INTEL

Intel Celeron 667

Intel processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
30W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 1C / 1T
Base Clock 667 GHz
TDP 30W
Architecture P6
Socket Intel Socket 370S
nm
Process 180 nm

Intel Celeron 667 Specifications

Celeron 667 Core Configuration

Processing cores and threading

The Intel Celeron 667 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Celeron 667 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Celeron 667 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Celeron 667 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
667 GHz
Boost Clock
N/A
Multiplier
5x

Intel's Celeron 667 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Celeron 667 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Celeron 667's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
32 KB
L2 Cache
128 KB

P6 Architecture & Process

Manufacturing and design details

The Intel Celeron 667 is built on Intel's 180 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Celeron 667 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
P6
Codename
Timna
Process Node
180 nm
Foundry
Intel
Die Size
129 mm²
Generation
Celeron (Timna)

P6 Instruction Set Features

Supported CPU instructions and extensions

The Celeron 667 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE

Power & Thermal

TDP and power specifications

The Intel Celeron 667 has a TDP (Thermal Design Power) of 30W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
30W

Intel Socket 370S Platform & Socket

Compatibility information

The Celeron 667 uses the Intel Socket 370S socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 370S
Package
FC-PGA
DDR5

Intel Socket 370S Memory Support

RAM compatibility and speeds

Memory support specifications for the Celeron 667 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Celeron 667 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
unknown Depends on motherboard
Memory Bus
Single-channel

Intel's Celeron 667 Integrated Graphics

Built-in GPU specifications

The Intel Celeron 667 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Celeron 667 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel i752
Graphics Model
Intel i752

Product Information

Release and pricing details

The Intel Celeron 667 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Celeron 667 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Market
Desktop
Status
End-of-life
Part Number
QV18
Bundled Cooler
None

About Intel Celeron 667

The Intel Celeron 667 is a desktop processor in the Celeron (Timna) generation, built on the P6 architecture at Intel's 180 nm process. The die size is 129 mm², and the part number is QV18. It has one core and one thread, with a base clock of 667.00 MHz and no boost clock. The package uses Intel Socket 370S, and the integrated graphics block is the Intel i752. The memory bus is single-channel, and memory support is listed as unknown because it depends on the motherboard. ECC memory is not supported, and the production status is end-of-life.

Benchmark Performance

The database record for the Celeron 667 contains an empty benchmarks array, so no measured benchmark scores are available for this processor. The avgBenchmarkScore field is recorded as 0, which is consistent with the absence of benchmark entries. Because no measured scores exist, that 0 should be treated as an unpopulated field rather than a performance result. The percentileVsAllCpus field is 50, which places the processor at the median of all CPUs in the database. This percentile is the only aggregate performance indicator present in the record. The base clock is 667.00 MHz, and since boostClock is null, the operating frequency is fixed rather than adaptive. With one core and one thread, the processor provides a single logical execution path. The cache hierarchy comprises 32 KB of L1 cache and 128 KB of L2 cache, with no L3 cache listed. The memory bus is single-channel, but memory bandwidth is not listed, so the memory subsystem cannot be quantified. No nearestRivals entries exist in the record, meaning there are no rival names, scores, or deltaPct values to report. Without those fields, no percentage differences against specific processors can be derived. The only comparative context is the 50th-percentile position, an aggregate value with no supporting benchmark rows in this entry.

Who Should Consider It

The market segment is Desktop, so the Celeron 667 is positioned for desktop platforms rather than mobile or server systems. The production status is End-of-life, which limits practical use to existing Socket 370S systems. The integrated Intel i752 graphics provides display output without a separate graphics card, making the part usable for basic desktop builds. Since the processor has one core and one thread, workloads that scale across multiple threads will not gain additional hardware execution resources. With a fixed 667.00 MHz base clock and no boost clock, the performance ceiling for that single thread is fixed. Memory support is listed as unknown and depends on the motherboard, so memory configuration is a board-level decision. ECC memory is not supported, which rules out configurations that require ECC. The listed cache amounts, 32 KB of L1 and 128 KB of L2, define the working set capacity visible to the single core; no L3 cache is present in the record. PCIe information is not listed, so expansion interface capabilities are unspecified in the database. The empty benchmark array means no gaming, office, or content-creation score is recorded; recommendations must therefore rely on the listed processor structure rather than measured workloads. Users with a light, single-threaded desktop workload and a compatible motherboard are the most plausible audience for this part. The i752 graphics is included in the package, but no graphics benchmark data exists to support a gaming assessment. The record does not list a release date, so the production timeline is defined only by the End-of-life status. For content creation, the lack of additional cores and the absence of creation benchmark scores make a creation-focused recommendation unsupported by the data. For heavier multithreaded tasks, the single-thread, single-core design is the limiting factor.

How It Compares

The nearestRivals array in this record is empty. No rival processor names are listed, so a paragraph-by-paragraph comparison against specific competitors cannot be written. Because no rival entries exist, there are no deltaPct values to report. The only comparative value present is percentileVsAllCpus, which is 50. This places the Celeron 667 at the median of the database's CPU distribution. However, the empty benchmarks array means that percentile is not backed by measured score entries in this record. The avgBenchmarkScore of 0 reflects the lack of measured benchmark data rather than a tested performance level. Without rival IDs, this processor cannot be said to lead or trail another CPU by any percentage. No nearest rival data is present in the database for this part. Any relative performance statement would require information not contained in the record. Therefore, the comparison section is confined to the aggregate percentile field and the absence of specific rival deltas.

FAQ

Q: What socket does the Intel Celeron 667 use?

A: It uses Intel Socket 370S.

Q: Does the processor include integrated graphics?

A: Yes, the integrated graphics block is the Intel i752.

Q: What cache levels are listed?

A: The listed caches are 32 KB of L1 and 128 KB of L2; no L3 cache is listed.

Q: Does the Celeron 667 have a boost clock?

A: No, boostClock is null; the base clock is 667.00 MHz.

Q: Does it support ECC memory?

A: No, ECC memory support is false. Memory support is listed as unknown and depends on the motherboard.

Q: Is the processor still in production?

A: No, the production status is End-of-life.

Power and Thermals

The Celeron 667 has a TDP of 30 W. This 30 W value is the only thermal design point in the record. The manufacturing data lists a 180 nm process node and a 129 mm² die size, while the transistor count is not listed. The socket is Intel Socket 370S, so any cooling hardware must physically match that socket. The multiplierUnlocked field is false, meaning the multiplier is not available for user overclocking. With no boost clock, the thermal specification corresponds to the 667.00 MHz base-clock operating point. The integrated Intel i752 graphics is contained in the package, but the record does not provide a separate graphics power number. A 30 W TDP implies a modest cooling tier, and no reference cooler is listed in the database. The single-thread, single-core design at 667.00 MHz sets the workload envelope covered by the 30 W thermal specification. The locked multiplier keeps the thermal profile anchored to the stock frequency. The record provides no additional thermal measurements, so the 30 W TDP remains the sole thermal metric for this processor.

Detailed benchmark scores and charts for the Intel Celeron 667 are below.

Benchmark Scores

No benchmark data available for this CPU.

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