INTEL

Intel Xeon 6768P-B

Intel processor specifications and benchmark scores

64
Cores
128
Threads
3.5
GHz Boost
325W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 64C / 128T
Boost Clock 3.5 GHz
Base Clock 2.2 GHz
L3 Cache 256 MB (shared)
TDP 325W
Architecture Granite Rapids
Socket Intel BGA 5026
nm
Process 5 nm
Released Dec 2025

Intel Xeon 6768P-B Specifications

Xeon 6768P-B Core Configuration

Processing cores and threading

The Intel Xeon 6768P-B features 64 physical cores and 128 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
64
Threads
128
SMP CPUs
1

6768P-B Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon 6768P-B benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 6768P-B by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
3.5 GHz
All-Core Turbo
3.3 GHz
Multiplier
22x

Intel's Xeon 6768P-B Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 6768P-B processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 6768P-B's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
112 KB (per core)
L2 Cache
2 MB (per core)
L3 Cache
256 MB (shared)

Granite Rapids Architecture & Process

Manufacturing and design details

The Intel Xeon 6768P-B is built on Intel's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 6768P-B incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Granite Rapids
Codename
Granite Rapids
Process Node
5 nm
Foundry
Intel
Die Size
2x 598 mm²
Generation
Xeon 6 (Granite Rapids-D)

Granite Rapids Instruction Set Features

Supported CPU instructions and extensions

The Xeon 6768P-B by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
SHA
AES-NI
F16C
BMI1
BMI2
AMX
Intel 64
VT-x
VT-d

6768P-B Power & Thermal

TDP and power specifications

The Intel Xeon 6768P-B has a TDP (Thermal Design Power) of 325W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
325W

Intel BGA 5026 Platform & Socket

Compatibility information

The Xeon 6768P-B uses the Intel BGA 5026 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 5026
PCIe
Gen 5, 32 Lanes(CPU only)
Package
FC-BGA18N
DDR5

Intel BGA 5026 Memory Support

RAM compatibility and speeds

Memory support specifications for the 6768P-B define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 6768P-B determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Eight-channel
Memory Bandwidth
409.6 GB/s
ECC Memory
Supported

Xeon 6768P-B Product Information

Release and pricing details

The Intel Xeon 6768P-B is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 6768P-B by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Dec 2025
Market
Server/Workstation
Status
Active
Part Number
unknown
Bundled Cooler
None

Xeon 6768P-B Benchmark Scores

No benchmark data available for this CPU.

About Intel Xeon 6768P-B

Intel Xeon 6768P-B is a 64-core, 128-thread server processor built on Intel’s Granite Rapids architecture, manufactured on a 5 nm process with a dual-die design totaling 2x 598 mm². It targets the Server/Workstation segment with a 325 W TDP, DDR5 memory support across an eight-channel bus, and 32 PCIe Gen 5 lanes from the CPU. The processor sits at the 50th percentile among all CPUs in the database, indicating a mid-pack standing in aggregate benchmark terms, though its core configuration suggests a specific workload orientation rather than a general-purpose leader.

Benchmark Performance

The benchmark data for this processor is sparse, with no direct scores recorded in the database and no nearest rivals listed to anchor comparisons. The percentileVsAllCpus field places it at 50, meaning half of all tracked CPUs score above it and half below in the aggregate metric. This is an unusual position for a 64-core part, as most high-core-count server chips cluster near the top of the distribution. The absence of nearestRivals data prevents a precise delta analysis against specific competitors, but the 50th percentile implies that raw multi-core throughput is not the defining strength here, or that the benchmark pool is heavily weighted toward consumer parts with higher single-thread performance.

The processor’s base clock of 2.20 GHz and boost clock of 3.50 GHz are modest for a modern Xeon, particularly when compared to flagship parts in the same architecture family that often reach higher boost frequencies. The 256 MB shared L3 cache is substantial, which often aids in cache-sensitive workloads like database queries or in-memory analytics, but the mid-pack percentile suggests that cache alone does not overcome clock limitations in the aggregate benchmark. Without rival scores, the data indicates a processor designed for sustained throughput in parallel tasks rather than peak performance in lightly threaded scenarios.

Single-Thread vs Multi-Thread Behavior

The split between single-thread and multi-thread performance is defined by the clock range and core count. The 2.20 GHz base clock is conservative, which helps manage the 325 W TDP under full load, but it also means single-threaded tasks will rarely see the 3.50 GHz boost for extended periods. The 128 threads provide massive parallelism, so any workload that scales across cores—such as virtualization, scientific simulations, or batch processing—will see near-linear gains up to the memory bandwidth limit of 409.6 GB/s. Conversely, single-thread performance is capped by the boost clock, which is unremarkable for a 2020s-era Xeon; many consumer processors exceed 5 GHz, leaving this chip at a disadvantage in tasks like legacy software or lightly threaded game logic.

Real-world behavior follows a clear pattern: the chip excels when all 64 cores are engaged, as the L3 cache and eight-channel DDR5 memory controller feed the cores efficiently. In mixed workloads, the operating system can schedule threads across cores to keep the boost clock active on a few cores, but sustained single-thread performance will settle near the base clock under thermal or power constraints. The 50th percentile in aggregate benchmarks likely reflects this duality—strong multi-thread scores pulling the average up, while weaker single-thread results drag it down relative to high-clock consumer parts.

