Intel Xeon 6760P
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Xeon 6760P Specifications
Xeon 6760P Core Configuration
Processing cores and threading
The Intel Xeon 6760P features 64 physical cores and 128 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
6760P Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Xeon 6760P benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 6760P by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Xeon 6760P Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the 6760P processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 6760P's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Granite Rapids Architecture & Process
Manufacturing and design details
The Intel Xeon 6760P is built on Intel's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 6760P incorporate advanced branch prediction and out-of-order execution for optimal performance.
Granite Rapids Instruction Set Features
Supported CPU instructions and extensions
The Xeon 6760P by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Power & Thermal
TDP and power specifications
The Intel Xeon 6760P has a TDP (Thermal Design Power) of 330W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 4710 Platform & Socket
Compatibility information
The Xeon 6760P uses the Intel Socket 4710 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 4710 Memory Support
RAM compatibility and speeds
Memory support specifications for the 6760P define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 6760P determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Product Information
Release and pricing details
The Intel Xeon 6760P is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 6760P by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
About Intel Xeon 6760P
The Intel Xeon 6760P is a server and workstation processor built on the Granite Rapids architecture, representing the Xeon 6 (Granite Rapids-SP) generation. It packs 64 cores and 128 threads, with a base clock of 2.20 GHz and a boost clock of 3.80 GHz, fabricated on Intel's 5 nm process. The chip uses a dual-die design with a combined die size of 2x 598 mm², and its launch MSRP is $7803. With a 330 W TDP, an active production status, and a release date of 2025-02-23, this processor targets high-end parallel computing environments.
Benchmark Performance
The database entry for the Intel Xeon 6760P contains no direct benchmark scores and no nearest rival entries, meaning the analysis must derive performance expectations from the architectural specifications. The 64 cores and 128 threads form the primary compute foundation, providing a massive parallel throughput capacity. The 320 MB shared L3 cache is a substantial pool for data reuse, which can significantly reduce memory access latency in workloads that exhibit high temporal locality. The memory bandwidth of 409.6 GB/s, delivered through an eight-channel DDR5 bus, is a strong indicator of performance in memory-bound tasks.
The percentile field places this CPU at the 50th percentile among all CPUs in the database. This suggests a median position in the overall distribution of processors, but without specific rival scores or deltaPct values, no percentage comparisons can be drawn. The absence of benchmark data means the 50th percentile is the only relative performance metric available. The boost clock of 3.80 GHz is moderate for a processor with this core count, implying that performance scaling will come primarily from core count rather than raw frequency. The 5 nm process node indicates a modern fabrication, but the dual-die design with a 2x 598 mm² die size suggests a physically large package that may influence thermal and power behavior. The L1 cache is 112 KB per core, and the L2 cache is 2 MB per core, which are generous per-core allocations that support individual core efficiency.
Who Should Consider It
The market segment is explicitly server and workstation, which defines the target audience. The 128 threads are well-suited for multi-threaded rendering, scientific simulations, large-scale virtualization, and batch processing workloads. The eight-channel DDR5 memory bus with 409.6 GB/s bandwidth supports data-intensive applications such as in-memory databases, real-time analytics, and AI inference tasks that require rapid data movement. The 88 PCIe Gen 5 lanes (CPU only) allow for extensive expansion with multiple GPUs or high-speed NVMe storage arrays, making it a candidate for compute clusters or deep learning servers.
ECC memory support is a critical feature for environments where data integrity is paramount, such as financial modeling or research computing. The lack of integrated graphics means a discrete GPU is mandatory for any display output, which is standard for server platforms. The 50th percentile ranking against all CPUs suggests it is not an outlier in performance but sits in the middle of the database's population, potentially indicating a balanced choice for general server workloads rather than a niche extreme. The 320 MB shared L3 cache is particularly beneficial for workloads that share large datasets across many cores, such as graph processing or large-scale simulations.
Single-Thread vs Multi-Thread Behavior
The base clock of 2.20 GHz and boost clock of 3.80 GHz represent a 1.6 GHz boost headroom. Single-threaded tasks will rely on the 3.80 GHz boost, but the architecture's emphasis on core count means single-thread performance is likely secondary to multi-thread throughput. The 2 MB L2 cache per core is generous, aiding per-core efficiency for moderately threaded workloads. The 320 MB shared L3 cache is a massive pool that can reduce cross-core communication latency in multi-threaded workloads, as data can be shared without traversing the memory bus as frequently.
