INTEL

Intel Mobile Pentium III 850

Intel processor specifications and benchmark scores

1
Cores
1
Threads
โ€”
GHz Boost
18W
TDP
๐Ÿ–ฅ๏ธIntegrated GPU

Intel Mobile Pentium III 850 Specifications

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Mobile Pentium III 850 Core Configuration

Processing cores and threading

The Intel Mobile Pentium III 850 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1
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Mobile Pentium III 850 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Mobile Pentium III 850 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Mobile Pentium III 850 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
850 GHz
Boost Clock
N/A
Multiplier
8.5x
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Intel's Mobile Pentium III 850 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Mobile Pentium III 850 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Mobile Pentium III 850's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
256 KB
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P6 Architecture & Process

Manufacturing and design details

The Intel Mobile Pentium III 850 is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Mobile Pentium III 850 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Coppermine
Process Node
180 nm
Foundry
Intel
Transistors
28 million
Die Size
106 mmยฒ
Generation
Pentium III (Coppermine)
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P6 Instruction Set Features

Supported CPU instructions and extensions

The Mobile Pentium III 850 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
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Mobile Pentium III 850 Power & Thermal

TDP and power specifications

The Intel Mobile Pentium III 850 has a TDP (Thermal Design Power) of 18W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
18W
Tj Max
100ยฐC
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Intel Socket 495 Platform & Socket

Compatibility information

The Mobile Pentium III 850 uses the Intel Socket 495 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 495
Package
ยตPGA
DDR5

Intel Socket 495 Memory Support

RAM compatibility and speeds

Memory support specifications for the Mobile Pentium III 850 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Mobile Pentium III 850 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
unknown Depends on motherboard
Memory Bus
Single-channel
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Intel's Mobile Pentium III 850 Integrated Graphics

Built-in GPU specifications

The Intel Mobile Pentium III 850 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Mobile Pentium III 850 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)
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Mobile Pentium III 850 Product Information

Release and pricing details

The Intel Mobile Pentium III 850 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Mobile Pentium III 850 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2000
Launch Price
$722
Market
Mobile
Status
End-of-life
Part Number
SL4AHSL4PSSL53LSL58P

Mobile Pentium III 850 Benchmark Scores

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No benchmark data available for this CPU.

About Intel Mobile Pentium III 850

The Intel Mobile Pentium III 850 stands out with its 180 nm manufacturing process, a hallmark of Intel's Coppermine architecture in the Pentium III generation. This process node enabled efficient single-core performance at a base clock of 850 MHz while maintaining a low TDP of 18W for mobile applications. Designed for Intel Socket 495, the Intel Intel Mobile Pentium III 850 delivered reliable power for laptops of its era, launched on September 25, 2000, at a price of $722. Its single-threaded design focused on clock speed and SSE instructions for enhanced multimedia tasks. Engineers optimized the 180 nm fab for thermal efficiency, crucial in battery-powered devices. Overall, this process balanced cost and performance effectively for early 2000s mobile computing.

Performance metrics for the Intel Intel Mobile Pentium III 850 highlight its 850 MHz clock speed, supporting one core and one thread without hyper-threading. It competed well against contemporaries like AMD's mobile Athlons in single-threaded workloads such as office apps and light gaming. The 256KB L2 cache aided in quick data access, though no modern benchmarks exist due to its age. Power draw at 18W positioned it favorably for extended battery life compared to desktop siblings. In competitive positioning, it held ground in enterprise laptops where Intel compatibility reigned supreme. Real-world tests from 2000 showed solid SPEC scores for its class, underscoring capable everyday performance.

Upgrade considerations for the Intel Mobile Pentium III 850 are limited by its Socket 495 and 180 nm design, incompatible with later platforms. Users eyeing upgrades should target Pentium M or Core Duo for significant leaps in efficiency and multi-core power. Competitive alternatives included VIA C3 for ultra-low power but inferior performance. Key factors include:

  • Socket lock-in prevents drop-in replacements without motherboard swaps.
  • Shift to 130 nm or smaller nodes in successors for better perf-per-watt.
  • Modern emulation via software handles legacy Pentium III tasks effortlessly.

Retaining the Intel Intel Mobile Pentium III 850 suits collectors or vintage restores, but performance demands favor full system overhauls. Socket evolution demands planning for any path forward.

The AMD Equivalent of Mobile Pentium III 850

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD โ€ข 4 Cores

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