INTEL

Intel Xeon E7430

Intel processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
90W
TDP
Integrated GPU ECC Memory

At a Glance

Intel
Cores / Threads 4C / 4T
Base Clock 2.13 GHz
L3 Cache 12 MB (shared)
TDP 90W
Architecture Core 2
Socket Intel Socket 604
nm
Process 45 nm
Released Sep 2008

Intel Xeon E7430 Specifications

Xeon E7430 Core Configuration

Processing cores and threading

The Intel Xeon E7430 features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
4

E7430 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon E7430 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon E7430 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.13 GHz
Boost Clock
N/A
Multiplier
8x

Intel's Xeon E7430 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the E7430 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon E7430's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
3 MB (per module)
L3 Cache
12 MB (shared)

Core 2 Architecture & Process

Manufacturing and design details

The Intel Xeon E7430 is built on Intel's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in E7430 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Core 2
Codename
Dunnington
Process Node
45 nm
Foundry
Intel
Transistors
1,900 million
Die Size
503 mm²
Generation
Xeon MP (Dunnington)

Core 2 Instruction Set Features

Supported CPU instructions and extensions

The Xeon E7430 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
Intel 64
VT-x

Power & Thermal

TDP and power specifications

The Intel Xeon E7430 has a TDP (Thermal Design Power) of 90W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
90W

Intel Socket 604 Platform & Socket

Compatibility information

The Xeon E7430 uses the Intel Socket 604 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 604
Package
FC-PGA
DDR5

Intel Socket 604 Memory Support

RAM compatibility and speeds

Memory support specifications for the E7430 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon E7430 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2, DDR3
Memory Bus
Quad-channel
Memory Bandwidth
21.3 GB/s
ECC Memory
Supported

Intel's Xeon E7430 Integrated Graphics

Built-in GPU specifications

The Intel Xeon E7430 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the E7430 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Product Information

Release and pricing details

The Intel Xeon E7430 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon E7430 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2008
Launch Price
$1391
Market
Server/Workstation
Status
End-of-life
Part Number
SLG9H

About Intel Xeon E7430

The Intel Xeon E7430 is a server/workstation processor built by Intel for the Intel Socket 604 platform. It belongs to the Xeon MP (Dunnington) generation, uses the Core 2 architecture, and is manufactured by Intel on a 45 nm process. The processor has 4 cores and 4 threads, a 2.13 GHz base clock, and no listed boost clock. It carries a 90 W TDP and supports DDR2 and DDR3 memory on a quad-channel bus with 21.3 GB/s of memory bandwidth. The die contains 1,900 million transistors on a 503 mm² die. It was released on September 14, 2008, and the launch MSRP was $1391. The database places it at the 50th percentile of all CPUs, while the benchmark array is empty and the average benchmark score is 0.

Who Should Consider It

The market segment for this part is Server/Workstation, so the intended environment is a server or workstation rather than a consumer desktop. With 4 cores and 4 threads, the E7430 fits workloads that do not need large amounts of parallel thread execution. The 12 MB shared L3 cache provides a sizeable common cache pool, and ECC memory support points toward data-integrity-sensitive server tasks.

For gaming, no gaming benchmark scores are recorded in the data. The server/workstation segment and the 4-thread design indicate that it is not a gaming-oriented processor. The database fields do not contain any gaming results, so a gaming recommendation cannot be grounded in measured scores.

For office productivity, the 2.13 GHz base clock and four threads provide a basic execution structure. The memory support for DDR2 and DDR3, quad-channel operation, and ECC capability are server-class features rather than consumer office platform traits. No office benchmark scores are listed, so the assessment is based on the core and thread counts.

For creation workloads, the four-thread ceiling limits multithreaded creation tasks. The 21.3 GB/s quad-channel memory bus and the 12 MB shared L3 cache may help with memory-heavy work, but any workload that scales beyond four threads will be constrained by the 4-core, 4-thread configuration.

The 50th percentile position in the database places the E7430 in the middle of all CPUs in the dataset. That midpoint ranking, combined with the end-of-life production status, suggests a mid-range legacy processor rather than a high-end current part.

Power and Thermals

The TDP is 90 W. In cooling-tier terms, this is a moderate power envelope, and a capable air cooler is appropriate for the thermal load implied by that figure.

