INTEL

Intel Core i3-2340UE

Intel processor specifications and benchmark scores

2
Cores
4
Threads
GHz Boost
17W
TDP
🖥️Integrated GPU

Intel Core i3-2340UE Specifications

⚙️

Core i3-2340UE Core Configuration

Processing cores and threading

The Intel Core i3-2340UE features 2 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
4
SMP CPUs
1
⏱️

i3-2340UE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core i3-2340UE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i3-2340UE by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
N/A
Multiplier
13x
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Intel's Core i3-2340UE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the i3-2340UE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i3-2340UE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
3 MB (shared)
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Sandy Bridge Architecture & Process

Manufacturing and design details

The Intel Core i3-2340UE is built on Intel's 32 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i3-2340UE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Sandy Bridge
Codename
Sandy Bridge
Process Node
32 nm
Foundry
Intel
Transistors
624 million
Die Size
149 mm²
Generation
Core i3 (Sandy Bridge)
🔢

Sandy Bridge Instruction Set Features

Supported CPU instructions and extensions

The Core i3-2340UE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AES-NI
Intel 64
VT-x
VT-d
🔌

i3-2340UE Power & Thermal

TDP and power specifications

The Intel Core i3-2340UE has a TDP (Thermal Design Power) of 17W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
17W
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Intel BGA 1023 Platform & Socket

Compatibility information

The Core i3-2340UE uses the Intel BGA 1023 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 1023
Package
rPGA
DDR5

Intel BGA 1023 Memory Support

RAM compatibility and speeds

Memory support specifications for the i3-2340UE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i3-2340UE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel
🖥️

Intel's Core i3-2340UE Integrated Graphics

Built-in GPU specifications

The Intel Core i3-2340UE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i3-2340UE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel HD 3000
Graphics Model
Intel HD 3000
📦

Core i3-2340UE Product Information

Release and pricing details

The Intel Core i3-2340UE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i3-2340UE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2011
Market
Mobile
Status
End-of-life
Part Number
SR074

Core i3-2340UE Benchmark Scores

📊

No benchmark data available for this CPU.

About Intel Core i3-2340UE

The Intel Core i3-2340UE, a dual-core processor from Intel’s Sandy Bridge generation, presents an intriguing case study in low-power computing efficiency. This particular model, officially designated as the i3-2340UE, features a base clock speed of 1.30 GHz deliberately conservative to align with its ultra-low 17W TDP, which makes it ideal for environments where thermal headroom is constrained. Despite having only two physical cores, the chip supports Hyper-Threading, enabling four simultaneous threads a configuration that enhances multitasking and light parallel workloads. Manufactured on a 32 nm process, the i3-2340UE exemplifies early 2010s design trade-offs between performance, power, and integration density. Its 3 MB of shared L3 cache provides a modest but functional pool for data sharing between cores, though modern applications might find this limiting. Released in June 2011, this BGA-1023 socket-only CPU was never intended for mainstream desktops but rather for specialized, compact systems. As an embedded variant of the Core i3 lineup, the 2340UE reflects Intel’s push into fanless and space-constrained computing niches.
  • The Intel Core i3-2340UE’s dual-core, four-thread layout leverages Hyper-Threading to maintain responsiveness in multitasking scenarios despite limited core count.
  • Running at a fixed 1.30 GHz without Turbo Boost, the processor prioritizes thermal stability over peak performance, typical of its ultra-low power class.
  • With a TDP of just 17 watts, the i3-2340UE is engineered for passive cooling solutions and silent operation in embedded or industrial systems.
  • The 32 nm fabrication process, while outdated by today’s standards, was a hallmark of Sandy Bridge’s improved power efficiency and integrated graphics.
  • Shared 3 MB L3 cache aids in reducing memory latency for basic computational tasks but may bottleneck data-intensive applications.
  • Target applications include digital signage, kiosks, thin clients, and compact industrial controllers where reliability and low power trump raw performance.

The AMD Equivalent of Core i3-2340UE

Looking for a similar processor from AMD? The AMD Ryzen 3 PRO 1200 offers comparable performance and features in the AMD lineup.

AMD Ryzen 3 PRO 1200

AMD • 4 Cores

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