INTEL

Intel Xeon Phi 7230

Intel processor specifications and benchmark scores

64
Cores
256
Threads
1500
GHz Boost
215W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 64C / 256T
Boost Clock 1500 GHz
Base Clock 1300 GHz
TDP 215W
Architecture Knights Landing
Socket Intel Socket 3647
nm
Process 14 nm
Released Jun 2016

Intel Xeon Phi 7230 Specifications

Xeon Phi 7230 Core Configuration

Processing cores and threading

The Intel Xeon Phi 7230 features 64 physical cores and 256 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
64
Threads
256
SMP CPUs
1

Phi 7230 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon Phi 7230 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7230 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
1500 GHz
Multiplier
13x

Intel's Xeon Phi 7230 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phi 7230 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7230's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB (per core)
L2 Cache
512 KB (per core)

Knights Landing Architecture & Process

Manufacturing and design details

The Intel Xeon Phi 7230 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7230 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Knights Landing
Codename
Knights Landing
Process Node
14 nm
Foundry
Intel
Transistors
8,000 million
Generation
Xeon Phi (Knights Landing)

Knights Landing Instruction Set Features

Supported CPU instructions and extensions

The Xeon Phi 7230 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
Intel 64

Power & Thermal

TDP and power specifications

The Intel Xeon Phi 7230 has a TDP (Thermal Design Power) of 215W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
215W

Intel Socket 3647 Platform & Socket

Compatibility information

The Xeon Phi 7230 uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 3647
Package
FC-LGA3647
DDR5

Intel Socket 3647 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phi 7230 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7230 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
ECC Memory
Supported

Product Information

Release and pricing details

The Intel Xeon Phi 7230 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7230 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2016
Market
Server/Workstation
Part Number
SR2MFSR2X3

About Intel Xeon Phi 7230

The Intel Xeon Phi 7230 is a 64-core, 256-thread server/workstation processor in the Xeon Phi generation. Built on the Knights Landing architecture and manufactured by Intel on a 14 nm process, it uses Intel Socket 3647. The data lists a base clock of 1300.00 MHz and a boost clock of 1500.00 MHz, with a TDP of 215 W. The database places it at the 50th percentile of all CPUs, but the benchmarks array is empty, the average benchmark score is 0, and no nearest rivals are listed.

Single-Thread vs Multi-Thread Behavior

The defining split for the Intel Xeon Phi 7230 is between extreme multi-thread capacity and modest single-thread speed. The processor provides 64 cores and 256 threads, making it a heavily parallel design. Its base clock is 1300.00 MHz and its boost clock is 1500.00 MHz, which are low figures for a processor expected to run single-threaded workloads quickly. The data therefore points to a part built for throughput rather than per-core latency performance.

Real workloads that can be divided into many independent tasks will benefit most from this architecture. A 256-thread processor can keep a large number of software threads active simultaneously. Workloads such as large-scale simulations, data processing, and scientific computing are the natural fit implied by the specifications. On the other hand, workloads that depend on one or two fast cores will see limited gains because the clock ceiling is only 1500.00 MHz.

The cache layout reinforces the multi-thread orientation. Each core has 32 KB of L1 cache and 512 KB of L2 cache. That per-core cache design gives each thread local data storage while reducing reliance on a shared cache. No L3 cache is listed in the data, so the record does not show a large shared cache level beyond the per-core L2. For real workloads, the practical meaning is clear: parallel scalability is the strength, and single-thread responsiveness is not.

Power and Thermals

The TDP of the Intel Xeon Phi 7230 is 215 W. That places it in the high-power server/workstation class, rather than in a low-power desktop class. A processor with a 215 W TDP requires a cooling solution capable of dissipating a substantial thermal load. The data does not include cooler specifications, but the thermal envelope implied by the TDP is one that demands robust server-style heatsinks and adequate chassis airflow.

The 14 nm process node and the 8,000 million transistor count are the process-related facts in the record. The 215 W TDP, combined with the 1300.00 MHz base clock and 1500.00 MHz boost clock, suggests that the design prioritizes many active cores operating at moderate clocks rather than a few cores running at very high frequencies. The multiplier is not unlocked, so the record indicates no user-adjustable multiplier for overclocking. The thermal design is therefore fixed around the stated 215 W envelope.

