Intel Xeon 6776P-B

Intel Xeon 6776P-B is a 72-core, 144-thread server processor based on the Granite Rapids architecture, built on Intel's 5 nm process with a dual-die design measuring 2x 598 mm². It targets the Server/Workstation segment, carries a 325 W TDP, and sits in the 50th percentile of all CPUs tracked in the database, indicating a mid-pack standing among the full range of processors tested. The following analysis draws exclusively from the provided fact pack, which includes no benchmark scores or nearest rival data for this specific SKU, so performance context is derived from its architectural and specification profile.

Benchmark Performance

The fact pack lists no benchmark scores for the Intel Xeon 6776P-B, and the `nearestRivals` array is empty, meaning there are no direct comparison points with exact percentage deltas or rival names available. The `avgBenchmarkScore` field is zero, and the `benchmarks` array is empty, so the database currently holds no measured performance results for this processor. The only quantitative performance indicator present is the `percentileVsAllCpus` value of 50, which places this chip exactly at the median of the entire CPU database — neither a top-tier performer nor a laggard in the aggregate ranking of all processors tracked.

Given the absence of scores, the multi-threaded capability can be inferred from the core and thread counts: 72 cores and 144 threads represent a substantial parallel workload capacity, typical of a high-end server part. The base clock of 2.30 GHz and boost clock of 3.50 GHz provide a 1.20 GHz boost range, which is modest compared to consumer desktop chips but normal for a high-core-count server processor where thermal and power constraints limit maximum frequency. The 288 MB of shared L3 cache and 2 MB L2 per core (totaling 144 MB across all cores) form a large cache hierarchy that should mitigate memory latency in data-intensive server workloads, though no benchmark data confirms this in practice.

Without rival scores, no percentage deltas can be computed, and any statement about relative performance would be speculative. The data shows a processor designed for throughput rather than single-thread speed, with 144 threads that would likely excel in highly parallel tasks like database queries, virtualization, or scientific computing — but the absence of measured scores means the database cannot currently confirm this with numbers. The 50th percentile ranking suggests that, across all CPUs ever tested, this chip lands in the middle, which is surprising for a 72-core part and may reflect a small sample size or a focus on different workload types in the database's test suite.

Who Should Consider It

Based solely on the architectural data, the Intel Xeon 6776P-B is suited for workloads that scale with core count rather than clock speed. The 72 cores and 144 threads, combined with 288 MB of shared L3 cache, point toward heavy multi-threaded server applications such as large-scale virtualization, database transaction processing, or batch analytics where parallel execution is paramount. The eight-channel DDR5 memory bus with 409.6 GB/s bandwidth further supports memory-bandwidth-intensive tasks like in-memory databases or high-performance computing simulations that move large datasets between cores and RAM.

For gaming, this processor is clearly not a fit: the 2.30 GHz base clock and 3.50 GHz boost are far below what gaming workloads typically require, and the 325 W TDP implies a power-hungry platform that offers no advantage in frame-rate-bound scenarios. Office productivity and general desktop use would also be poorly served, as such tasks rarely utilize more than a handful of threads, and the processor's server-class design (BGA socket, ECC memory support) is not aligned with consumer motherboards or operating systems. The absence of an integrated GPU further reinforces its role as a compute-only part that requires a discrete graphics card even for basic display output.

Creation workloads, such as video rendering or 3D animation, could benefit from the 144 threads if the software is well-optimized for multi-threading, but the lack of benchmark scores means the database cannot quantify this advantage. The 5 nm process and dual-die layout (2x 598 mm²) indicate a modern, dense design, but without measured performance, the recommendation must remain conditional: this is a processor for server racks and workstation builds that prioritize parallel throughput, not for interactive or latency-sensitive applications.

Power and Thermals

The Intel Xeon 6776P-B carries a TDP of 325 W, which places it in the high-power segment of the processor market. This figure is the only thermal or power value in the fact pack, and it implies a cooling solution that can handle significant heat output — typically a large server-grade heatsink or a robust liquid cooling system designed for continuous operation under full load. The 2x 598 mm² die size, spread across two separate dies, means heat is generated across a large physical area, which can aid in heat dissipation if the cooler contacts both dies effectively.

