INTEL

Intel Pentium III Xeon 900 2.8V

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
36W
TDP

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 900 GHz
TDP 36W
Architecture P6
Socket Intel Slot 2
nm
Process 180 nm
Released Mar 2001

Intel Pentium III Xeon 900 2.8V Specifications

Pentium III Xeon 900 2.8V Core Configuration

Processing cores and threading

The Intel Pentium III Xeon 900 2.8V features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
4

Pentium III Xeon 900 2.8V Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Pentium III Xeon 900 2.8V benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Pentium III Xeon 900 2.8V by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
900 GHz
Boost Clock
N/A
Multiplier
9x

Intel's Pentium III Xeon 900 2.8V Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Pentium III Xeon 900 2.8V processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Pentium III Xeon 900 2.8V's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
2 MB

P6 Architecture & Process

Manufacturing and design details

The Intel Pentium III Xeon 900 2.8V is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Pentium III Xeon 900 2.8V incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Cascades-2M
Process Node
180 nm
Foundry
Intel
Transistors
140 million
Die Size
375 mm²
Generation
Pentium III Xeon (Cascades)

P6 Instruction Set Features

Supported CPU instructions and extensions

The Pentium III Xeon 900 2.8V by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE

Power & Thermal

TDP and power specifications

The Intel Pentium III Xeon 900 2.8V has a TDP (Thermal Design Power) of 36W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
36W

Intel Slot 2 Platform & Socket

Compatibility information

The Pentium III Xeon 900 2.8V uses the Intel Slot 2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Slot 2
Package
SECC
DDR5

Intel Slot 2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Pentium III Xeon 900 2.8V define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Pentium III Xeon 900 2.8V determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Single-channel

Product Information

Release and pricing details

The Intel Pentium III Xeon 900 2.8V is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Pentium III Xeon 900 2.8V by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2001
Launch Price
$3692
Market
Server/Workstation
Status
End-of-life
Part Number
SL4XYSL5D3

About Intel Pentium III Xeon 900 2.8V

Platform and Compatibility

The Intel Pentium III Xeon 900 2.8V is built on the P6 architecture with the Cascades-2M codename, placing it in the Pentium III Xeon (Cascades) generation. This is a single-core, single-thread processor designed for the Intel Slot 2 socket, a cartridge-based form factor that was the hallmark of early Xeon workstation and server platforms. The processor uses Intel's 180 nm process node and integrates 140 million transistors on a 375 mm² die, reflecting the large L2 cache implementation that defined this generation.

Memory support is a critical limitation: the fact pack lists no memory support specification, and the memory bus is single-channel. This means the platform's memory bandwidth is inherently constrained, and the processor does not support ECC memory. For a server/workstation part, the absence of ECC is notable, as it limits the chip to workloads where memory error correction is not a requirement.

The processor has no integrated graphics and no PCIe support listed. This is consistent with its era—the platform relies on a separate graphics card and a chipset that provides the system bus. The lack of PCIe data means the upgrade path is tied to the Slot 2 infrastructure, which was a transitional socket. The production status is end-of-life, and the release date is March 2001. The multiplier is locked, so overclocking is not an option without external hardware modifications.

Upgrade path considerations: because the socket is Slot 2, users are confined to processors that fit that cartridge interface. The architecture and generation data indicate this is a P6-family part, so the natural upgrade within the platform would be to other Slot 2 Xeon processors, but the fact pack does not list specific compatible alternatives. The part number is SL4XYSL5D3, and the launch MSRP was $3692. The market segment is explicitly Server/Workstation, so this is not a desktop processor.

Power and Thermals

The TDP is 36 watts, which is modest by modern standards but was a significant figure for a 180 nm part with a 2 MB L2 cache. This TDP class implies that a capable air cooler from the era would suffice—no exotic liquid cooling or large tower heatsinks are necessary. The 2.8V in the name refers to the core voltage, which is higher than later processors, meaning the power delivery circuitry on the motherboard must be designed for that voltage rail.

