INTEL

Intel Xeon 6979P

Intel processor specifications and benchmark scores

120
Cores
240
Threads
3.9
GHz Boost
500W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 120C / 240T
Boost Clock 3.9 GHz
Base Clock 2.1 GHz
L3 Cache 504 MB (shared)
TDP 500W
Architecture Granite Rapids
Socket Intel Socket 7529
nm
Process 5 nm
Released Sep 2024

Intel Xeon 6979P Specifications

Xeon 6979P Core Configuration

Processing cores and threading

The Intel Xeon 6979P features 120 physical cores and 240 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
120
Threads
240
SMP CPUs
2

6979P Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon 6979P benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 6979P by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.1 GHz
Boost Clock
3.9 GHz
All-Core Turbo
3.2 GHz
Multiplier
21x

Intel's Xeon 6979P Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 6979P processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 6979P's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
112 KB (per core)
L2 Cache
2 MB (per core)
L3 Cache
504 MB (shared)

Granite Rapids Architecture & Process

Manufacturing and design details

The Intel Xeon 6979P is built on Intel's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 6979P incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Granite Rapids
Codename
Granite Rapids
Process Node
5 nm
Foundry
Intel
Die Size
3x 598 mm²
Generation
Xeon 6 (Granite Rapids-AP)

Granite Rapids Instruction Set Features

Supported CPU instructions and extensions

The Xeon 6979P by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
SHA
AES-NI
F16C
BMI1
BMI2
AMX
Intel 64
VT-x
VT-d

6979P Power & Thermal

TDP and power specifications

The Intel Xeon 6979P has a TDP (Thermal Design Power) of 500W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
500W
Tj Max
95°C

Intel Socket 7529 Platform & Socket

Compatibility information

The Xeon 6979P uses the Intel Socket 7529 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 7529
PCIe
Gen 5, 96 Lanes(CPU only)
Package
FC-LGA18N
DDR5

Intel Socket 7529 Memory Support

RAM compatibility and speeds

Memory support specifications for the 6979P define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 6979P determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Twelve-channel
Memory Bandwidth
614.4 GB/s
ECC Memory
Supported

Xeon 6979P Product Information

Release and pricing details

The Intel Xeon 6979P is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 6979P by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2024
Launch Price
$11025
Market
Server/Workstation
Status
Active
Part Number
SRPKZ
Bundled Cooler
None

Xeon 6979P Benchmark Scores

No benchmark data available for this CPU.

About Intel Xeon 6979P

The Intel Xeon 6979P is an Intel server/workstation processor from the Xeon 6 (Granite Rapids-AP) generation, using the Granite Rapids architecture. The record lists 120 cores and 240 threads, a 2.10 GHz base clock, a 3.90 GHz boost clock, and a TDP of 500. It is built for Intel Socket 7529, fabricated on Intel’s 5 nm process, and implemented with a 3x 598 mm² die configuration. The database entry contains no benchmark scores, an average benchmark score of 0, a 50th-percentile rank, and an empty nearestRivals list, so direct performance comparisons are limited to what the specification fields can indicate.

Benchmark Performance

Benchmark entries are absent from the FACT PACK. The avgBenchmarkScore field records 0, and percentileVsAllCpus records 50. In isolation, a zero score combined with a 50th-percentile rank is internally inconsistent, which strongly suggests the benchmark portion of this entry is unfilled. No nearestRivals data exists, so there are no deltaPct values to quote; any percentage comparison with another processor would require data not present in this record.

The only benchmark-adjacent facts available are the physical and logical configuration: 120 cores, 240 threads, 504 MB of shared L3, and a twelve-channel DDR5 memory path. Those specifications point toward a throughput-oriented part, but the record does not provide measured scores to confirm workload performance. The percentileVsAllCpus value of 50 is the single positional data point, yet without an associated score it cannot be used to infer a real ranking. The benchmark section of this entry is therefore best read as a placeholder until score data is linked to the part.

Power and Thermals

The power data is limited to one field: TDP 500. No cooler specifications, temperatures, or measured power-consumption numbers appear in the FACT PACK. A TDP of 500 places this processor in a thermal class that requires a cooling solution capable of handling that sustained thermal load, and the market segment field of Server/Workstation reinforces the expected use environment.

The die size is recorded as 3x 598 mm², which describes a multi-die layout; the record provides no per-die thermal data. The production status is Active, and the release date is 2024-09-23, so this is a current part in the dataset. Without additional thermal measurements, the practical guidance is to design for the 500 TDP envelope and validate using platform thermal probes. The FACT PACK cannot state what cooler size or airflow is sufficient.

