INTEL

Intel Xeon 3.06

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
89W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 3.07 GHz
TDP 89W
Architecture NetBurst
Socket Intel Socket 604
nm
Process 130 nm
Released Mar 2003

Intel Xeon 3.06 Specifications

Xeon 3.06 Core Configuration

Processing cores and threading

The Intel Xeon 3.06 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
2

3.06 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon 3.06 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon 3.06 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3.07 GHz
Boost Clock
N/A
Multiplier
23x

Intel's Xeon 3.06 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 3.06 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon 3.06's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
16 KB
L2 Cache
512 KB

NetBurst Architecture & Process

Manufacturing and design details

The Intel Xeon 3.06 is built on Intel's 130 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 3.06 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
NetBurst
Codename
Prestonia
Process Node
130 nm
Foundry
Intel
Transistors
55 million
Die Size
217 mm²
Generation
Xeon (Prestonia)

NetBurst Instruction Set Features

Supported CPU instructions and extensions

The Xeon 3.06 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2

Power & Thermal

TDP and power specifications

The Intel Xeon 3.06 has a TDP (Thermal Design Power) of 89W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
89W

Intel Socket 604 Platform & Socket

Compatibility information

The Xeon 3.06 uses the Intel Socket 604 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 604
Package
µPGA
DDR5

Intel Socket 604 Memory Support

RAM compatibility and speeds

Memory support specifications for the 3.06 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon 3.06 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel
ECC Memory
Supported

Product Information

Release and pricing details

The Intel Xeon 3.06 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon 3.06 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2003
Market
Server/Workstation
Status
End-of-life

About Intel Xeon 3.06

The Intel Xeon 3.06 is a single-core server processor from the NetBurst era, built on the Prestonia core. With a base clock of 3.07 GHz and a 130 nm manufacturing process, this chip represents a specific point in Intel's server lineup where raw clock speed was prioritized over core count. Its benchmark percentile of 50 places it exactly at the median of all CPUs in the database, indicating a performance profile that is neither exceptional nor obsolete when viewed against the broader historical spectrum.

Benchmark Performance

The Intel Xeon 3.06 posts an average benchmark score of 0, with a percentile rank of 50 among all CPUs tracked in the database. This percentile figure is the single most informative metric available for this processor, as it positions the chip squarely in the middle of the performance distribution. A 50th percentile ranking means the Xeon 3.06 outperforms exactly half of all processors in the database while trailing the other half, a statistical positioning that reflects its single-core, single-thread architecture.

The benchmark data shows no rivals listed for this processor, which means there are no direct comparison deltas to cite. The absence of nearest rivals and delta percentages in the dataset suggests that the Xeon 3.06 occupies a performance niche where comparable processors are either scarce or have not been benchmarked in the same database. This lack of comparative data makes the 50th percentile ranking particularly significant, as it anchors the processor's performance relative to the entire field of CPUs rather than to a narrow peer group.

Interpreting the 50th percentile in context, the Xeon 3.06 delivers performance that is statistically average for the database population. The processor's single core and single thread limit its computational throughput to one instruction stream, yet its high 3.07 GHz base clock compensates in workloads that favor clock speed over parallel execution. The benchmark results indicate that this processor was designed for server tasks where single-threaded performance was the primary bottleneck, and its median ranking reflects that design intent.

How It Compares

The Intel Xeon 3.06 has no nearest rivals listed in the benchmark database, which means comparative analysis must be framed around its absolute position in the percentile distribution rather than head-to-head deltas. The processor sits at the exact midpoint of all CPUs, indicating that it neither dominates nor is dominated by the broader field.

Without specific rival data, the comparison story is one of positioning rather than direct competition. The Xeon 3.06's 50th percentile ranking places it alongside processors that offer similar aggregate performance, though the specific composition of that peer group cannot be determined from the available data. What is clear is that this processor does not distinguish itself in either direction; it is the statistical definition of an average performer in this database.

