads.

Q: What are the base and boost clock speeds?

A: The base clock is 1500.00 MHz and the boost clock is 1600.00 MHz.

Q: What is the TDP of this processor?

A: The TDP is 320 W.

Q: What type of memory does it support?

A: It supports DDR4 memory with ECC (Error-Correcting Code).

Q: What is the process node and transistor count?

A: It is built on a 14 nm process with 8,000 million transistors.

Q: What is its performance percentile in the database?

A: It sits at the 50th percentile of all CPUs.

Q: What socket does it use?

A: It uses the Intel Socket 3647.

Detailed benchmark scores and charts for the Intel Xeon Phi 7295 are below.

Benchmark Scores

No benchmark data available for this CPU.

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