INTEL

Intel Core i3-2340UE

Intel processor specifications and benchmark scores

2
Cores
4
Threads
GHz Boost
17W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 2C / 4T
Base Clock 1300 GHz
L3 Cache 3 MB (shared)
TDP 17W
Architecture Sandy Bridge
Socket Intel BGA 1023
nm
Process 32 nm
Released Jun 2011

Intel Core i3-2340UE Specifications

Core i3-2340UE Core Configuration

Processing cores and threading

The Intel Core i3-2340UE features 2 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
4
SMP CPUs
1

i3-2340UE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core i3-2340UE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i3-2340UE by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
N/A
Multiplier
13x

Intel's Core i3-2340UE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the i3-2340UE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i3-2340UE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
3 MB (shared)

Sandy Bridge Architecture & Process

Manufacturing and design details

The Intel Core i3-2340UE is built on Intel's 32 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i3-2340UE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Sandy Bridge
Codename
Sandy Bridge
Process Node
32 nm
Foundry
Intel
Transistors
624 million
Die Size
149 mm²
Generation
Core i3 (Sandy Bridge)

Sandy Bridge Instruction Set Features

Supported CPU instructions and extensions

The Core i3-2340UE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AES-NI
Intel 64
VT-x
VT-d

i3-2340UE Power & Thermal

TDP and power specifications

The Intel Core i3-2340UE has a TDP (Thermal Design Power) of 17W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
17W

Intel BGA 1023 Platform & Socket

Compatibility information

The Core i3-2340UE uses the Intel BGA 1023 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 1023
Package
rPGA
DDR5

Intel BGA 1023 Memory Support

RAM compatibility and speeds

Memory support specifications for the i3-2340UE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i3-2340UE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel

Intel's Core i3-2340UE Integrated Graphics

Built-in GPU specifications

The Intel Core i3-2340UE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i3-2340UE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel HD 3000
Graphics Model
Intel HD 3000

Core i3-2340UE Product Information

Release and pricing details

The Intel Core i3-2340UE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i3-2340UE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2011
Market
Mobile
Status
End-of-life
Part Number
SR074

Core i3-2340UE Benchmark Scores

No benchmark data available for this CPU.

About Intel Core i3-2340UE

The Intel Core i3-2340UE is a mobile processor from the Sandy Bridge generation, released in 2011. It integrates two physical cores with Hyper-Threading, yielding four logical threads, and operates at a fixed base clock of 1300 MHz. With a thermal design power (TDP) of 17 watts, it is engineered for ultra-low-power laptops and compact systems. The chip includes Intel HD 3000 integrated graphics and supports dual-channel DDR3 memory. In the benchmark database, it holds a 50th percentile rank among all CPUs, though no specific benchmark scores are recorded for this part.

Platform and Compatibility

The Core i3-2340UE uses the Intel BGA 1023 socket, a ball-grid array package designed for soldered installation on mobile motherboards. This means the processor is not user-replaceable or upgradeable; it is permanently attached to the system board. The underlying architecture is Sandy Bridge, built on a 32 nm process node, with 624 million transistors on a 149 mm² die. This places the chip in the second generation of Intel Core processors, though the "UE" suffix designates an ultra-low-power variant aimed at thin and light portable devices.

Memory support is limited to DDR3, with a dual-channel memory bus. The absence of ECC support indicates that this processor is intended for consumer or mainstream mobile use rather than error-correcting workstation or server environments. The integrated graphics solution is Intel HD 3000, which is part of the Sandy Bridge die and provides basic display output and video decode capabilities. No discrete PCIe lanes are specified in the available data, so expansion options are constrained to what the platform provides, but the processor itself does not expose a separate PCIe interface in the specifications.

As an end-of-life product, the i3-2340UE is no longer in active production. Its release date of 2011 places it in the early years of the Sandy Bridge lineup, and the part number SR074 identifies a specific stepping. The combination of a low base clock and a modest TDP suggests that this chip was designed for systems where power efficiency takes precedence over raw performance. The BGA socket and mobile market segment further reinforce that this is a soldered, low-power component intended for compact chassis.

Power and Thermals

The thermal design power (TDP) of 17 watts is a defining characteristic of this processor. This figure represents the maximum amount of heat that the cooling solution must dissipate under sustained workloads. A 17W TDP is typical for ultra-low-power mobile processors, enabling passive cooling in some chassis or a very small fan and heat pipe assembly in others. The low power draw also extends battery life in portable devices, making the i3-2340UE suitable for netbooks, thin laptops, and other compact form factors.

The 32 nm process node contributes to this efficiency, as smaller transistors generally require less voltage and produce less heat. The transistor count of 624 million and die size of 149 mm² are consistent with a dual-core Sandy Bridge design that includes integrated graphics and memory controller. The lack of a boost clock means that the processor operates at a fixed 1300 MHz frequency, which simplifies thermal management because the power envelope does not vary with turbo activity.