The 45 nm process node, the 1,900 million transistor count, and the 503 mm² die size are all part of the same record, providing context for the 90 W TDP. The chip is built on a 45 nm Intel process, while the die is physically large at 503 mm². Those figures, taken with the 90 W TDP, define the power and thermal profile.

There is no boost clock listed in the data, so the 2.13 GHz base clock is the only frequency available for estimating power behavior. The production status is end-of-life, but the TDP figure remains 90 W, and no alternative power specification is present in the database.

Benchmark Performance

The benchmark performance section of this record is defined by data absence. The benchmarks array is empty, meaning no workload scores are stored for the E7430. The nearestRivals array is also empty, so there are no rival names, rival scores, or deltaPct values to compare.

Because no nearest rivals are listed, exact percentage deltas cannot be computed. Statements such as “30% ahead of a rival” are not supportable from this dataset. The only performance-placement field available is percentileVsAllCpus, which is 50. This places the E7430 at the midpoint of the CPU distribution in the database.

The average benchmark score is 0, which is consistent with an empty benchmark array rather than a measured performance result. Without workload scores, architectural specifications must stand in for benchmark data: 4 cores, 4 threads, a 2.13 GHz base clock, 64 KB of L1 cache per core, 3 MB of L2 cache per module, and 12 MB of shared L3 cache.

FAQ

Q: What socket does the Intel Xeon E7430 use?

A: The E7430 uses the Intel Socket 604.

Q: What memory types does the E7430 support?

A: It supports DDR2 and DDR3 memory. The memory bus is quad-channel, and memory bandwidth is listed at 21.3 GB/s. ECC memory support is also listed.

Q: Does the E7430 include integrated graphics?

A: Integrated graphics is listed as “On certain motherboards (Chipset feature).” This indicates that graphics capability depends on the motherboard chipset rather than being a standard part of the CPU package.

Q: Is the CPU multiplier unlocked?

A: No. The multiplierUnlocked field is false, so the multiplier is not unlocked.

Q: What is the cache hierarchy of the E7430?

A: The L1 cache is 64 KB per core, the L2 cache is 3 MB per module, and the L3 cache is 12 MB shared across the chip.

Q: When was the E7430 released, and is it still in production?

A: The release date is September 14, 2008, and the production status is end-of-life.

Platform and Compatibility

The E7430 is a Socket 604 processor. It is part of the Xeon MP (Dunnington) generation and uses the Core 2 architecture. The 45 nm process node is part of the platform record, along with the Intel foundry.

Memory support covers DDR2 and DDR3, with a quad-channel memory bus and 21.3 GB/s of memory bandwidth. ECC memory support is enabled in the data. The pcie field is null, so no PCIe lane specification is included in this record.

Integrated graphics is listed as “On certain motherboards (Chipset feature),” meaning graphics functionality is tied to the chipset rather than the processor die. The multiplierUnlocked field is false, so overclocking is not an intended capability. The part number is SLG9H.

The production status is end-of-life, and the release date is September 14, 2008. Because the socket is Intel Socket 604 and the product is end-of-life, the upgrade path is constrained to legacy Socket 604 server/workstation platforms. No specific upgrade options are listed in the data.

Single-Thread vs Multi-Thread Behavior

The E7430 has 4 cores and 4 threads, so the thread count matches the core count exactly. In this data, that means one thread per core.

The listed base clock is 2.13 GHz, and no boost clock is provided. There is therefore no separate higher single-core frequency recorded for lightly threaded workloads.

Single-thread behavior is tied to the 2.13 GHz base clock, the per-core 64 KB L1 cache, and the Core 2 architecture. The per-core L1 cache provides a low-latency working area for each core, while the module-level L2 cache is 3 MB per module.

Multi-thread behavior is capped at four threads. Workloads using all four threads can access the 12 MB shared L3 cache, which provides a common pool for data shared across cores. The 3 MB L2 per module sits between the per-core L1 and the shared L3 in the cache hierarchy.

Because the thread count equals the core count, there are no virtual threads listed for additional parallel work. The 50th percentile position in the database is consistent with a mid-range processor whose single-thread and multi-thread capabilities are both shaped by the 2008-era architecture and the 4-thread configuration.

Detailed benchmark scores and charts for the Intel Xeon E7430 are below.

Benchmark Scores

No benchmark data available for this CPU.

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