Intel Core i7-8670
Intel processor specifications and benchmark scores
Integrated GPUAt a Glance
IntelIntel Core i7-8670 Specifications
Core i7-8670 Core Configuration
Processing cores and threading
The Intel Core i7-8670 features 6 physical cores and 12 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
i7-8670 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Core i7-8670 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i7-8670 by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Core i7-8670 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the i7-8670 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i7-8670's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Coffee Lake Architecture & Process
Manufacturing and design details
The Intel Core i7-8670 is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i7-8670 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Coffee Lake Instruction Set Features
Supported CPU instructions and extensions
The Core i7-8670 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Power & Thermal
TDP and power specifications
The Intel Core i7-8670 has a TDP (Thermal Design Power) of 65W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 1151 Platform & Socket
Compatibility information
The Core i7-8670 uses the Intel Socket 1151 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 1151 Memory Support
RAM compatibility and speeds
Memory support specifications for the i7-8670 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i7-8670 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Intel's Core i7-8670 Integrated Graphics
Built-in GPU specifications
The Intel Core i7-8670 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i7-8670 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Product Information
Release and pricing details
The Intel Core i7-8670 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i7-8670 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
About Intel Core i7-8670
The Intel Core i7-8670 is a desktop Coffee Lake processor from Intel, listed as an Intel Socket 1151 part. Its architecture and codename fields both read Coffee Lake, and its generation field is Core i7 (Coffee Lake). The process node is 14 nm, the market segment is Desktop, and the production status is End-of-life, with the release-date field indicating late 2017. The processor has 6 cores and 12 threads, a base clock of 3.10, a boost clock of 4.40, and a TDP of 65. Its cache hierarchy is 64 KB L1 per core, 256 KB L2 per core, and 12 MB shared L3. It supports dual-channel DDR4 memory with 42.7 GB/s of bandwidth. The CPU-side PCIe interface is Gen 3, 16 lanes. Integrated graphics are provided by UHD Graphics 630. The multiplier is not unlocked, and ECC memory is not supported. The database record also lists percentileVsAllCpus as 50, avgBenchmarkScore as 0, and both the benchmarks array and nearestRivals array as empty.
Single-Thread vs Multi-Thread Behavior
The behavioral split begins with the clock fields. The 4.40 boost clock is the highest advertised clock in the record, representing the natural reference for workloads that depend on a single thread. The 3.10 base clock is the lower advertised frequency and serves as the baseline for sustained operation. The record does not include an all-core boost frequency, so the multi-thread side is defined primarily by the 6-core and 12-thread configuration rather than by a published all-core clock.
Each core has 64 KB of L1 cache and 256 KB of L2 cache. The L3 cache is 12 MB shared across all cores. This layout gives each individual core a private low-level working set while providing a common data pool for all 12 threads. For real workloads, this creates a meaningful structural distinction: a lightly threaded task can aim at the 4.40 boost ceiling, while a heavily threaded task can engage all 12 threads and share the 12 MB L3.
The memory system is part of the same story. The processor supports DDR4 memory on a dual-channel bus with 42.7 GB/s of bandwidth. That bandwidth is the aggregate pathway between memory and all cores, whether one thread is running at the 4.40 boost clock or a multi-threaded workload is spread across 12 threads. The 12 MB shared L3 also reduces how often those threads need to cross the memory interface, assuming the working set fits in cache.
Without benchmark scores, the practical magnitude of the single-thread versus multi-thread split cannot be quantified from this record. What can be said from the specification data is that the processor is configured for both modes: a high single-thread clock of 4.40 and a 6-core, 12-thread topology for parallel work. The absence of a separate all-core clock field leaves the multi-thread frequency behavior unspecified.