Platform and Compatibility

The socket is Intel Socket 7529. The architecture and codename are both Granite Rapids, and the generation field is Xeon 6 (Granite Rapids-AP); the series field is null. The part is manufactured by Intel on a 5 nm node, with a die size of 3x 598 mm². Memory support is DDR5 across a twelve-channel bus, and the memory bandwidth is recorded as 614.4 GB/s. ECC memory is supported.

PCIe connectivity is Gen 5 with 96 lanes from the CPU only. No integrated graphics is listed. The multiplier is locked. The production status is Active, the release date is 2024-09-23, and the part number is SRPKZ. The launch MSRP is $11025.

Upgrade path implications follow from the socket and generation: compatibility depends on Intel Socket 7529. The FACT PACK does not list compatible chipsets or other Socket 7529 processors, so no broader platform roadmap can be derived from this record. The twelve-channel memory bus and 96 PCIe lanes define the platform’s expansion envelope: main memory traffic is served by a wide DDR5 implementation, while add-in devices rely on PCIe Gen 5 lanes. ECC support is appropriate for server memory reliability. The locked multiplier means frequency adjustment is not an intended user feature.

FAQ

Q: How many cores and threads does the Intel Xeon 6979P have?

A: It has 120 cores and 240 threads.

Q: What are its clock speeds?

A: The base clock is 2.10 GHz, and the boost clock is 3.90 GHz.

Q: What is the cache configuration?

A: The cache fields list 112 KB of L1 per core, 2 MB of L2 per core, and 504 MB of shared L3.

Q: Which memory and PCIe capabilities are recorded?

A: It supports DDR5 over a twelve-channel memory bus with 614.4 GB/s of bandwidth, ECC memory, and PCIe Gen 5 with 96 lanes from the CPU only.

Q: Does the processor include integrated graphics?

A: No, the integratedGraphics field is null, so no integrated graphics is recorded.

Q: What is the thermal design power?

A: The TDP is 500.

Who Should Consider It

The benchmark fields are empty, so this recommendation is based on the specification record rather than measured scores. The most defining number is 120 cores and 240 threads; a workload has to be highly parallel to use that many logical processors effectively. The 504 MB shared L3 and 614.4 GB/s memory bandwidth are the resources that keep those cores occupied with data.

The market segment field says Server/Workstation, so the intended workload class is parallel server/workstation processing rather than consumer or desktop tasks. For gaming, there are no gaming scores in the record, so a gaming assessment cannot be grounded here. For creation or office work, the same limitation applies: no creator or office benchmark data exists in the FACT PACK.

The base clock of 2.10 GHz and boost clock of 3.90 GHz show a chip that can raise frequency for burst activity, but its primary identity is multi-core throughput. Anyone considering this part should be planning for workloads that can consume 240 threads and the 614.4 GB/s memory path.

Single-Thread vs Multi-Thread Behavior

Single-thread performance in this record is represented only by the clock frequencies: 2.10 GHz base and 3.90 GHz boost. The range between those values is the frequency envelope available to a lightly loaded core. Multi-thread performance is represented by 120 cores, 240 threads, 504 MB of shared L3, and 614.4 GB/s of memory bandwidth. Those are the numbers that define the multi-thread resources.

A single-thread workload can only access a small slice of the silicon, so the 3.90 GHz boost clock is the relevant upper bound. A multithread workload can spread across all 240 threads, but it requires substantial memory bandwidth to feed them. The 112 KB L1 and 2 MB L2 per core provide per-core data locality, while the 504 MB L3 is the shared staging area for coarser working sets.

Since no single-thread or multi-thread benchmark scores are present in the record, the exact split between those behaviors cannot be quantified. Nevertheless, the core count and memory bandwidth reveal the intended workload shape: many parallel threads rather than one high-frequency thread.

How It Compares

The nearestRivals array is empty. There are no rival names, rival scores, or deltaPct values to report from the FACT PACK. The only relational field is percentileVsAllCpus, which is 50, but it is not tied to any named competitor.

Because the record includes no nearestRivals data, any comparison against a specific rival processor would require information outside this pack. The empty benchmark array compounds the issue: without measured scores, a percentage delta cannot be calculated even if a rival were named. The Xeon 6979P’s relative position is therefore undefined in this dataset.

The AMD Equivalent of Xeon 6979P

Looking for a similar processor from AMD? The AMD Ryzen 5 7533HS offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 7533HS

AMD • 6 Cores

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