INTEL

Intel Mobile Pentium III 900

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
23W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 900 GHz
TDP 23W
Architecture P6
Socket Intel Micro-BGA2
nm
Process 180 nm
Released Mar 2001

Intel Mobile Pentium III 900 Specifications

Mobile Pentium III 900 Core Configuration

Processing cores and threading

The Intel Mobile Pentium III 900 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Mobile Pentium III 900 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Mobile Pentium III 900 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Mobile Pentium III 900 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
900 GHz
Boost Clock
N/A
Multiplier
9x

Intel's Mobile Pentium III 900 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Mobile Pentium III 900 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Mobile Pentium III 900's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
256 KB

P6 Architecture & Process

Manufacturing and design details

The Intel Mobile Pentium III 900 is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Mobile Pentium III 900 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Coppermine
Process Node
180 nm
Foundry
Intel
Transistors
28 million
Die Size
106 mm²
Generation
Pentium III (Coppermine)

P6 Instruction Set Features

Supported CPU instructions and extensions

The Mobile Pentium III 900 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE

Mobile Pentium III 900 Power & Thermal

TDP and power specifications

The Intel Mobile Pentium III 900 has a TDP (Thermal Design Power) of 23W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
23W
Tj Max
100°C

Intel Micro-BGA2 Platform & Socket

Compatibility information

The Mobile Pentium III 900 uses the Intel Micro-BGA2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Micro-BGA2
Package
H-PBGA495
DDR5

Intel Micro-BGA2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Mobile Pentium III 900 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Mobile Pentium III 900 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
unknown Depends on motherboard
Memory Bus
Single-channel

Intel's Mobile Pentium III 900 Integrated Graphics

Built-in GPU specifications

The Intel Mobile Pentium III 900 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Mobile Pentium III 900 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Mobile Pentium III 900 Product Information

Release and pricing details

The Intel Mobile Pentium III 900 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Mobile Pentium III 900 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2001
Launch Price
$562
Market
Mobile
Status
End-of-life
Part Number
SL54GSL59H

Mobile Pentium III 900 Benchmark Scores

No benchmark data available for this CPU.

About Intel Mobile Pentium III 900

The Intel Mobile Pentium III 900 is a single-core, single-thread processor from the P6 architecture family, built on Intel's 180 nm process with the Coppermine core. It operates at a base clock of 900.00 MHz, with no boost capability, and its benchmark data places it at the 50th percentile among all CPUs, indicating a mid-pack position for its era. With no direct rival scores or benchmark entries available in the data, the analysis here focuses on its architectural characteristics and the implications of its specifications.

Benchmark Performance

The benchmark results for the Intel Mobile Pentium III 900 are absent from the available dataset, including an average benchmark score of zero and an empty nearestRivals array. Consequently, there are no exact percentage deltas or comparative scores to cite against competing processors. What the data does show is a 50th percentile ranking across all CPUs, which situates this chip exactly at the median of the performance distribution. In practical terms, this percentile suggests that half of the processors in the database outperform it and half underperform it, a reasonable standing for a mobile chip from its generation.

The lack of rival data means the raw clock speed of 900.00 MHz is the primary performance indicator. In the context of the Pentium III Coppermine generation, this clock rate represents a high-end mobile configuration, as the architecture's efficiency allowed for competitive single-threaded execution at this frequency. The 32 KB L1 cache and 256 KB L2 cache are modest by modern standards but were appropriate for the workload demands of early 2000s mobile computing. The single-threaded nature of the chip means that performance scales directly with instructions per clock and clock speed, with no multi-threaded headroom to leverage. For applications that were not optimized for parallelism, which was the norm at the time of its release, the 900 MHz clock would have delivered responsive performance for typical productivity tasks.

Given the absence of benchmark scores, the 50th percentile placement is the only quantitative performance reference. This figure implies that the processor was neither a standout nor a laggard in the broader CPU landscape, aligning with its positioning as a mainstream mobile option. The data does not support claims of superiority or deficiency relative to specific rivals, as no rival names or deltaPct values are provided. What remains clear is that this processor's performance profile is defined by its high clock speed for the era, its single-core architecture, and its median percentile standing.

Who Should Consider It

The workload profile of the Intel Mobile Pentium III 900 is dictated by its single-core, single-thread design and its 900.00 MHz base clock. For office productivity tasks—word processing, spreadsheet management, and email—the data indicates a capable experience, as these workloads are largely single-threaded and do not demand high core counts. The 256 KB L2 cache helps reduce latency for repeated data access, which benefits typical office application usage patterns.