Who Should Consider It
Because no benchmark scores are attached, recommendations must be based on the specification fields rather than measured results. Builders targeting the Intel Socket 1151 platform can consider this part as a 6-core, 12-thread desktop CPU. The 4.40 boost clock is the specification most relevant to workloads that are constrained by a single core. The 6-core and 12-thread counts, together with the 12 MB shared L3, are relevant to workloads that scale across cores.
For gaming, the 4.40 boost clock is the headline value. The integrated UHD Graphics 630 provides a display output path without requiring a discrete adapter, but the fact pack contains no gaming benchmark or frame-rate data to convert that specification into a performance ranking. For creation workloads that parallelize across cores, the relevant values are 12 threads, 12 MB shared L3, and the dual-channel DDR4 bandwidth of 42.7 GB/s. The record has no render or content-creation scores, so no ranking against rivals is possible from the fact pack.
For office and lighter desktop workloads, the integrated UHD Graphics 630 and the 4.40 boost clock are the main assets. The 65 TDP and 14 nm process indicate a conventional desktop power envelope. The end-of-life status, however, is an important context: the part is not an active new-platform entry in the database. The locked multiplier also removes unlocked overclocking from the feature set. Users who require ECC memory must look elsewhere, since ECC support is false, and the CPU-side PCIe interface is limited to Gen 3, 16 lanes.
Benchmark Performance
The benchmark section of this record is empty. The benchmarks array has no entries, avgBenchmarkScore is 0, and nearestRivals is an empty array. As a result, there are no rival names and no deltaPct values in this fact pack. No exact percentage lead or deficit over any competitor can be stated from this data.
The only comparative value present is percentileVsAllCpus: 50. This places the processor at the midpoint of the all-CPU distribution in the database. A percentile of this type is a rank position, not a measured margin. It does not indicate how far above or below any named rival the processor sits, and it cannot be used to calculate a percentage difference between this CPU and another SKU.
The avgBenchmarkScore of 0 reinforces that no aggregated workload scores are present in this record. In practical terms, all benchmark-based comparisons for this processor are unsupported by the current fact pack. The specification profile is complete enough for structural analysis, but the database does not supply the measured scores or nearest-rival deltas needed for percentage comparisons.
FAQ
Q: What socket does the Intel Core i7-8670 use?
A: The processor uses the Intel Socket 1151.
Q: How many cores and threads does it have?
A: The processor has 6 cores and 12 threads.
Q: Does it include integrated graphics?
A: Yes, the integrated graphics field is UHD Graphics 630.
Q: What memory configuration is supported?
A: The processor supports dual-channel DDR4 memory with a listed bandwidth of 42.7 GB/s. ECC memory is not supported.
Q: Is the multiplier unlocked?
A: No, the multiplierUnlocked field is false.
Q: What is the processor's TDP?
A: The TDP field is 65.
Power and Thermals
The power and thermal profile begins with the 65 TDP value. This is the only power-related figure in the fact pack, and it is the design point that a cooling solution must address. The 14 nm process is the manufacturing node for this part. The base clock is 3.10 and the boost clock is 4.40, both operating within the same 65 TDP part. The integrated UHD Graphics 630 is also part of the processor, so display and compute workloads share the same 65 TDP envelope when the graphics block is active.
The memory and I/O resources contribute to the platform-level power picture. The dual-channel DDR4 interface with 42.7 GB/s of bandwidth and the Gen 3, 16-lane PCIe interface are all associated with this Socket 1151 processor. The 65 TDP class implies a mainstream desktop cooling tier. The fact pack does not include a cooler size, radiator specification, or thermal test result, so no more specific cooling recommendation is possible from the data.
The locked multiplier removes overclocking as a source of additional thermal demand. The end-of-life production status also affects context: this thermal profile is relevant to an existing platform rather than a newly selected one. In summary, the 65 TDP field is the anchor for cooling decisions, and no other power or thermal measurements are present in the record.
Detailed benchmark scores and charts for the Intel Core i7-8670 are below.
Benchmark Scores
No benchmark data available for this CPU.
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