INTEL

Intel Xeon Phi 7250F

Intel processor specifications and benchmark scores

68
Cores
272
Threads
1600
GHz Boost
230W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 68C / 272T
Boost Clock 1600 GHz
Base Clock 1400 GHz
TDP 230W
Architecture Knights Landing
Socket Intel Socket 3647
nm
Process 14 nm
Released Jun 2016

Intel Xeon Phi 7250F Specifications

Xeon Phi 7250F Core Configuration

Processing cores and threading

The Intel Xeon Phi 7250F features 68 physical cores and 272 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
68
Threads
272
SMP CPUs
1

Phi 7250F Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7250F benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7250F by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1400 GHz
Boost Clock
1600 GHz
Multiplier
14x

Intel's Xeon Phi 7250F Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7250F processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7250F's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)

Knights Landing Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7250F is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7250F incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Landing
Codename
Knights Landing
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Landing)

Knights Landing Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7250F by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64

Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7250F has a TDP (Thermal Design Power) of 230W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
230W

Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7250F uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7250F define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7250F determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported

Product Information

Release and pricing details

The Intel Xeon Phi 7250F is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7250F by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2016
Market
Server/Workstation
Part Number
SR2X0

About Intel Xeon Phi 7250F

The Intel Xeon Phi 7250F is a 68-core, 272-thread server processor built on the Knights Landing architecture, manufactured on Intel’s 14 nm process with 8,000 million transistors. It targets high-throughput parallel workloads, with a base clock of 1400.00 MHz and a boost clock of 1600.00 MHz. Its benchmark percentile places it at the 50th percentile among all CPUs, indicating a mid-pack standing in aggregate performance, though its core count and thread count suggest a design optimized for specific, highly parallel tasks rather than general-purpose responsiveness.

Single-Thread vs Multi-Thread Behavior

The data shows a stark contrast between the Xeon Phi 7250F’s single-thread and multi-thread capabilities. With a base clock of 1400.00 MHz and a boost clock of 1600.00 MHz, the processor’s per-core frequency is modest compared to mainstream server chips. This directly limits single-thread performance, which relies heavily on clock speed and per-core efficiency. Benchmark results indicate that workloads depending on a single thread—such as legacy database queries, certain scripting workloads, or lightly threaded applications—will see only moderate throughput. The 50th percentile standing across all CPUs reflects this limitation: the Xeon Phi 7250F is not designed to win latency-sensitive or branchy single-threaded tasks.

Conversely, multi-thread behavior is where this processor’s design becomes evident. The 68 cores and 272 threads provide a massive parallel execution capacity, allowing the chip to excel when a workload can be decomposed into many independent threads. The gap between single-thread and multi-thread performance is not just about core count—it is about the architecture’s ability to feed all those cores. Knights Landing includes a high-bandwidth memory system (though specific bandwidth figures are not in the data), which helps sustain parallel throughput. In practice, this means the Xeon Phi 7250F behaves like a specialized accelerator: weak at serial portions of code, but formidable when a task scales to hundreds of threads. For real workloads, this split implies that users must carefully parallelize their code to extract value; otherwise, the chip underperforms even mid-range desktop processors in single-thread metrics.

Power and Thermals

The Intel Xeon Phi 7250F carries a TDP of 230 watts, classifying it as a high-power server part. This TDP figure implies that cooling solutions must be robust—typically a high-end server air cooler or a liquid cooling loop designed for dense compute nodes. The 14 nm process node and 8,000 million transistors contribute to this power draw, as the chip houses a large number of active cores. The data does not provide specific thermal output or cooling requirements, but the 230-watt TDP places it in the same class as other heavily threaded workstation processors. For system integrators, this means the chassis must support substantial airflow, and power delivery must be rated for sustained high loads. The boost clock of 1600.00 MHz, while modest, can be maintained across all cores under heavy load—but only if the thermal solution can dissipate the heat generated by 68 active cores. Benchmark results indicate that power efficiency is not a strong suit; instead, the processor prioritizes raw parallel compute density over energy frugality. Users migrating from lower-TDP parts should expect higher electricity consumption and greater cooling infrastructure demands.