From a cooling standpoint, the 17W TDP allows for a low-profile cooler. In practice, this often translates to a small heatsink and a quiet fan, or even a fanless design in well-ventilated enclosures. The thermal characteristics are well within the capabilities of standard mobile cooling solutions, and the processor does not require exotic cooling methods. The data indicates that the i3-2340UE is firmly in the energy-efficient segment, prioritizing low heat output and power consumption over peak performance.

Benchmark Performance

The benchmark database does not contain any recorded performance scores for the Core i3-2340UE; the average benchmark score is listed as 0, and no individual benchmarks are provided. However, the processor's percentile rank of 50 offers a relative measure: it sits exactly at the median of all CPUs in the database, meaning half of the recorded processors are faster and half are slower. This is a broad indicator, but without actual scores, it is not possible to quantify the performance in specific workloads.

Given the specifications, the performance ceiling is limited by the 1300 MHz base clock and the dual-core, four-thread configuration. The 3 MB shared L3 cache helps mitigate memory latency, and the dual-channel DDR3 memory bus provides adequate bandwidth for the core count. The integrated HD 3000 graphics share the same memory subsystem, which can reduce available bandwidth for the CPU in graphics-intensive tasks.

In terms of raw computational throughput, the i3-2340UE would be adequate for basic productivity tasks such as web browsing, word processing, and light spreadsheet work. The lack of a boost clock means that there is no headroom for transient performance spikes; the processor runs at a constant frequency. This makes its performance predictable but also limits its ability to handle sudden bursts of demanding work. The 50th percentile ranking suggests that, despite its low clock, the processor is not at the very bottom of the performance spectrum, likely due to the benefits of Hyper-Threading and a relatively modern architecture for its time.

How It Compares

The nearestRivals list in the database is empty, so there are no direct competitor comparisons available. Consequently, the only positional reference is the 50th percentile across all CPUs. This places the i3-2340UE in the middle of the overall distribution, which is notable for a processor with such a low clock speed. The median rank likely reflects the fact that many older and less capable processors exist in the database, as well as the fact that this chip benefits from Hyper-Threading and a reasonably efficient architecture.

Without rival data, it is not possible to state specific deltas in performance. The processor's own specifications, however, allow for an internal comparison: the dual-core design with four threads gives it an advantage over single-core or dual-core parts without Hyper-Threading, but the low frequency holds it back relative to higher-clocked Sandy Bridge or later-generation processors. The integrated HD 3000 graphics also provide a baseline level of GPU capability, which can offload some tasks from the CPU.

In the context of its release year, 2011, the i3-2340UE would have been positioned as an entry-level mobile chip. Its 17W TDP and BGA socket are typical of ultra-portable designs. The lack of a boost clock further differentiates it from other i3 variants that might have higher base frequencies, but those are not listed as rivals. The data does not support any direct comparisons, so the analysis must rely on the processor's own characteristics and its overall percentile standing.

Single-Thread vs Multi-Thread Behavior

The Core i3-2340UE has two physical cores and four logical threads via Hyper-Threading. The base clock of 1300 MHz applies to both cores, and there is no turbo boost to increase frequency on a single core. This means that single-threaded performance is entirely dependent on the 1300 MHz clock and the architectural efficiency of Sandy Bridge. With a modest frequency, the processor will deliver lower per-core throughput compared to higher-clocked parts, making it less suitable for workloads that rely on a single thread, such as legacy applications or certain simulation tasks.

Multi-threaded performance benefits from the four logical threads, allowing the operating system to schedule work across four hardware contexts. However, the physical core count is still two, so the scaling from two to four threads is limited by the shared execution resources within each core. The 3 MB shared L3 cache is a positive factor, as it reduces the need to access main memory when multiple threads operate on the same data set. The dual-channel DDR3 memory bus provides sufficient bandwidth for most multi-threaded workloads, though it is shared with the integrated graphics.

In practice, the processor will show better relative performance in multi-threaded tasks that can utilize four threads, such as video encoding or multi-tabbed web browsing, compared to single-threaded tasks like JavaScript execution or certain older games. The lack of a boost clock means that the processor cannot dynamically shift power to one core, so single-threaded performance remains constant. This makes the i3-2340UE a predictable but not particularly strong performer in either category. The 50th percentile overall ranking suggests that its multi-threaded capabilities, combined with its low power draw, make it a balanced choice for basic mobile computing, but it will not excel in demanding applications.

The AMD Equivalent of Core i3-2340UE

Looking for a similar processor from AMD? The AMD Ryzen 3 PRO 1200 offers comparable performance and features in the AMD lineup.

AMD Ryzen 3 PRO 1200

AMD • 4 Cores

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