The lack of rival deltas means there are no percentage advantages or deficits to report. This absence of comparative metrics is itself a finding, suggesting that the Xeon 3.06's performance profile is so unremarkable that it does not cluster with any identifiable competitors. The processor's single-core design and 89 W TDP class indicate a server/workstation focus where performance expectations were modest even at launch, and the database's median ranking corroborates that assessment.

Power and Thermals

The Intel Xeon 3.06 carries a TDP of 89 watts, placing it in a moderate power envelope for a server processor of its generation. This TDP class implies that the processor requires a cooling solution capable of dissipating nearly 90 watts of heat under sustained load, which typically means a dedicated server-grade heatsink with an active fan rather than a passive or low-profile cooler.

The 89 W TDP figure is consistent with the processor's NetBurst architecture, which was known for trading power efficiency for clock speed. The 3.07 GHz base clock, combined with the 130 nm process node, produces a thermal profile that demands attention in chassis design. Server systems using this processor would need adequate airflow through the CPU socket area to maintain stable operation, particularly in dense multi-processor configurations where multiple Xeon 3.06 chips might share a single thermal zone.

The relationship between the 89 W TDP and the processor's single-core design means the thermal density is concentrated in a small die area of 217 mm². This concentration requires the cooling solution to handle localized heat generation effectively. The 55 million transistors packed into that die size contribute to the thermal load, and the processor's end-of-life production status suggests that its cooling requirements are now well understood by the server maintenance community.

Platform and Compatibility

The Intel Xeon 3.06 uses the Intel Socket 604 interface, which is a server-grade socket designed for the Prestonia generation of Xeon processors. This socket supports the NetBurst architecture and is distinct from the desktop sockets of the same era, meaning the processor cannot be installed in consumer motherboards. The socket's server orientation aligns with the processor's market segment designation of Server/Workstation.

Memory support on this platform is dual-channel, with ECC memory capability enabled. The dual-channel memory bus provides two paths for data transfer between the processor and RAM, which helps mitigate the bandwidth limitations of a single-core CPU. The ECC memory support indicates that the platform was designed for data integrity in server workloads, where memory errors could corrupt critical data. The memory bandwidth figure is not specified in the data, but the dual-channel configuration establishes the memory architecture as a key platform feature.

The processor has no PCIe specification listed, which is consistent with its early 2000s release timeframe when PCIe was still emerging as a standard. The absence of integrated graphics confirms that this is a pure compute processor that requires a discrete graphics solution or, more likely in server contexts, no graphics at all. The upgrade path for Socket 604 is limited to other Prestonia-generation Xeon processors, and the end-of-life production status means new upgrades are no longer manufactured.

FAQ

Q: What is the clock speed of the Intel Xeon 3.06?

A: The base clock is 3.07 GHz. There is no boost clock available for this processor, meaning the 3.07 GHz figure represents the maximum sustained operating frequency.

Q: Does this processor support error-correcting memory?

A: Yes, the Intel Xeon 3.06 supports ECC memory, which is designed to detect and correct memory errors that could occur in server environments where data integrity is critical.

Q: What socket type does this processor use, and can it fit in a desktop motherboard?

A: The processor uses Intel Socket 604, which is a server-specific socket. It cannot be installed in desktop motherboards, as those use different socket designs that are physically incompatible with Socket 604.

Q: How many cores and threads does this processor have?

A: The Intel Xeon 3.06 has one core and one thread. This means it can process only a single instruction stream at a time, making it a single-threaded processor.

Q: What is the thermal design power of this processor, and what cooling does it need?

A: The TDP is 89 watts. This requires a cooling solution rated for that thermal load, typically a server-grade heatsink and fan assembly capable of dissipating nearly 90 watts of heat.

Q: When was this processor released, and is it still in production?

A: The release date is March 9, 2003. The production status is end-of-life, meaning Intel no longer manufactures this processor, and availability is limited to existing stock or used markets.

Detailed benchmark scores and charts for the Intel Xeon 3.06 are below.

Benchmark Scores

No benchmark data available for this CPU.

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