INTEL

Intel Mobile Pentium III 850

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
18W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 850 GHz
TDP 18W
Architecture P6
Socket Intel Socket 495
nm
Process 180 nm
Released Sep 2000

Intel Mobile Pentium III 850 Specifications

Mobile Pentium III 850 Core Configuration

Processing cores and threading

The Intel Mobile Pentium III 850 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Mobile Pentium III 850 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Mobile Pentium III 850 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Mobile Pentium III 850 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
850 GHz
Boost Clock
N/A
Multiplier
8.5x

Intel's Mobile Pentium III 850 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Mobile Pentium III 850 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Mobile Pentium III 850's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
256 KB

P6 Architecture & Process

Manufacturing and design details

The Intel Mobile Pentium III 850 is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Mobile Pentium III 850 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Coppermine
Process Node
180 nm
Foundry
Intel
Transistors
28 million
Die Size
106 mm²
Generation
Pentium III (Coppermine)

P6 Instruction Set Features

Supported CPU instructions and extensions

The Mobile Pentium III 850 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE

Mobile Pentium III 850 Power & Thermal

TDP and power specifications

The Intel Mobile Pentium III 850 has a TDP (Thermal Design Power) of 18W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
18W
Tj Max
100°C

Intel Socket 495 Platform & Socket

Compatibility information

The Mobile Pentium III 850 uses the Intel Socket 495 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 495
Package
µPGA
DDR5

Intel Socket 495 Memory Support

RAM compatibility and speeds

Memory support specifications for the Mobile Pentium III 850 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Mobile Pentium III 850 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
unknown Depends on motherboard
Memory Bus
Single-channel

Intel's Mobile Pentium III 850 Integrated Graphics

Built-in GPU specifications

The Intel Mobile Pentium III 850 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Mobile Pentium III 850 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Mobile Pentium III 850 Product Information

Release and pricing details

The Intel Mobile Pentium III 850 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Mobile Pentium III 850 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2000
Launch Price
$722
Market
Mobile
Status
End-of-life
Part Number
SL4AHSL4PSSL53LSL58P

Mobile Pentium III 850 Benchmark Scores

No benchmark data available for this CPU.

About Intel Mobile Pentium III 850

The Intel Mobile Pentium III 850 is a single-core mobile processor from the P6 architecture family, built on Intel's 180 nm process with a Coppermine codename. Released in late 2000 with a launch MSRP of $722, this chip targets the mobile market segment and has long since reached end-of-life production status.

Benchmark Performance

The benchmark data for this processor is notably sparse, with no recorded benchmark scores available in the database. The average benchmark score stands at 0, and the processor holds a percentile ranking of 50 among all CPUs, placing it exactly at the midpoint of the performance distribution. This percentile figure indicates that, despite the absence of direct performance measurements, the Mobile Pentium III 850 occupies a median position relative to the broader CPU landscape — neither a standout performer nor a laggard.

Without explicit benchmark scores or nearest rival data, direct performance comparisons cannot be quantified with percentage deltas. However, the architectural details provide meaningful context. The processor runs at a base clock of 850.00 MHz with no boost capability, which was a competitive frequency for its era. The single core and single thread configuration means the processor handles one instruction stream at a time, a standard design for mobile processors of this generation. The 32 KB L1 cache and 256 KB L2 cache represent a balanced cache hierarchy for the Coppermine architecture, with the L2 cache operating at full processor speed — a significant advantage over earlier Pentium III variants that used slower off-die cache.

The 180 nm process node with 28 million transistors on a 106 mm² die size indicates a mature manufacturing technology that prioritized power efficiency over raw transistor density. The 18 W thermal design power (TDP) reflects the mobile focus, allowing for thinner notebook designs compared to desktop counterparts of the same era. The P6 architecture, while older than the subsequent NetBurst designs, was renowned for its efficient instruction execution and low power consumption, which are critical attributes for battery-powered devices.

Platform and Compatibility

The Mobile Pentium III 850 uses the Intel Socket 495 interface, a package designed specifically for mobile Pentium III processors. This socket is not compatible with desktop motherboards, reinforcing the chip's exclusive mobile positioning. The processor relies on the motherboard for memory support, with the fact pack indicating that memory compatibility is dependent on the motherboard implementation. This means system memory type and capacity are determined by the chipset and board design rather than the CPU itself.

Memory access is handled through a single-channel memory bus, which was the standard configuration for mobile processors at this time. The lack of ECC memory support indicates this processor targets consumer and business notebooks rather than mission-critical server applications where error correction would be necessary. The absence of PCIe support in the fact pack is consistent with the processor's 2000 release date, as the PCIe standard was not yet introduced; the system would rely on older bus architectures provided by the chipset.

