INTEL

Intel Mobile Pentium III 700

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
15W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 700 GHz
TDP 15W
Architecture P6
Socket Intel Micro-BGA2
nm
Process 180 nm
Released Apr 2000

Intel Mobile Pentium III 700 Specifications

Mobile Pentium III 700 Core Configuration

Processing cores and threading

The Intel Mobile Pentium III 700 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Mobile Pentium III 700 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Mobile Pentium III 700 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Mobile Pentium III 700 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
700 GHz
Boost Clock
N/A
Multiplier
7x

Intel's Mobile Pentium III 700 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Mobile Pentium III 700 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Mobile Pentium III 700's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
256 KB

P6 Architecture & Process

Manufacturing and design details

The Intel Mobile Pentium III 700 is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Mobile Pentium III 700 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Coppermine
Process Node
180 nm
Foundry
Intel
Transistors
28 million
Die Size
106 mm²
Generation
Pentium III (Coppermine)

P6 Instruction Set Features

Supported CPU instructions and extensions

The Mobile Pentium III 700 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE

Mobile Pentium III 700 Power & Thermal

TDP and power specifications

The Intel Mobile Pentium III 700 has a TDP (Thermal Design Power) of 15W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
15W
Tj Max
100°C

Intel Micro-BGA2 Platform & Socket

Compatibility information

The Mobile Pentium III 700 uses the Intel Micro-BGA2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Micro-BGA2
Package
H-PBGA495
DDR5

Intel Micro-BGA2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Mobile Pentium III 700 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Mobile Pentium III 700 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
unknown Depends on motherboard
Memory Bus
Single-channel

Intel's Mobile Pentium III 700 Integrated Graphics

Built-in GPU specifications

The Intel Mobile Pentium III 700 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Mobile Pentium III 700 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Mobile Pentium III 700 Product Information

Release and pricing details

The Intel Mobile Pentium III 700 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Mobile Pentium III 700 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Apr 2000
Launch Price
$562
Market
Mobile
Status
End-of-life
Part Number
SL3Z7SL4JKSL56R

Mobile Pentium III 700 Benchmark Scores

No benchmark data available for this CPU.

About Intel Mobile Pentium III 700

The Intel Mobile Pentium III 700 is a single-core, single-thread mobile processor built on the P6 architecture, specifically the Coppermine core, using a 180 nm process from Intel. It operates at a base clock of 700.00 MHz, contains 28 million transistors on a 106 mm² die, and offers 32 KB of L1 cache alongside 256 KB of L2 cache. This part sits in the 50th percentile of all CPUs in the database, indicating a median performance tier for its era, though it carries no benchmark scores of its own in the data.

How It Compares

The FACT PACK lists no nearest rivals for the Intel Mobile Pentium III 700, meaning the database provides no direct comparative scores or delta percentages against other processors. Consequently, its positioning must be inferred from its percentile rank and architectural traits. At the 50th percentile, this CPU sits exactly at the midpoint of all recorded processors, suggesting it neither leads nor lags the typical hardware of its generation. Without rival names or scores, the data cannot establish a concrete hierarchy, but the percentile implies a balanced, middle-of-the-road standing relative to the broader CPU landscape.

Given the absence of nearestRivals entries, any comparison against specific competing parts is impossible from the provided facts. The processor’s classification as a mobile Pentium III with a single core and modest 700 MHz clock places it in a category of early low-power laptops, but the benchmark database does not enumerate its direct competitors. The 50th percentile figure acts as a general anchor: half of all CPUs in the database rank above it, half below, which is consistent with a mainstream mobile chip of its time rather than a flagship or entry-level outlier.

Without rival deltas, the only quantitative comparison available is the percentile itself. This value suggests that the Mobile Pentium III 700 performs at a level typical of the average CPU in the database, which for a mobile part from 2000 implies reasonable capability for contemporary tasks like basic productivity and light web use. The lack of nearest rivals means no claims about being ahead of or behind specific models can be substantiated, so the analysis rests solely on its median position.

Power and Thermals

The Intel Mobile Pentium III 700 has a thermal design power (TDP) of 15 watts. This figure places it in the low-power class for mobile processors, typical of early 2000s laptop chips designed to balance performance with battery life. A 15W TDP indicates that a modest cooling solution is sufficient—likely a small heatsink with a low-speed fan or even passive cooling on some motherboards, given the chip’s modest clock speed and single-core design.

For a mobile part, this TDP translates to manageable heat dissipation within a compact chassis. The architecture’s 180 nm process, while large by modern standards, was contemporary for its release and allowed the 15W envelope to be met without exotic cooling. The data shows no boost clock, so the chip runs at a fixed 700.00 MHz, which further simplifies thermal management—there are no transient power spikes from frequency scaling.

The absence of integrated graphics on the CPU itself (noted as a chipset feature on certain motherboards) means the thermal load is confined to the processor core alone, keeping temperatures lower than a combined CPU-GPU package would. For system builders, a 15W TDP implies that a capable air cooler, such as a small aluminum heatsink, is adequate; no liquid cooling or high-end thermal solutions are warranted. This aligns with the mobile market segment, where power efficiency trumps raw thermal headroom.

Benchmark Performance

The FACT PACK reports an average benchmark score of 0 for the Intel Mobile Pentium III 700, with no individual benchmark results listed. This zero score is not a performance measurement but rather an indication that no data was collected or normalized for this processor. Consequently, the chip’s raw performance cannot be quantified through the database’s scoring system, and no direct deltas against rivals are available due to the empty nearestRivals array.

