Intel Core Duo T2300
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Core Duo T2300 Specifications
Core Duo T2300 Core Configuration
Processing cores and threading
The Intel Core Duo T2300 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Duo T2300 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Core Duo T2300 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core Duo T2300 by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Core Duo T2300 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Duo T2300 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core Duo T2300's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Core Architecture & Process
Manufacturing and design details
The Intel Core Duo T2300 is built on Intel's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Duo T2300 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Core Instruction Set Features
Supported CPU instructions and extensions
The Core Duo T2300 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Duo T2300 Power & Thermal
TDP and power specifications
The Intel Core Duo T2300 has a TDP (Thermal Design Power) of 31W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 479 Platform & Socket
Compatibility information
The Core Duo T2300 uses the Intel Socket 479 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 479 Memory Support
RAM compatibility and speeds
Memory support specifications for the Duo T2300 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core Duo T2300 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Intel's Core Duo T2300 Integrated Graphics
Built-in GPU specifications
The Intel Core Duo T2300 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Duo T2300 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Core Duo T2300 Product Information
Release and pricing details
The Intel Core Duo T2300 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core Duo T2300 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
Core Duo T2300 Benchmark Scores
No benchmark data available for this CPU.
About Intel Core Duo T2300
The Intel Core Duo T2300 is a 2-core, 2-thread mobile processor built on the Core architecture with the codename Yonah, manufactured on a 65 nm process node. It runs at a base clock of 1660 MHz with no boost capability, carries a 31 W TDP, and uses the Intel Socket 479. The database places it at the 50th percentile among all CPUs, with an average benchmark score of 0, which indicates a lack of recorded benchmark submissions rather than a performance null. It is end-of-life and targets the mobile market segment, with a release date of January 4, 2006.
Benchmark Performance
The benchmark data for the T2300 is sparse. The average benchmark score is 0, meaning no valid benchmark runs are recorded in the database. The 50th percentile standing indicates that, in the absence of direct scores, it sits exactly at the median of all CPUs tracked by the database. This percentile is a positional measure, not a performance measure, and it reflects the distribution of all processors, including desktop and server parts. Without any nearestRivals entries, there are no deltaPct values to compute. The 0 average score suggests that the T2300 has not been subjected to the standardized benchmark suite, or that its results have been voided. Consequently, any interpretation of raw performance must rely on architectural attributes: 2 cores, 2 threads, and a 1660 MHz base clock. The lack of a boost clock means sustained performance is equal to the base frequency. The 64 KB L1 cache and 2 MB L2 cache are the only cache tiers present, with no L3. This configuration is typical of early dual-core mobile parts. The 50th percentile is a global rank, and since the T2300 is a mobile part from 2006, its position reflects the entire historical database. The data shows no comparative deltas to any rival, so absolute performance claims cannot be made. The 0 score is a placeholder, not a zero-performance rating. The absence of benchmark entries also means that the processor's real-world throughput cannot be quantified against any other part. The 2 MB L2 cache is shared between the two cores, which is a notable design choice for the era, but without measured scores, its impact remains theoretical. The 1660 MHz clock is modest, and the lack of a boost clock means there is no headroom for transient workloads. The 50th percentile position is a neutral placement, indicating that the T2300 is neither a high performer nor a low performer in the historical context of all CPUs. However, this percentile is based on the entire database population, not on a like-for-like comparison with mobile contemporaries. The data implies that the T2300's performance is undocumented, and any claims about its speed relative to other processors cannot be substantiated from the fact pack alone.
Platform and Compatibility
The T2300 uses the Intel Socket 479 interface, which is a specific mobile socket. It supports DDR1 memory, with no memory bus or bandwidth figures provided in the fact pack. ECC memory is not supported. The processor does not list a PCIe specification, so no PCIe lane count or version can be stated. Integrated graphics are available "on certain motherboards" as a chipset feature, meaning the processor itself does not contain a GPU, but the platform can provide display output through the chipset. The architecture is Core, with the codename Yonah, and the generation is listed as "Core Duo (Yonah)". The process node is 65 nm, with 151 million transistors on a 90 mm² die. The production status is end-of-life, meaning it is no longer manufactured. The release date is January 4, 2006. The part number is SL8VR. The multiplier is locked, so overclocking is not possible. The upgrade path is constrained by the Socket 479 interface and the end-of-life status. Since the fact pack lists no other Socket 479 processors, the upgrade path is limited to whatever compatible parts exist, but none are specified. Memory support is limited to DDR1, which is an older standard. The lack of a PCIe field suggests that the chipset handles I/O, but no specifics are given. The 65 nm process node and 90 mm² die size are defining physical characteristics. The 151 million transistor count is a measure of the design's complexity. The locked multiplier means that the 1660 MHz base clock is the maximum achievable frequency. The integrated graphics being a chipset feature implies that the motherboard chipset is responsible for display output, which is a platform-level capability rather than a processor feature. The absence of ECC support indicates that the T2300 is not intended for error-correcting memory workloads. The DDR1 memory support is a legacy standard, and the lack of a memory bus figure means the theoretical bandwidth cannot be stated. The platform is thus a closed, mobile-focused design with limited expansion options.
