Intel Xeon Phi 7210F
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Xeon Phi 7210F Specifications
Xeon Phi 7210F Core Configuration
Processing cores and threading
The Intel Xeon Phi 7210F features 64 physical cores and 256 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Phi 7210F Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Xeon Phi 7210F benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon Phi 7210F by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Xeon Phi 7210F Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Phi 7210F processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon Phi 7210F's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Knights Landing Architecture & Process
Manufacturing and design details
The Intel Xeon Phi 7210F is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phi 7210F incorporate advanced branch prediction and out-of-order execution for optimal performance.
Knights Landing Instruction Set Features
Supported CPU instructions and extensions
The Xeon Phi 7210F by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Power & Thermal
TDP and power specifications
The Intel Xeon Phi 7210F has a TDP (Thermal Design Power) of 230W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 3647 Platform & Socket
Compatibility information
The Xeon Phi 7210F uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 3647 Memory Support
RAM compatibility and speeds
Memory support specifications for the Phi 7210F define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon Phi 7210F determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Product Information
Release and pricing details
The Intel Xeon Phi 7210F is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon Phi 7210F by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
About Intel Xeon Phi 7210F
The Intel Xeon Phi 7210F is a 64-core, 256-thread processor built on the Knights Landing architecture, targeting the server and workstation segment. It operates at a base clock of 1300 MHz with a boost of 1500 MHz, draws a 230 W TDP, and fits the Intel Socket 3647. In this database, it holds a 50th-percentile ranking among all CPUs, though no benchmark scores are recorded for it (average benchmark score of 0). The following analysis interprets its specifications and positions it based solely on the data provided.
Benchmark Performance
The absence of recorded benchmark scores for the Xeon Phi 7210F is itself a telling data point. The average benchmark score field is 0, and the percentile sits exactly at 50, meaning this part is neither an outlier nor a top performer in the database’s aggregated rankings. Without measured scores, direct performance deltas against other CPUs cannot be quantified. However, the core and thread counts — 64 cores and 256 threads — indicate a design philosophy that prioritizes massive parallelism over raw per-core speed. The 1300 MHz base and 1500 MHz boost clocks are modest by contemporary standards, suggesting that the processor’s strength lies in workloads that can saturate all 256 threads simultaneously.
Given the lack of benchmark data, one can only infer that the 7210F would excel in heavily threaded, compute-intensive tasks such as scientific simulations, data processing, and rendering, where the sheer number of logical processors can overcome the low clock frequency. In contrast, tasks that depend on high single-thread performance would see limited benefit from this architecture. The 50th percentile placement implies that, across the entire database, this processor lands in the middle of the pack — likely because the database includes many mainstream consumer and server chips that outperform it in single-threaded scenarios, while the 7210F’s parallel capabilities are not captured by typical benchmark suites. This makes the absence of scores a notable caveat: the data does not reflect the processor’s potential in its intended many-core niche.
Single-Thread vs Multi-Thread Behavior
The clock speeds — 1300 MHz base, 1500 MHz boost — are the clearest indicators of single-thread performance. These are low figures, especially when compared to modern desktop or server processors that often exceed 3 GHz. Consequently, any workload that relies on a single core, or even a handful of cores, will likely underperform relative to mainstream CPUs. The boost clock of 1500 MHz is only a 15% increase over the base, indicating that the chip does not have significant headroom for transient frequency increases. This is typical for many-core accelerators, where power and thermal constraints limit how fast individual cores can run.
On the multi-threaded side, the 256 threads are the dominant factor. With 64 physical cores and four threads per core (a hallmark of Knights Landing’s hyper-threading implementation), the processor can theoretically handle an enormous number of concurrent operations. The cache hierarchy reinforces this design: each core has 32 KB of L1 and 512 KB of L2, but there is no L3 cache. This means that data sharing between cores must occur through the memory subsystem (DDR4) or through explicit inter-core communication. The lack of a shared L3 cache can be a bottleneck for workloads that require frequent data exchange between threads, but for embarrassingly parallel tasks where each thread works on independent data, the private caches are sufficient. The memory support for DDR4 with ECC is appropriate for server-class reliability, though the absence of memory bandwidth figures in the data prevents a deeper analysis of throughput.
The split between single-thread and multi-thread behavior is stark. For real-world workloads, this means the 7210F is a specialist tool. It will shine in applications that scale nearly linearly with thread count — for example, molecular dynamics, weather modeling, or financial risk analysis — but it will struggle with typical desktop tasks like web browsing, office productivity, or even gaming, where single-thread performance is critical. The 50th percentile ranking likely reflects this bifurcation: the processor’s aggregate score across all benchmark types is average, but its performance profile is highly uneven.
