INTEL

Intel Xeon 3.06

Intel processor specifications and benchmark scores

1
Cores
1
Threads
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GHz Boost
89W
TDP
๐Ÿ›ก๏ธECC Memory

Intel Xeon 3.06 Specifications

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Xeon 3.06 Core Configuration

Processing cores and threading

The Intel Xeon 3.06 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
2
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3.06 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon 3.06 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 3.06 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3.07 GHz
Boost Clock
N/A
Multiplier
23x
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Intel's Xeon 3.06 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 3.06 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 3.06's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
16 KB
L2 Cache
512 KB
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NetBurst Architecture & Process

Manufacturing and design details

The Intel Xeon 3.06 is built on Intel's 130 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 3.06 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
NetBurst
Codename
Prestonia
Process Node
130 nm
Foundry
Intel
Transistors
55 million
Die Size
217 mmยฒ
Generation
Xeon (Prestonia)
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NetBurst Instruction Set Features

Supported CPU instructions and extensions

The Xeon 3.06 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
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3.06 Power & Thermal

TDP and power specifications

The Intel Xeon 3.06 has a TDP (Thermal Design Power) of 89W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
89W
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Intel Socket 604 Platform & Socket

Compatibility information

The Xeon 3.06 uses the Intel Socket 604 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 604
Package
ยตPGA
DDR5

Intel Socket 604 Memory Support

RAM compatibility and speeds

Memory support specifications for the 3.06 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 3.06 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel
ECC Memory
Supported
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Xeon 3.06 Product Information

Release and pricing details

The Intel Xeon 3.06 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 3.06 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2003
Market
Server/Workstation
Status
End-of-life

Xeon 3.06 Benchmark Scores

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No benchmark data available for this CPU.

About Intel Xeon 3.06

The Intel Xeon 3.06 GHz processor, based on the Prestonia core, is a single-threaded, single-core CPU designed for the server and workstation markets of its era. Operating at a base clock speed of 3.07 GHz, this processor did not feature modern boost frequency technology. Its performance was derived from its high clock speed for the time and its on-die L2 cache. The singular core and thread configuration meant it was optimized for applications that did not require parallel processing capabilities. This Xeon processor was engineered to deliver reliability for critical business computations. Its architecture represented a significant step in Intel's server CPU development.

The thermal design of the Intel Xeon 3.06 is characterized by a TDP of 89 watts, which required robust cooling solutions in server chassis. Manufactured on a 130 nm process, the chip's power consumption and heat output were typical for high-performance processors of the early 2000s. The cache hierarchy was crucial for its performance, featuring:

  • L1 Cache: 8 KB for data and 12 KB for instructions.
  • L2 Cache: 512 KB integrated on the processor die.
  • L3 Cache: This particular model did not include an L3 cache.
  • The cache was designed for low-latency access to frequently used data.
  • This setup aimed to maximize the efficiency of the single execution core.
The 3.06 GHz Xeon chip's cache system helped mitigate the performance limitations of contemporary front-side bus speeds.

Target use cases for the Xeon 3.06 were primarily entry-level servers and single-processor workstations handling business applications, file serving, and web hosting. This CPU was not intended for high-throughput computing or virtualization environments that benefit from multiple cores. Its release in 2003 positioned it as a solution for organizations requiring a balance of performance and stability. The Socket 604 platform provided a foundation for reliable system builds. The Intel Xeon 3.06 from Intel served as a workhorse processor for foundational IT infrastructure during its product lifecycle.

The AMD Equivalent of Xeon 3.06

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD โ€ข 4 Cores

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