INTEL

Intel Xeon MP 3.0

Intel processor specifications and benchmark scores

1
Cores
2
Threads
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GHz Boost
85W
TDP
๐Ÿ›ก๏ธECC Memory

Intel Xeon MP 3.0 Specifications

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Xeon MP 3.0 Core Configuration

Processing cores and threading

The Intel Xeon MP 3.0 features 1 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
2
SMP CPUs
4
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MP 3.0 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon MP 3.0 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon MP 3.0 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3 GHz
Boost Clock
N/A
Multiplier
30x
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Intel's Xeon MP 3.0 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the MP 3.0 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon MP 3.0's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
8 KB
L2 Cache
512 KB
L3 Cache
4 MB
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NetBurst Architecture & Process

Manufacturing and design details

The Intel Xeon MP 3.0 is built on Intel's 130 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in MP 3.0 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
NetBurst
Codename
Gallatin
Process Node
130 nm
Foundry
Intel
Die Size
269 mmยฒ
Generation
Xeon (Gallatin)
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NetBurst Instruction Set Features

Supported CPU instructions and extensions

The Xeon MP 3.0 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
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MP 3.0 Power & Thermal

TDP and power specifications

The Intel Xeon MP 3.0 has a TDP (Thermal Design Power) of 85W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
85W
Tj Max
71ยฐC
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Intel Socket 604 Platform & Socket

Compatibility information

The Xeon MP 3.0 uses the Intel Socket 604 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 604
Package
ยตPPGA603
DDR5

Intel Socket 604 Memory Support

RAM compatibility and speeds

Memory support specifications for the MP 3.0 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon MP 3.0 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR1
ECC Memory
Supported
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Xeon MP 3.0 Product Information

Release and pricing details

The Intel Xeon MP 3.0 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon MP 3.0 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2004
Market
Server/Workstation
Status
End-of-life
Part Number
SL79V

Xeon MP 3.0 Benchmark Scores

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No benchmark data available for this CPU.

About Intel Xeon MP 3.0

The Intel Xeon MP 3.0 by Intel is a fascinating artifact of early 2000s server architecture, built on the 130nm "Gallatin" core. This single-core processor leverages Hyper-Threading to deliver two threads, a significant feature for its era designed to improve workload throughput on a then-mature process node. Its defining characteristic is a substantial 4MB of on-die L3 cache, a premium addition aimed at accelerating data access for demanding multi-processor configurations. Socket 604 platforms provided the foundation for scalable systems, though the 85W TDP reflects the thermal cost of such integration on this process. What trade-offs did Intel make to integrate that large cache, and how did it shape the performance profile for database and enterprise applications at the time? The chip design prioritizes server stability and cache-sensitive workloads over raw clock speed advancements seen in desktop counterparts.

Without specific benchmark scores, how can we gauge the performance of the Intel Xeon MP 3.0? Its competitive positioning was squarely against other single and dual-core server offerings from AMD's Opteron line, which introduced integrated memory controllers. For optimal pairing, system builders would consider:

  1. Multi-socket (4P or 8P) server motherboards to leverage its MP design for scalability.
  2. Registered ECC DDR memory to ensure data integrity in critical environments.
  3. Robust server chassis cooling to manage the thermal load of multiple CPUs.
  4. Legacy Windows Server 2003 or contemporary Linux distributions for OS support.
  5. Workloads like legacy file serving, static web hosting, or period-correct database applications.
Was it ultimately a stopgap solution before the industry's shift to multi-core designs? Its value was in extending the life of a platform architecture, offering a cache-rich path for enterprises before the dual-core revolution took hold.

The AMD Equivalent of Xeon MP 3.0

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD โ€ข 4 Cores

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