Intel Core 2 Duo T7300
Intel processor specifications and benchmark scores
Integrated GPUAt a Glance
IntelIntel Core 2 Duo T7300 Specifications
Core 2 Duo T7300 Core Configuration
Processing cores and threading
The Intel Core 2 Duo T7300 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
2 Duo T7300 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Core 2 Duo T7300 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core 2 Duo T7300 by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Core 2 Duo T7300 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the 2 Duo T7300 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core 2 Duo T7300's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Core 2 Architecture & Process
Manufacturing and design details
The Intel Core 2 Duo T7300 is built on Intel's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 2 Duo T7300 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Core 2 Instruction Set Features
Supported CPU instructions and extensions
The Core 2 Duo T7300 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
2 Duo T7300 Power & Thermal
TDP and power specifications
The Intel Core 2 Duo T7300 has a TDP (Thermal Design Power) of 35W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 479 Platform & Socket
Compatibility information
The Core 2 Duo T7300 uses the Intel Socket 479 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 479 Memory Support
RAM compatibility and speeds
Memory support specifications for the 2 Duo T7300 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core 2 Duo T7300 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Intel's Core 2 Duo T7300 Integrated Graphics
Built-in GPU specifications
The Intel Core 2 Duo T7300 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the 2 Duo T7300 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Core 2 Duo T7300 Product Information
Release and pricing details
The Intel Core 2 Duo T7300 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core 2 Duo T7300 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
Core 2 Duo T7300 Benchmark Scores
No benchmark data available for this CPU.
About Intel Core 2 Duo T7300
Intel Core 2 Duo T7300 is a mobile processor with 2 cores and 2 threads, based on the Core 2 architecture with the codename Merom. Its generation is listed as Core 2 Duo (Merom), manufactured by Intel on a 65 nm process with 293 million transistors on a 143 mm² die. The base clock is 2000.00, and no boost clock is recorded. Cache consists of 64 KB L1 and 4 MB L2, with no L3. The processor uses Intel Socket 479, carries a 35 W TDP, and belongs to the mobile market segment. It was released on 2006-07-26 and is now end-of-life. The benchmark list is empty, the average benchmark score is 0, and the percentile versus all CPUs is 50.
Benchmark Performance
The benchmark list in the record contains no individual entries, so there are no measured test scores to analyze. The average benchmark score is 0, which is the aggregate value stored for this processor. The percentile versus all CPUs is 50, which places the T7300 at the median of the database ranking, but that position is not accompanied by any non-zero benchmark average.
The nearestRivals list is also empty. No rival names, scores, or deltaPct values are available for comparison. Consequently, no percentage statements can be made from the data. The record does not support claims such as "X% ahead of a rival" or "X% behind a rival." The absence of the nearestRivals array means the database's comparison feature offers no measurable reference points.
The only quantitative compute details in the record are the 2-core, 2-thread configuration, the 2000.00 base clock, the 64 KB L1 cache, and the 4 MB L2 cache. The absence of a boost clock implies there is no recorded higher-frequency state. These fields describe the processor's architecture, but they are not benchmark results. The data therefore permits a configuration-level description, while the performance ranking is limited to a 50th percentile and an average benchmark score of 0.
Power and Thermals
The power and thermal record is concentrated in a 35 W TDP. That TDP class indicates a modest thermal envelope for a processor in the mobile market segment. The 65 nm process node is the manufacturing context for this die, which packs 293 million transistors across 143 mm². The 35 W figure is the only thermal boundary provided, and no cooler specifications are listed.
Because no boost clock is recorded, the thermal design is tied to the 2000.00 base clock rather than to a secondary higher-frequency state. The absence of a boost clock also means there is no additional recorded power state to account for in thermal analysis. A 35 W TDP in a mobile segment points toward a thermal solution sized for notebook-class cooling, but the data does not specify heatsink dimensions, fan type, or cooling tier. The end-of-life production status indicates that no future thermal guidance is being added to the record.
