INTEL

Intel Xeon Phi 7230F

Intel processor specifications and benchmark scores

64
Cores
256
Threads
1500
GHz Boost
230W
TDP
🛡️ECC Memory

Intel Xeon Phi 7230F Specifications

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Xeon Phi 7230F Core Configuration

Processing cores and threading

The Intel Xeon Phi 7230F features 64 physical cores and 256 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
64
Threads
256
SMP CPUs
1
⏱️

Phi 7230F Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7230F benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7230F by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
1500 GHz
Multiplier
13x
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Intel's Xeon Phi 7230F Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7230F processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7230F's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)
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Knights Landing Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7230F is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7230F incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Landing
Codename
Knights Landing
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Landing)
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Knights Landing Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7230F by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64
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Phi 7230F Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7230F has a TDP (Thermal Design Power) of 230W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
230W
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Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7230F uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7230F define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7230F determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported
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Xeon Phi 7230F Product Information

Release and pricing details

The Intel Xeon Phi 7230F is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7230F by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2016
Market
Server/Workstation
Part Number
SR2X2

Xeon Phi 7230F Benchmark Scores

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No benchmark data available for this CPU.

About Intel Xeon Phi 7230F

Intel Xeon Phi 7230F: Data-Driven Insights for High-Performance Users

The Intel Xeon Phi 7230F is a beast of compute power, built on Intel's Knights Landing architecture and offering 64 cores and 256 threads for parallel-heavy workloads. For gamers, streamers, and content creators, this processor brings serious muscle for real-world scenarios like render farms, physics simulations, and AI training. While base clock sits at 1.3 GHz, the turbo boost up to 1.5 GHz means it can ramp up quickly when needed. With a 230W TDP, power efficiency is a consideration, but the sheer parallel performance can eclipse single-thread bottlenecks seen in gaming CPUs, especially in tasks that scale across many cores. Whether you're batch rendering high-poly assets or streaming multi-angle setups, the Xeon Phi 7230F delivers with brute-force multithreading and the reliability of Intel's Socket 3647 platform.

  • 64 cores and 256 threads for maximum parallel workload performance
  • 14 nm process technology for efficiency and thermal management
  • Base clock 1.3 GHz, turbo up to 1.5 GHz for extra burst capability
  • 230W TDP high-performance profile demands robust cooling
  • Socket 3647 compatibility for server-grade stability and expandability
  • Release date June 20, 2016, proven in HPC and professional rendering environments

In productivity benchmarks, the Intel Xeon Phi 7230F shines in multi-threaded applications like Blender, Maya, or Adobe Media Encoder, where it can significantly cut down render times compared to mainstream CPUs. For gamers who also dabble in content creation, the Xeon Phi’s ability to handle multiple simultaneous tasks like running a game while encoding a stream makes it attractive for power users. However, the lack of gaming-specific benchmarks means its real-world gaming performance is less clear, though its high core count could benefit future-generation titles that scale well with threads. Cost effectiveness depends heavily on use case: for pure gaming, a mainstream CPU may offer better value, but for professional workloads that leverage all 256 threads, the Xeon Phi 7230F can be a game-changer, justifying its price and power requirements.

When considering compatibility, the Intel Xeon Phi 7230F uses the Socket 3647 interface, meaning it fits into server and workstation motherboards rather than typical consumer platforms. This limits its use outside of professional and enthusiast environments that already have the infrastructure to support its power and cooling needs. The Knights Landing architecture and 14 nm process ensure stability and longevity, making it a solid investment for studios and power users who need reliable, high-throughput performance. While not designed with gaming as the primary focus, the Xeon Phi 7230F’s thread count and parallel processing prowess can still offer advantages in gaming-adjacent tasks like streaming, mod development, and running virtual machines. For those willing to invest in the ecosystem, the Xeon Phi 7230F stands out as a specialized powerhouse, blending server-grade reliability with desktop-grade accessibility for high-performance users.

The AMD Equivalent of Xeon Phi 7230F

Looking for a similar processor from AMD? The AMD Ryzen 5 1600X offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1600X

AMD • 6 Cores

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