The data suggests that multi-threaded performance will dominate, given the 128 threads and the large shared cache. For workloads that are predominantly single-threaded, the 3.80 GHz boost is modest compared to higher-frequency desktop parts, but the server market prioritizes throughput over latency. The 112 KB L1 cache per core provides fast access to frequently used data, which helps mitigate the relatively lower boost clock. The eight-channel memory bus and 409.6 GB/s bandwidth ensure that multi-threaded workloads are not starved for data, allowing the cores to stay busy. The combination of a high core count and substantial cache hierarchy points to a design optimized for parallel execution rather than single-thread responsiveness.
Platform and Compatibility
The processor uses Intel Socket 4710, which is specific to the Granite Rapids-SP generation. Memory support is DDR5 with an eight-channel bus, providing a theoretical bandwidth of 409.6 GB/s. ECC memory is supported, which is essential for data integrity in server applications. The PCIe interface is Gen 5 with 88 lanes available from the CPU, enabling high-bandwidth peripherals such as network cards, GPUs, and NVMe storage. There is no integrated graphics, so a dedicated GPU is required for display output.
The production status is active, and the release date is 2025-02-23. The multiplier is locked, meaning overclocking is not supported, which is typical for server SKUs. The upgrade path is limited to the Socket 4710 platform, which is tied to the Granite Rapids architecture. The die size of 2x 598 mm² indicates a dual-die package, which may have implications for thermal interface material and cooler mounting compatibility. The process node is 5 nm, fabricated by Intel, and the part number is SRV5G. The absence of an integrated graphics field means no iGPU is present, which simplifies the platform but requires a dedicated graphics adapter for any visual output.
How It Compares
The database entry does not include any nearest rival entries, so direct percentage comparisons against specific competitor models cannot be made from the provided data. The 50th percentile ranking against all CPUs provides a broad context, but without rival names or deltaPct values, a detailed competitive analysis is impossible. The raw specifications—64 cores, 128 threads, 320 MB shared L3 cache, and 409.6 GB/s memory bandwidth—position it as a high-core-count server part.
The launch MSRP of $7803 places it in the premium server segment. The lack of integrated graphics and locked multiplier are consistent with server-oriented designs. The 5 nm process and dual-die design indicate a modern fabrication, but the specific transistor count is not listed. The 88 PCIe Gen 5 lanes are a notable feature, providing ample expansion capability. The eight-channel DDR5 memory bus is a key differentiator for memory-intensive workloads. Without rival data, the only comparative anchor is the 50th percentile, which suggests a median performance position among all CPUs in the database.
FAQ
Q: How many cores and threads does the Intel Xeon 6760P have?
A: It has 64 cores and 128 threads.
Q: What socket does the Intel Xeon 6760P use?
A: It uses Intel Socket 4710.
Q: What type of memory does it support?
A: It supports DDR5 memory with an eight-channel bus, providing 409.6 GB/s of memory bandwidth.
Q: What is the TDP of the Intel Xeon 6760P?
A: The TDP is 330 W.
Q: Does the Intel Xeon 6760P have integrated graphics?
A: No, the integrated graphics field is null, meaning no iGPU is present.
Q: What is the process node of the Intel Xeon 6760P?
A: It is fabricated on a 5 nm process by Intel.
Q: What is the launch MSRP of the Intel Xeon 6760P?
A: The launch MSRP is $7803.
Power and Thermals
The TDP is 330 W, which is a high power draw and implies a robust cooling solution is necessary. The 5 nm process node helps manage power efficiency, but the dual-die design with a combined die size of 2x 598 mm² generates significant heat. A server chassis with high-airflow cooling or a liquid cooling solution would be appropriate for sustained operation under load. The locked multiplier prevents overclocking, but the platform may allow power management features to adjust performance per watt.
The 330 W TDP class is typical for high-core-count server processors, requiring a capable cooling tier. No specific cooler size or wattage figures are provided in the data, so the recommendation is qualitative: a capable air cooler or liquid cooler designed for server sockets would be needed. The eight-channel memory bus and 88 PCIe Gen 5 lanes also contribute to system-level power demands, but those are not quantified in the pack. The active production status and release date of 2025-02-23 indicate a current-generation part, and the 50th percentile ranking suggests it is not an extreme outlier in the overall CPU landscape, which may imply moderate thermal characteristics relative to the most power-hungry parts.
Detailed benchmark scores and charts for the Intel Xeon 6760P are below.
Benchmark Scores
No benchmark data available for this CPU.
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