The combination of 35 W TDP, 65 nm process, and the mobile market segment forms the complete thermal picture available from the fact pack. System-level cooling decisions would need to treat the 35 W TDP as the target, since no other power or thermal number exists in the record.
Platform and Compatibility
The processor is specified for Intel Socket 479. The architecture is Core 2, the codename is Merom, and the generation is listed as Core 2 Duo (Merom). Intel is the manufacturer and the foundry. The process node is 65 nm.
The transistor count is 293 million, and the die size is 143 mm². Cache configuration is 64 KB L1 and 4 MB L2, with no L3 cache listed. Memory support is not recorded: the memory support, memory bus, and memory bandwidth fields are all absent. ECC memory is flagged as false, so error-correcting memory support is not present in the data.
PCIe information is not provided in the record, so PCIe version, lane count, or expansion capability cannot be reported. Integrated graphics are listed as "On certain motherboards (Chipset feature)", meaning graphics output is dependent on the motherboard chipset rather than a dedicated processor-integrated GPU.
The multiplier unlocked field is false, so no unlocked multiplier is documented. The part number is SLAMD. The release date is 2006-07-26, and the production status is end-of-life. The upgrade path is therefore constrained by Intel Socket 479 and by the end-of-life status. Without memory support or PCIe data, no broader platform expansion can be described from the record.
FAQ
Q: What is the socket type for the Intel Core 2 Duo T7300?
A: The processor uses Intel Socket 479.
Q: How many cores and threads does the T7300 have?
A: It has 2 cores and 2 threads, with a base clock of 2000.00 and no boost clock.
Q: What cache is listed?
A: The cache configuration is 64 KB L1 and 4 MB L2; there is no L3 cache.
Q: Does the processor support ECC memory?
A: No. The ECC memory field is false, and the record does not list memory support, memory bus, or memory bandwidth.
Q: Does the T7300 have integrated graphics?
A: Integrated graphics are listed only as a chipset feature on certain motherboards, not as a processor-integrated GPU.
Q: Is the multiplier unlocked?
A: No. The multiplier unlocked field is false, and the part number is SLAMD.
How It Compares
The nearestRivals array is empty, so there are no nearest rivals to analyze. No rival names are listed, and therefore no rival scores or deltaPct values exist in the record. The only comparative marker is the 50th percentile, which indicates a median position in the database's CPU ranking. However, the average benchmark score of 0 means that percentile is not supported by a non-zero measured average.
Because the rival list is empty, all relative performance statements based on the database's comparison fields are impossible. There is no named competitor against which the T7300 can be called faster or slower. The processor's position is therefore expressed only by the 50th percentile, the 2-core, 2-thread layout, the 2000.00 base clock, and the 4 MB L2 cache. Without measured scores, the comparison section cannot go beyond the fields present in the record.
Who Should Consider It
Benchmark results are absent, so any consideration must be grounded in the specification fields rather than measured performance. The T7300 offers 2 cores and 2 threads, a 2000.00 base clock, 64 KB L1 cache, and 4 MB L2 cache.
For office workloads that fit within two threads, the dual-core, dual-thread configuration provides the thread count and base clock listed in the record. Workloads requiring more than two threads will not gain from additional logical processors, because none are present. For creation work, no creation benchmark scores are recorded; the relevant data is limited to the dual-core topology and the 4 MB L2 cache. For gaming, no game benchmarks appear in the record, and integrated graphics depend on the motherboard chipset feature, so a gaming recommendation cannot be derived from the data.
The 35 W TDP and Intel Socket 479 indicate a mobile platform with a modest thermal envelope. The end-of-life production status and average benchmark score of 0 further constrain any recommendation. The processor is most plausibly relevant to an existing Intel Socket 479 mobile platform with a 35 W thermal design target and a need for a Core 2 Merom dual-core part.
The AMD Equivalent of Core 2 Duo T7300
Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.
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