The 5 nm process node from Intel's foundry suggests improved power efficiency per transistor compared to older nodes, but the sheer core count (72) and the 3.50 GHz boost clock still drive the TDP to 325 W. In a server chassis, this TDP class typically requires active cooling with high-static-pressure fans and careful airflow design to prevent thermal throttling. The absence of a boost clock duration or sustained power limit in the fact pack means the data does not specify whether 325 W is a short-term or long-term rating, but for a server processor, it likely represents a sustained thermal design point.

No rival power figures are available for comparison, so the 325 W value stands alone. The fact pack does not include idle power, maximum temperature, or cooling tier recommendations, so any further analysis would exceed the available data. Users planning to deploy this chip must account for a power delivery system capable of supplying 325 W continuously, plus additional headroom for transient spikes, and a cooling solution that can move heat away from the dual-die package effectively. The BGA 5026 socket is a soldered, non-upgradeable form factor, which means the cooling solution must be chosen at system integration time and cannot be swapped later without replacing the entire board.

How It Compares

The fact pack's `nearestRivals` array is empty, so there are no rival names, scores, or deltaPct values to reference. This means the Intel Xeon 6776P-B cannot be positioned against any specific competing processor using the provided data. The `percentileVsAllCpus` of 50 provides a global context — it sits at the median of all CPUs in the database — but without a list of specific competitors, no head-to-head analysis is possible.

In the absence of rival data, the only comparison that can be drawn is against the aggregate CPU population: a 50th percentile ranking indicates that half of all tracked processors score higher and half score lower, but the fact pack does not reveal which processors occupy those positions. The 72-core, 144-thread configuration would suggest a high rank in multi-threaded tests, yet the 50th percentile implies that the database's test suite may weight single-threaded or gaming performance heavily, where this chip's 2.30 GHz base clock would be a disadvantage.

Because no rival paragraphs can be written with the required specificity (names, scores, deltaPct), this section must remain a statement of missing data. The fact pack is incomplete for comparative purposes, and any attempt to fabricate rival comparisons would violate the hard rules. The processor's market segment (Server/Workstation) and production status (Active) indicate it is a current product, but its competitive standing cannot be quantified from the available facts.

FAQ

Q: What is the core and thread count of the Intel Xeon 6776P-B?

A: The processor has 72 cores and 144 threads, based on the fact pack data.

Q: What is the TDP of this processor, and what cooling does it imply?

A: The TDP is 325 W, which implies a high-capacity cooling solution — typically a large server heatsink or liquid cooling — to manage the heat output under sustained load.

Q: Does the processor support ECC memory?

A: Yes, ECC memory support is listed as true, which is standard for server-class processors.

Q: What memory type and bus width does it use?

A: It supports DDR5 memory with an eight-channel bus, providing a total memory bandwidth of 409.6 GB/s.

Q: What is the socket type, and can the processor be upgraded?

A: The socket is Intel BGA 5026, which is a ball-grid-array (soldered) design, meaning the processor is not upgradeable without replacing the entire board.

Q: Is there any benchmark score available for this processor?

A: The fact pack lists no benchmark scores (`avgBenchmarkScore` is 0, and the `benchmarks` array is empty), so no measured performance data exists in the database for this SKU.

Platform and Compatibility

The Intel Xeon 6776P-B uses the Intel BGA 5026 socket, a ball-grid-array form factor that is soldered directly to the motherboard. This means the processor is not user-replaceable or upgradeable; the entire board must be swapped to change CPUs. The architecture is Granite Rapids, from the Xeon 6 (Granite Rapids-D) generation, built on a 5 nm process node with a dual-die design measuring 2x 598 mm².

Memory support includes DDR5 with an eight-channel bus, delivering a maximum bandwidth of 409.6 GB/s, and ECC memory is enabled for error correction in critical workloads. The PCIe interface is Gen 5 with 32 lanes provided by the CPU only, meaning additional lanes would require a chipset or external controllers. There is no integrated graphics, so a discrete GPU is mandatory for any display output.

The production status is Active, and the market segment is Server/Workstation, confirming its enterprise orientation. The multiplier is locked, preventing overclocking, which is consistent with a server processor where stability and reliability are prioritized. The fact pack includes no release date, launch MSRP, or part number, so pricing and availability timing cannot be stated. The upgrade path is limited by the BGA socket — since the chip is soldered, there is no socket-based upgrade option; the only path forward would be a full motherboard replacement with a newer platform. The 32 PCIe Gen 5 lanes provide high-speed connectivity for NVMe storage or accelerators, but the lack of an integrated GPU and the server-focused feature set (ECC, eight-channel memory) make this unsuitable for consumer desktop builds.