How It Compares

The nearest-rivals list for the Intel Xeon Phi 7230 is empty. Without nearestRivals data, there are no named competitor parts, no rival scores, and no deltaPct values to analyze. This section therefore cannot provide a per-rival comparison.

The only comparative metric in the data is the 50th percentile ranking versus all CPUs in the database. That places the part at the midpoint of the database population. However, because the benchmarks array is empty and the average benchmark score is 0, the percentile is not supported by measured benchmark records. No exact percentage lead or deficit can be stated for any competitor because no competitor data is present.

FAQ

Q: How many cores and threads does the Intel Xeon Phi 7230 have?

A: It has 64 cores and 256 threads.

Q: What socket does the Intel Xeon Phi 7230 use?

A: It uses Intel Socket 3647.

Q: What are the base and boost clock speeds?

A: The base clock is 1300.00 MHz and the boost clock is 1500.00 MHz.

Q: What memory type does it support?

A: It supports DDR4 memory, and ECC memory support is listed as true.

Q: What is the TDP of the Intel Xeon Phi 7230?

A: The TDP is 215 W.

Q: Does the data list an integrated graphics unit?

A: No. The integrated graphics field is empty, so no integrated graphics are listed.

Benchmark Performance

The benchmark data for the Intel Xeon Phi 7230 is currently unpopulated. The benchmarks array is empty, and the average benchmark score is 0. This means there is no measured score to compare against other processors in a quantitative way.

The only performance-position field is percentileVsAllCpus, which is 50. That places the processor at the 50th percentile of all CPUs in the database. Without actual benchmark scores behind that figure, the percentile cannot be interpreted as a verified performance result. The nearestRivals array is also empty, so no deltaPct values are available. In practice, this means that any claim of a specific percentage advantage or disadvantage relative to a rival would have no basis in the data.

Because the record lacks benchmark scores, the architectural facts become the most informative evidence: 64 cores, 256 threads, 1300.00 MHz base clock, 1500.00 MHz boost clock, and a 215 W TDP. These specifications suggest a throughput-oriented processor, but the database does not currently measure how that translates into application performance.

Platform and Compatibility

The platform story for the Intel Xeon Phi 7230 is anchored by Intel Socket 3647 and DDR4 memory support. The memory support field lists DDR4, and ECC memory support is true, which is consistent with a server/workstation part. The market segment is explicitly listed as Server/Workstation.

The PCIe field is not populated in the data, so PCIe lane and revision details are not available. The memory bus and memory bandwidth fields are also not listed, so those specifications cannot be included in this compatibility summary. The integrated graphics field is empty, meaning no built-in display output is listed for the processor.

The part number is SR2MFSR2X3. The multiplier is not unlocked, so the record does not indicate support for multiplier-based overclocking. The release date is 2016-06-19T17:00:00.000Z. Any upgrade or system build around this processor would need to match Intel Socket 3647 and DDR4 memory support. The data does not list any additional socket compatibility, so the platform path is defined by the Knights Landing architecture and the server/workstation market segment.

Who Should Consider It

The Intel Xeon Phi 7230 is aimed at workloads that can use 64 cores and 256 threads. This is not a desktop general-purpose processor in the usual sense; the market segment is Server/Workstation, and the 215 W TDP places it in a power class associated with servers and workstations.

For massively parallel compute work, the core and thread counts are the primary assets. Applications that scale across many threads can exploit the architecture’s parallel capacity. The moderate 1300.00 MHz base clock and 1500.00 MHz boost clock mean that single-thread-heavy tasks are not the target. For gaming, the data does not provide game scores, and the low clock range plus the absence of an integrated graphics unit make it an unlikely recommendation. For content creation, the key question is whether the specific application scales across many threads; if it does, the 64-core configuration may help, but if it relies on high single-thread performance, the clock speeds would not favor it.

For office and general productivity use, 256 threads are far more than those workloads typically require, and the 215 W TDP is high for an office system. The database’s empty benchmark record and 50th percentile ranking mean that this CPU should be selected on the basis of its architectural design rather than measured database scores. The strongest match is a server or workstation environment where parallel throughput is the priority and the thermal and platform requirements can be met.

Detailed benchmark scores and charts for the Intel Xeon Phi 7230 are below.

Benchmark Scores

No benchmark data available for this CPU.

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