Power and Thermals

The 325 W TDP classifies this processor as a high-power part, requiring robust cooling solutions typical of dual-socket server platforms. Air cooling is possible with large server heatsinks designed for 300+ W TDPs, but liquid cooling becomes practical for dense rack deployments where airflow is limited. The 5 nm process node from Intel helps mitigate some heat density, but the dual-die design with 2x 598 mm² die area spreads heat across a wide surface, making thermal interface material and heatsink mounting critical. The base clock of 2.20 GHz likely serves as a power-saving measure, allowing the chip to idle lower than its TDP when not under load, but sustained all-core workloads will approach the 325 W envelope.

Cooling tier implications are clear: this is not a chip for small form factor or passively cooled systems. It demands an active cooling solution with a high-capacity heatsink, and server chassis designs should account for airflow direction and ambient temperature limits. The 409.6 GB/s memory bandwidth also generates additional heat from the eight-channel DDR5 DIMMs, so system builders must consider total platform power, not just the CPU. The lack of a launch MSRP or release date in the data means no cost-based cooling recommendations, but the power class alone suggests a dedicated server environment rather than a workstation tower.

Who Should Consider It

Workload-based recommendations stem directly from the core count, memory bandwidth, and clock speeds. For parallel computing tasks—such as rendering, financial risk modeling, or data processing pipelines that use all 128 threads—this processor is a strong fit. The 256 MB L3 cache and 409.6 GB/s memory bandwidth reduce bottlenecks in data-intensive operations, making it suitable for in-memory databases or large-scale analytics where working sets exceed typical consumer cache sizes. Server virtualization benefits from the thread count, allowing many concurrent VMs without oversubscription.

Gaming is not a primary use case, as the 3.50 GHz boost clock and 50th percentile aggregate score indicate lower per-core performance than dedicated gaming CPUs. Single-thread-heavy game engines will leave most cores idle, wasting the chip’s potential. Creation workloads like video editing can leverage the multi-thread strength for rendering, but timeline scrubbing and effects previews rely on single-thread speed, which is middling here. Office productivity and general desktop use are overkill; the power draw and cooling requirements make it impractical for typical office tasks. The intended audience is clearly server operators running scale-out workloads that fit within 64 cores and 128 threads, where the 325 W TDP is an acceptable trade-off for the parallelism.

How It Compares

No nearest rivals are listed in the database, so direct delta comparisons against specific competing models are unavailable. The 50th percentile against all CPUs provides a general reference point: this chip neither dominates nor lags the field in aggregate terms. In the absence of rival data, the comparison must be inferred from architecture and specs. Against other Granite Rapids parts with higher boost clocks or greater core counts, this chip would likely trail in multi-thread scores but offer similar memory bandwidth. Against older Xeons with fewer cores but higher clocks, the single-thread performance gap would be smaller, but the multi-thread advantage here is obvious due to the 128 threads.

The lack of a nearestRivals array means no percentage deltas can be cited, so the comparison remains qualitative. What the data does show is that this processor is not positioned as a flagship—its 50th percentile standing suggests it competes with mid-range server parts in aggregate scoring, even though its core count is high. The 2.20 GHz base clock is likely a deliberate choice to fit within the 325 W TDP while maintaining a high core count, which means in purely multi-threaded benchmarks it may outperform parts with fewer cores but higher clocks, yet lose to parts with similar core counts and more aggressive boost behavior.

Platform and Compatibility

The processor uses the Intel BGA 5026 socket, which is a ball-grid array package, meaning it is soldered to the motherboard and not upgradeable or replaceable without specialized equipment. This socket is specific to the Granite Rapids-D generation, so the upgrade path within the same platform is limited to processors that share the same BGA 5026 footprint and architecture. The architecture is Granite Rapids, part of the Xeon 6 family (Granite Rapids-D), which indicates a focus on density and power efficiency for edge or rack-scale deployments, though the 325 W TDP belies that efficiency label.

Memory support is DDR5 across an eight-channel bus, providing a theoretical bandwidth of 409.6 GB/s. ECC memory is supported, which is essential for server reliability. The PCIe interface is Gen 5 with 32 lanes from the CPU, sufficient for a range of accelerators, NVMe storage, or network cards, but not for massive GPU arrays that require more lanes. The processor is not multiplier-unlocked, so overclocking is not possible, reinforcing its server positioning. The production status is active, meaning it is currently available for system integration. The integrated graphics field is null, so a discrete GPU or server management controller is required for display output. The socket being BGA also means the motherboard must be designed for this specific processor, limiting flexibility compared to LGA sockets that allow CPU swaps. Upgrade path is essentially locked to the initial purchase; any future upgrade requires a full motherboard replacement.

The AMD Equivalent of Xeon 6768P-B

Looking for a similar processor from AMD? The AMD Ryzen 5 7500X3D offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 7500X3D

AMD • 6 Cores

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