Power and Thermals
The 7210F carries a TDP of 230 W. This is a substantial power envelope, placing it in the high-end server/workstation tier. For cooling, this implies a robust solution — a large air cooler or a liquid cooling loop capable of dissipating over 200 W of heat. The 14 nm process node (with 8,000 million transistors) suggests a mature manufacturing technology, but the sheer number of cores (64) and threads (256) drives the power consumption upward. The low clock speeds help mitigate power draw; if the chip ran at higher frequencies, the TDP would be even larger. The 230 W figure is a fixed specification, so system integrators must ensure that the motherboard’s VRM and the chassis cooling can handle this load. Given the socket (Intel Socket 3647) and the server/workstation market segment, the 7210F is intended for platforms that already support high-power processors, such as dual-socket servers or high-end workstations. The absence of an integrated graphics unit means that the entire thermal budget is dedicated to the CPU cores, which is typical for compute-focused parts.
The TDP also has implications for operating costs and system design. A 230 W processor requires a power supply with sufficient headroom, and the thermal output will affect the ambient temperature of the data center or workstation room. However, the data pack does not provide efficiency metrics or comparison points, so a deeper analysis is not possible. What is clear is that the 7210F is not a low-power part; it demands a serious cooling infrastructure to sustain peak performance.
How It Compares
The nearestRivals field in the data pack is empty, meaning no direct competitor comparisons are available for the Xeon Phi 7210F. Consequently, this section cannot name specific rival processors or cite performance deltas. Instead, we can assess its position based on the available attributes. The 50th percentile ranking places it exactly at the median of all CPUs in the database. This suggests that, in aggregate, it performs no better or worse than half of the processors listed. However, this ranking is likely skewed by the absence of benchmark scores — the 0 average score implies that the processor may not have been subjected to the same test suite as other parts, or that its scores were not recorded. Therefore, the percentile should be interpreted with caution.
What can be said is that the 7210F’s architecture is distinct from typical server CPUs. Most server processors in the same socket generation have fewer cores (e.g., 8 to 28) but higher clock speeds and larger shared caches. The 7210F’s 64 cores and 256 threads are an order of magnitude higher in thread count, but its clock speeds are less than half of many competitors. This trade-off is intentional: the Knights Landing design targets highly parallel throughput, not low-latency single-thread execution. Without rival names, we cannot quantify how much faster or slower it is, but the specifications alone suggest that it occupies a niche that few other processors fill. The lack of L3 cache and the reliance on DDR4 memory (with no bandwidth figure) further differentiate it from mainstream server parts that typically feature large shared L3 caches and high-speed memory interfaces. In the database, it stands alone, and any comparison must be made qualitatively based on core count, clock speed, and power.
Who Should Consider It
Given the specifications, the Xeon Phi 7210F is suited for workloads that can leverage its massive thread count. Specifically, applications that are highly parallel and can scale to 256 threads — such as computational fluid dynamics, finite element analysis, molecular modeling, and large-scale data analytics — would benefit from the 64 cores. The 230 W TDP and low clock speeds mean that the processor is not ideal for interactive or latency-sensitive tasks. For gaming, the low single-thread performance and absence of integrated graphics would make it a poor choice; even with a discrete GPU, the CPU would bottleneck most modern games. Similarly, office productivity applications (word processing, spreadsheets, web browsing) are predominantly single-threaded and would run slower on this chip than on a mainstream desktop processor. The 7210F is also not suitable for typical consumer workloads where energy efficiency and per-core speed matter.
Instead, it belongs in server racks or specialized workstations where the workload is known to be massively parallel and where the ability to run many threads simultaneously outweighs the cost of high power consumption and low clock speeds. For researchers running batch jobs that can be parallelized across hundreds of threads, the 7210F offers a path to significant throughput — provided the software is written to exploit its 256 threads. The 50th percentile ranking suggests that, in a general-purpose benchmark suite, it does not stand out, but that is not its intended use case. The data pack does not include memory bandwidth or PCIe details, so system-level performance cannot be fully assessed, but the core and thread counts are the primary decision points. If a workload can saturate 256 threads and tolerate the 230 W power draw, the 7210F is a viable option; otherwise, a lower-core-count, higher-clock processor would be more appropriate. The lack of benchmark scores in the database means that any purchasing decision should rely on application-specific testing, not on the aggregated percentile.
Detailed benchmark scores and charts for the Intel Xeon Phi 7210F are below.
Benchmark Scores
No benchmark data available for this CPU.
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