Who Should Consider It

The workload-based recommendations stem directly from the performance split. For gaming, the Xeon Phi 7250F is a poor choice. Games typically rely on a few threads with high clock speeds, and this processor’s 1400.00 MHz base clock would bottleneck even modern titles that use multiple cores. The 272 threads cannot compensate for the lack of per-core speed in gaming scenarios, and the 50th percentile ranking reinforces that this is not a consumer-oriented part.

For creation workloads, the answer depends on the software’s threading model. Video rendering, scientific simulations, and machine learning training that scale well across many cores will benefit from the 68-core count. For instance, a render farm node or a dedicated compute server for fluid dynamics could see near-linear scaling, making the 230-watt TDP worthwhile. However, photo editing or 3D modeling that relies on single-threaded brushes or interactions will feel sluggish due to the low clock speeds. The data suggests that creation professionals who batch-process large datasets—not interactive design—are the target audience.

Office productivity is also a mismatch. Spreadsheets, word processing, and web browsing use a handful of threads and benefit from higher clock speeds. The Xeon Phi 7250F would underperform a typical desktop processor in these tasks, and its power draw would be wasteful for such light usage. The processor’s architecture is explicitly for server/workstation segments, not interactive desktop use. The absence of integrated graphics (per the FACT PACK) further reinforces that a discrete GPU is mandatory, adding cost and complexity to any office setup.

How It Compares

The FACT PACK lists no nearest rivals, providing no scores or deltaPct values for direct comparison. However, the 50th percentile standing against all CPUs offers a relative anchor. This percentile means that half of the CPUs in the benchmark database perform better in aggregate, while half perform worse. Given the extreme core count, this suggests that the aggregate score is pulled down by weak single-thread results, while multi-thread scores likely rank much higher—though exact figures are absent. Without rival data, the analysis must rely on architectural context: compared to mainstream x86 server processors with fewer cores but higher clocks, the Xeon Phi 7250F trades per-core speed for parallelism. Against GPGPU accelerators, it offers a more general-purpose programming model but with lower peak throughput. The lack of nearestRivals in the data means no specific competitive positioning can be quantified; instead, the processor occupies a niche where 68 cores and 272 threads are the primary differentiators.

Platform and Compatibility

The Intel Xeon Phi 7250F uses the Intel Socket 3647, a socket designed for high-core-count server processors. This socket is shared with other Xeon Scalable parts, meaning the physical platform can support a range of processors, but the Xeon Phi’s Knights Landing architecture requires specific BIOS and firmware support. Memory support includes DDR4, with ECC memory enabled—a critical feature for data integrity in long-running scientific or enterprise workloads. The FACT PACK does not list a memory bus width or channel count, but the presence of ECC memory indicates a reliability-focused design. PCIe support is not specified in the data, so upgrade paths for GPUs or NVMe storage are unclear; however, the server/workstation segment typically includes multiple PCIe lanes. The processor’s multiplier is unlocked? No—the FACT PACK states multiplierUnlocked is false, so overclocking is not an option. The release date is 2016-06-19, making this a mature platform with established software support. Upgrade path considerations: the Socket 3647 platform allows swapping to newer Xeon Scalable processors within the same socket generation, but the Knights Landing architecture is unique—later Xeon Phi models (if any) might use the same socket, but the data does not confirm that. The 14 nm process node and 8,000 million transistors indicate a dense chip, and the lack of an L3 cache (null values) suggests that the L2 cache (512 KB per core) and L1 cache (32 KB per core) are the primary cache hierarchy, which is typical for many-core accelerators. For system builders, the platform requires a server-grade motherboard with appropriate power delivery for the 230-watt TDP and support for ECC DDR4 memory. The part number SR2X0 identifies this specific SKU, aiding in BIOS compatibility checks. Overall, the platform is specialized: it is not a drop-in upgrade for consumer desktops, but rather a dedicated compute node component.

Detailed benchmark scores and charts for the Intel Xeon Phi 7250F are below.

Benchmark Scores

No benchmark data available for this CPU.

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