Given the 50th percentile rank, the processor’s performance is interpreted as median within the database’s full CPU population. In practical terms, a single core at 700.00 MHz with 256 KB of L2 cache suggests it handles single-threaded workloads—such as word processing, spreadsheet calculations, or older 2D games—at a level comparable to the average CPU of its era. The P6 architecture’s efficiency and the Coppermine core’s improved latency over earlier Pentium III designs likely contribute to this mid-tier standing.

Benchmark results from the database cannot be cited because none exist, so the analysis leans on the clock speed and cache configuration. A 700 MHz clock, paired with 32 KB L1 and 256 KB L2 caches, indicates a balanced design for its time—sufficient for office applications and light multitasking, but not suited for demanding 3D rendering or video encoding, which would require higher clock speeds or multiple cores. The lack of boost clock means no dynamic performance headroom, so sustained workloads run at a constant speed.

The percentile figure of 50 remains the only quantitative performance proxy. It implies that in a mixed dataset of desktop and mobile CPUs, this chip lands exactly at the median, meaning it outperforms the bottom half of all processors but trails the top half. For a mobile part, that is a respectable position, as laptop CPUs historically lag desktop counterparts in raw speed. The data does not support any claims of being a leader or laggard relative to named rivals.

Platform and Compatibility

The Intel Mobile Pentium III 700 uses the Intel Micro-BGA2 socket, a ball-grid array package designed for soldered installation on laptop motherboards. This socket is not user-upgradeable in the traditional sense, as Micro-BGA2 chips are typically fixed to the board, limiting the processor’s upgrade path to the motherboard’s lifespan. The architecture is P6, codenamed Coppermine, which represents Intel’s third generation of Pentium III processors, released with a 180 nm process node.

Memory support is listed as “unknown” and explicitly depends on the motherboard, with a single-channel memory bus. This means the CPU’s memory controller (or, more accurately, the motherboard’s chipset) dictates the RAM type and speed, which are not specified in the FACT PACK. ECC memory is not supported, indicating this is aimed at consumer or mainstream mobile use rather than error-correcting server workloads. The single-channel configuration limits memory bandwidth, though for a 700 MHz processor, this was typical and adequate for contemporary applications.

PCIe support is not specified, which suggests the processor predates or lacks a direct PCIe interface—likely relying on older bus standards like AGP or PCI for expansion, though these are not detailed. Integrated graphics are not on the CPU die but are available as a chipset feature on certain motherboards, meaning the processor itself cannot output video without a companion chip. The production status is end-of-life, and the release date is 2000-04-23, marking it as a product from the early Pentium III era.

The upgrade path is effectively nonexistent due to the BGA2 socket and soldered nature; users would need to replace the entire motherboard to change CPUs. The part number includes SL3Z7, SL4JK, and SL56R, indicating multiple steppings, but these do not affect compatibility. For a mobile platform, this chip’s compatibility is tied to the motherboard’s chipset, which determines memory and graphics support, but the FACT PACK provides no further specifics on those chipset features.

Who Should Consider It

Given its 50th percentile ranking and single-core design, the Intel Mobile Pentium III 700 is suited for basic productivity tasks—word processing, spreadsheet management, and email—where a single 700 MHz core with 256 KB of L2 cache is sufficient. The 15W TDP makes it appropriate for lightweight laptops prioritizing battery life over performance, and its mobile segment confirms this intent. Users running legacy operating systems or simple applications from the early 2000s would find this chip adequate.

For gaming, the processor’s capabilities are limited to older 2D titles or very early 3D games that do not demand high clock speeds or multiple cores. The lack of integrated graphics on the CPU itself means a compatible chipset with graphics support is required, which constrains gaming viability further. The data shows no benchmark scores, so any gaming claim must be conservative—this is not a gaming processor by modern standards, but it could handle era-appropriate casual games.

Creation workloads like video editing or 3D rendering are not recommended, as the single core and 700 MHz clock would result in very long render times. The 32 KB L1 and 256 KB L2 caches offer limited data throughput, and the single-channel memory bus further bottlenecks memory-intensive tasks. The 50th percentile rank places it below the top half of all CPUs, which includes many desktop parts better suited for creation.

Office users running standard productivity suites, web browsing with simple pages, and light multitasking would find the Mobile Pentium III 700 serviceable. Its 15W TDP means it runs cool and quiet, extending battery life in laptops—a key advantage for mobile professionals of that era. However, anyone needing modern software compatibility or performance would need to look elsewhere, as this chip is end-of-life and lacks features like multi-core support or fast memory interfaces.

In summary, the Mobile Pentium III 700 is a median performer for its time, best suited for basic computing in a mobile form factor. It is not a high-end part, and its 50th percentile standing reflects a balanced, mid-tier position. The launch MSRP is $562, which was a premium price for a mobile CPU in 2000, but the data shows no benchmarks to justify that cost today beyond its historical context.

The AMD Equivalent of Mobile Pentium III 700

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD • 4 Cores

View Specs Compare

Popular Intel Mobile Pentium III 700 Comparisons

See how the Mobile Pentium III 700 stacks up against similar processors from the same generation and competing brands.

Compare Mobile Pentium III 700 with Other CPUs

Select another CPU to compare specifications and benchmarks side-by-side.

Browse CPUs