INTEL

Intel Xeon Phi 7250F

Intel processor specifications and benchmark scores

68
Cores
272
Threads
1600
GHz Boost
230W
TDP
๐Ÿ›ก๏ธECC Memory

Intel Xeon Phi 7250F Specifications

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Xeon Phi 7250F Core Configuration

Processing cores and threading

The Intel Xeon Phi 7250F features 68 physical cores and 272 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
68
Threads
272
SMP CPUs
1
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Phi 7250F Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7250F benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7250F by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1400 GHz
Boost Clock
1600 GHz
Multiplier
14x
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Intel's Xeon Phi 7250F Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7250F processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7250F's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)
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Knights Landing Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7250F is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7250F incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Landing
Codename
Knights Landing
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Landing)
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Knights Landing Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7250F by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64
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Phi 7250F Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7250F has a TDP (Thermal Design Power) of 230W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
230W
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Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7250F uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7250F define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7250F determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported
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Xeon Phi 7250F Product Information

Release and pricing details

The Intel Xeon Phi 7250F is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7250F by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2016
Market
Server/Workstation
Part Number
SR2X0

Xeon Phi 7250F Benchmark Scores

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No benchmark data available for this CPU.

About Intel Xeon Phi 7250F

The Intel Xeon Phi 7250F stands out as a powerful heterogeneous computing solution designed for high-performance data-intensive workloads, leveraging its 68 cores and 272 threads to deliver unprecedented parallel processing capabilities. Engineered with a 14 nm manufacturing process, this Xeon Phi processor from Intel operates at a base frequency of 1400.00 GHz, with a turbo boost capability reaching up to 1600.00 GHz, ensuring that demanding computational tasks can achieve maximum efficiency when needed. Its high thread count and robust core architecture are tailored to accelerate scientific simulations, financial modeling, and big data analytics, providing a significant edge for researchers and engineers tackling complex computations. The 230W Thermal Design Power (TDP) reflects its capacity to handle intensive computations without compromising performance, making it a solid choice for systems requiring sustained high throughput. The Intel Socket 3647 ensures compatibility with advanced server and high-performance computing platforms, allowing seamless integration into existing infrastructure. As part of the Knights Landing generation, this chip represents Intelโ€™s commitment to delivering specialized processors for advanced computing tasks, emphasizing its role in pushing the boundaries of whatโ€™s possible in high-performance computing. The Intel Xeon Phi 7250Fโ€™s design focuses on optimizing vectorized operations and memory bandwidth, crucial for applications that demand rapid data movement and parallel execution. When evaluating the Intel Xeon Phi 7250F for specific performance metrics, users should consider its ability to handle massive parallel tasks, such as in-memory computing and machine learning workloads, where its sheer processing power can significantly reduce runtime. This chip is primarily aimed at the high-performance computing (HPC) market, where organizations need to process large datasets quickly and reliably, making it ideal for academic research institutions, financial institutions, and governments requiring robust computational resources. For pairing suggestions, complementing the Intel Xeon Phi 7250F with high-speed memory and a robust storage subsystem ensures that data access bottlenecks are minimized, allowing the processor to operate at peak efficiency. Memory configurations should prioritize high bandwidth and capacity to fully leverage the chipโ€™s multithreading and parallel operations, enhancing overall system responsiveness. The Intel Xeon Phi 7250Fโ€™s architecture also pairs well with specialized cooling solutions and power management systems, essential for maintaining stability under heavy computational loads. Ultimately, the Intel Xeon Phi 7250F is a specialized tool for demanding HPC applications, where its combination of core count, clock speeds, and memory bandwidth delivers exceptional performance in scenarios where speed and scalability are paramount.

The AMD Equivalent of Xeon Phi 7250F

Looking for a similar processor from AMD? The AMD Ryzen 5 1600X offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1600X

AMD โ€ข 6 Cores

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