Integrated graphics are listed as a chipset feature, meaning the processor itself does not contain a graphics core, but certain motherboards paired with appropriate chipsets could provide display output. This design separates the CPU and graphics responsibilities, allowing system manufacturers to choose whether to include graphics capabilities based on their target market. The upgrade path for this processor is limited to other Socket 495 mobile processors, though the end-of-life status means no new processors are being produced for this platform. The processor is not multiplier unlocked, preventing overclocking through multiplier adjustments.

How It Compares

The nearestRivals field in the fact pack is empty, meaning no direct competitor data is available for quantitative comparison. This absence of rival information prevents precise percentage-based analysis against specific competing processors. However, the percentile ranking of 50 provides a general reference point: this processor sits at the median of all CPUs in the database, suggesting it outperforms roughly half of all recorded processors while trailing the other half.

In the absence of direct rival scores, the architectural characteristics place the Mobile Pentium III 850 in a specific performance context. The 850 MHz clock speed was a high-end mobile offering at its release, positioned above entry-level mobile chips that typically ran at lower frequencies. The full-speed 256 KB L2 cache distinguishes it from lower-tier Pentium III mobile variants that may have used reduced cache configurations. The 180 nm process and 28 million transistor count align with the Coppermine generation, which was a refined iteration of the original Pentium III design.

The 18 W TDP indicates this processor was designed for performance-oriented notebooks that could accommodate active cooling solutions. This positioning suggests it would outperform lower-clock, lower-TDP mobile processors in the same generation, though specific benchmark deltas cannot be stated without data. The single-threaded performance, while unremarkable by modern standards, was competitive for contemporary single-threaded workloads such as office applications and early 3D games.

FAQ

Q: What is the base clock speed of the Intel Mobile Pentium III 850?

A: The base clock speed is 850.00 MHz, with no boost clock available.

Q: How many cores and threads does this processor have?

A: It has 1 core and 1 thread, capable of processing a single instruction stream simultaneously.

Q: What socket does the Mobile Pentium III 850 use?

A: It uses Intel Socket 495, which is specific to mobile Pentium III processors.

Q: Does this processor include integrated graphics?

A: No, integrated graphics are a chipset feature available on certain motherboards, not built into the processor itself.

Q: What is the thermal design power (TDP) of this processor?

A: The TDP is 18 W, which is relatively low and suitable for mobile notebook designs.

Q: Is ECC memory supported?

A: No, ECC memory is not supported by this processor.

Q: What is the manufacturing process for this chip?

A: It is built on a 180 nm process node with 28 million transistors on a 106 mm² die.

Q: When was this processor released?

A: The release date was 2000-09-24, and it is now end-of-life with production discontinued.

Who Should Consider It

The Mobile Pentium III 850 is a historical processor, and its target audience today is collectors, retro computing enthusiasts, and individuals maintaining legacy notebook systems. For those restoring or using early 2000s laptops, this processor offers a balance of performance and power efficiency that was well-suited for its era. The 850 MHz clock speed and 256 KB L2 cache provide adequate processing power for period-appropriate software, including Windows 98/2000 applications, office productivity suites, and early 2000s games that do not demand multi-core processing.

Mobile workstation users of the era would find this processor capable of handling productivity tasks such as word processing, spreadsheet calculations, and web browsing with the browsers available at the time. The 18 W TDP makes it suitable for notebooks with modest cooling solutions, enabling thinner and lighter designs compared to higher-power desktop-derived processors. The single-channel memory bus, while limiting memory bandwidth, is sufficient for the applications that this processor can realistically run.

For gaming, the processor's single-core design means it can run games from its contemporary period, particularly titles released before 2003 that were optimized for single-threaded performance. The lack of integrated graphics means a compatible chipset or discrete graphics card is required for any display output, which is a consideration for system builders. The 50th percentile ranking indicates this processor was not at the extreme high end even in its own time, but it represented a solid mid-to-upper tier mobile option.

The processor is not suitable for modern workloads such as video editing, 3D rendering, or contemporary web browsing, which require multiple cores and significantly higher clock speeds. Its 1 core and 1 thread configuration cannot handle parallel processing demands of current software. The end-of-life status means replacement parts are scarce, and the Socket 495 platform offers no meaningful upgrade path. For anyone building a new system, this processor is not a practical choice; its value lies entirely in historical preservation and period-accurate computing experiences. The 18 W TDP, while low by modern standards, is still higher than many contemporary low-power mobile chips, but the architectural differences make direct comparisons irrelevant. Ultimately, the Mobile Pentium III 850 serves a niche audience of retro computing enthusiasts who value authenticity over performance.

The AMD Equivalent of Mobile Pentium III 850

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD • 4 Cores

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