For gaming, the situation is more nuanced. The 50th percentile ranking suggests that the processor can handle older or less demanding titles, particularly those from its contemporary era. However, the lack of multi-threading and the modest cache size would become limiting factors for more complex game logic or physics calculations. Users considering this chip for gaming should focus on titles that predate the multi-core era, as the single-thread performance at 900 MHz would be the primary asset.

Content creation and media work are not well suited to this processor based on the available data. Video editing, 3D rendering, and large-scale image processing typically benefit from multiple threads, which this chip lacks entirely. The single-threaded nature would result in long render times and sluggish preview responsiveness for such applications. The absence of benchmark scores specifically for these workloads prevents a definitive quantitative assessment, but the architectural constraints are clear. This processor is best considered by users whose primary needs are basic productivity, light web browsing, and legacy software compatibility, rather than demanding computational tasks.

Power and Thermals

The thermal design power (TDP) of the Intel Mobile Pentium III 900 is rated at 23 watts. This figure classifies the processor within a low-power segment for its generation, making it suitable for thin-and-light laptops and other portable form factors. The 180 nm process node and 28 million transistor count contribute to this manageable power envelope, as the Coppermine core was designed with mobile efficiency in mind.

A 23-watt TDP implies a cooling solution of modest capability. A simple heat pipe assembly with a small fan, or even a passive heatsink in a well-ventilated chassis, would be sufficient to maintain stable operation under load. The data does not specify thermal limits or throttling behavior, but the low TDP suggests that sustained operation at the 900.00 MHz base clock should not overwhelm a standard mobile cooling solution. This is a critical advantage for mobile users, as lower power draw translates to reduced heat output, enabling quieter operation and longer battery life compared to higher-TDP desktop counterparts.

The die size of 106 mm² is relatively compact, which aids in heat dissipation by providing a concentrated but manageable thermal surface. For system integrators, the 23-watt TDP allows for simplified thermal design, potentially reducing the cost and complexity of the cooling system. End-of-life production status means that replacement thermal solutions may be harder to source, but the low power draw reduces the risk of thermal degradation over time.

Platform and Compatibility

The Intel Mobile Pentium III 900 is built for the Intel Micro-BGA2 socket, a ball-grid array package designed for mobile applications. This socket form factor is permanently affixed to the motherboard, meaning the processor is not user-upgradeable or replaceable in a traditional sense. The data indicates that memory support is dependent on the motherboard, with a single-channel memory bus configuration. This arrangement allows for simpler motherboard designs but limits memory bandwidth compared to multi-channel implementations.

The platform does not feature dedicated PCIe support, as the architecture predates the widespread adoption of PCIe in mobile platforms. Instead, expansion and connectivity are handled through older bus standards, which are not specified in the data. Integrated graphics are listed as a chipset feature, available on certain motherboards, meaning that the processor itself does not contain a graphics unit but can rely on motherboard-integrated solutions for display output. This is typical for the era, where graphics capabilities were often provided by separate chipsets rather than integrated into the CPU.

ECC memory is not supported, which aligns with the processor's target market of consumer and business mobile systems rather than servers or workstations. The upgrade path for this platform is effectively nonexistent, given the Micro-BGA2 socket and the end-of-life production status. Users are locked into the specific motherboard configuration, and any performance improvements would require a full system replacement rather than a simple processor swap. The 256 KB L2 cache and 32 KB L1 cache are the only cache levels present, with no L3 cache available.

How It Compares

The nearestRivals array in the data is empty, meaning there are no direct comparative scores, names, or deltaPct values to reference. As such, the Intel Mobile Pentium III 900 cannot be quantitatively positioned against specific competing processors from its generation or any other. The 50th percentile ranking is the only comparative metric, placing it at the median of the overall CPU distribution.

Without rival data, the comparison must rely on architectural context. The 900.00 MHz clock speed and single-core design are the defining characteristics. Competing mobile processors from the same era would likely have featured similar core counts but potentially lower clock speeds, which would position this chip favorably in single-threaded workloads. Conversely, processors with higher clock speeds or more advanced architectures would have outperformed it, but no such rivals are listed in the data.

The absence of benchmark scores and rival comparisons limits the depth of this analysis. The data simply does not support claims of outperformance or underperformance relative to any named competitor. What the data does confirm is a mid-tier standing in the overall CPU landscape, a 23-watt TDP that emphasized portability, and a platform design that prioritized integration over expandability. For users evaluating this processor, the key takeaway is that it offers a balanced, if unremarkable, single-threaded experience suitable for basic mobile computing tasks of its time.

The AMD Equivalent of Mobile Pentium III 900

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD • 4 Cores

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