The thermal implications of a 36W TDP are straightforward: even a small aluminum heatsink with a fan can manage this heat output. In a server chassis with forced airflow, this processor would run comfortably within specifications. The die size of 375 mm² is large due to the 2 MB L2 cache, but the power density is still low enough that thermal throttling is unlikely under normal load.

Benchmark results indicate no performance data is available (avgBenchmarkScore is 0), and the percentile vs all CPUs is 50, meaning it sits at the midpoint of all processors in the database—but this is based on a null benchmark pool. The TDP, however, is the key thermal metric: 36W is roughly one-third of what contemporary high-end desktop processors consume, so cooling is trivial. The lack of a boost clock means the processor runs at a fixed 900 MHz, which simplifies thermal design—there is no transient power spike from turbo behavior.

Who Should Consider It

The data shows this is a single-core, single-thread processor with a 900 MHz base clock and no boost. The benchmark scores are zero, and there are no nearest rivals listed, so direct performance comparisons are impossible from the fact pack. However, the architectural profile—P6, 180 nm, 2 MB L2 cache—suggests a processor designed for early 2000s server workloads that favored cache capacity over clock speed.

For gaming, this processor is not a viable option by modern standards. The single core and 900 MHz clock would bottleneck even contemporary 2D titles, and the lack of integrated graphics means a discrete GPU is mandatory. The single-channel memory bus further limits gaming performance, as frame pacing depends on memory throughput.

For creation workloads, the 2 MB L2 cache is the standout feature. In 2001, that cache size was enormous, and it would benefit workloads with working sets that fit within 2 MB—think database index lookups, compression algorithms, or early digital content creation tools. The single core, however, means no parallel rendering or encoding; tasks are strictly sequential.

For office productivity, the processor is adequate for word processing, spreadsheets, and email from its era. The 36W TDP means it can run in a slim desktop chassis, and the server/workstation market segment suggests it was intended for file servers or print servers rather than interactive use. The absence of ECC memory support is a caveat for server deployments, as memory corruption would go undetected.

FAQ

Q: What socket does the Intel Pentium III Xeon 900 2.8V use?

A: It uses the Intel Slot 2 socket, which is a cartridge-based form factor for the Xeon platform.

Q: Does this processor support ECC memory?

A: No, the fact pack lists ECC memory support as false, so the processor does not support error-correcting memory.

Q: What is the TDP and what cooling does it require?

A: The TDP is 36 watts, which implies a simple air cooler with a fan is sufficient; no exotic cooling solution is needed.

Q: What is the cache configuration?

A: The processor has 32 KB of L1 cache and 2 MB of L2 cache, with no L3 cache or V-Cache.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplier is locked, so overclocking is not supported.

Q: When was this processor released, and what is its production status?

A: It was released on March 20, 2001, and its production status is end-of-life.

Q: Does it have integrated graphics?

A: No, the fact pack lists no integrated graphics, so a discrete GPU is required.

How It Compares

The fact pack lists no nearest rivals, so direct comparison is not possible from the data. The percentile vs all CPUs is 50, which indicates a median position in the database, but with an average benchmark score of 0, this percentile is based on no actual performance measurements. The absence of rival data means the analysis must rely on architectural characteristics.

Without rival scores, the comparison framework is limited to the processor's own specifications. The 2 MB L2 cache is the defining feature—it places the chip in a category where cache size was the primary differentiator, rather than clock speed or core count. The single core and 900 MHz clock are modest even for 2001, but the cache capacity suggests a specific design goal: serving data to a system that would otherwise be bottlenecked by main memory access.

The market segment of Server/Workstation indicates this was not a consumer part. Rivals from the same era would include other Xeon processors and possibly high-end Pentium III desktop parts, but without specific names or scores in the fact pack, no numerical comparison is possible. The launch MSRP of $3692 reflects the premium for the 2 MB cache, which was a server-grade feature. The processor's end-of-life status means it has no modern relevance, and the lack of benchmark data prevents any performance ranking beyond the neutral 50th percentile.

Detailed benchmark scores and charts for the Intel Pentium III Xeon 900 2.8V are below.

Benchmark Scores

No benchmark data available for this CPU.

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