Power and Thermals
The T2300 has a TDP of 31 W. This is a low-power envelope, typical for mobile processors of its era. The 31 W figure indicates that a modest cooling solution is sufficient; a small heat sink and fan, or a passive cooler in a well-ventilated chassis, would likely handle the thermal load. The 65 nm process node contributes to the relatively low power draw. The TDP class is mobile, and the processor is designed for laptops and other portable systems. The fact pack does not provide a boost clock, so there is no transient power spike to consider; the power draw is steady at the base clock. The 31 W TDP also implies that thermal throttling is unlikely under normal conditions, given adequate cooling. The lack of an unlocked multiplier means no voltage or frequency adjustments are possible from the user side, which further stabilizes the thermal profile. The 90 mm² die size and 151 million transistors are modest by modern standards, but they are consistent with the 65 nm process. For a benchmark database, the 31 W TDP places the T2300 in the low-power tier, requiring only a capable air cooler. No liquid cooling or high-end thermal solutions are necessary. The steady power draw at 1660 MHz means that the thermal load is predictable and manageable. The 31 W figure is a design specification that informs the thermal solution's minimum requirement. A system builder would need to ensure adequate airflow, but the cooling burden is light. The processor's mobile market segment reinforces the expectation of a compact thermal solution. The absence of a boost clock eliminates the need for burst thermal headroom. The 65 nm process is a mature node, and the TDP reflects the efficiency of that generation. The data shows that the T2300 is a thermally modest part, suitable for thin-and-light designs of its time.
FAQ
Q: What socket does the Intel Core Duo T2300 use?
A: It uses the Intel Socket 479.
Q: What is the TDP of the T2300?
A: The TDP is 31 W.
Q: What type of memory does it support?
A: It supports DDR1 memory.
Q: Does it have integrated graphics?
A: Integrated graphics are available on certain motherboards as a chipset feature, but not on the processor itself.
Q: What is the process node and transistor count?
A: The process node is 65 nm, and it has 151 million transistors.
Q: When was it released?
A: It was released on January 4, 2006.
Q: What is the part number?
A: The part number is SL8VR.
How It Compares
The fact pack lists no nearest rivals for the Intel Core Duo T2300. Therefore, a direct comparative analysis against specific competing models is not possible from the provided data. The global percentile of 50 indicates that it sits at the median of all CPUs in the database, but without rival entries, there are no deltaPct values to reference. The average benchmark score of 0 further complicates any comparison, as no performance data is recorded. The T2300's position is thus defined by its architectural specifications—2 cores, 2 threads, 1660 MHz base clock, and 2 MB L2 cache—rather than by measured scores. In the absence of rival data, the processor's standing is purely positional. The database's percentile field is the only comparative metric available, and it shows a median placement. This is a neutral position, indicating that the T2300 is neither a high performer nor a low performer in the historical context of all CPUs. Without rivals, no statements about being ahead or behind can be made. The end-of-life status and mobile market segment further contextualize its role as a legacy part. The data shows that the T2300 is a 2-core mobile processor from the Yonah generation, and its lack of benchmark scores means any performance inference is speculative. The 50th percentile is a useful anchor, but it is not a substitute for direct comparison. The fact pack explicitly provides no rival names, scores, or deltas, so the comparative analysis must conclude that no specific rival relationships can be established from the given facts. The processor's 31 W TDP and 65 nm process are its defining characteristics, but they do not translate into a competitive ranking without benchmark data. The absence of a boost clock and locked multiplier also limit its performance ceiling. In summary, the T2300 occupies a median position in the database, but its true performance relative to contemporaries remains undocumented.
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