Intel Atom Z670

The Intel Atom Z670 is a single-core, single-thread mobile processor from Intel's Atom series, built on the Lincroft architecture and belonging to the Atom (Lincroft-T) generation. It operates at a base clock of 1500.00 MHz with a 3 W TDP, positioning it as an ultra-low-power solution for compact mobile devices. Released in 2011 and now end-of-life, this part is manufactured on Intel's 45 nm process node, integrating 140 million transistors into a die size of 65 mm². The cache hierarchy includes 64 KB of L1 cache and 512 KB of L2 cache per core. The database places this processor at the 50th percentile among all CPUs, though its average benchmark score is 0, and no nearest rivals are listed.

How It Compares

The Intel Atom Z670 has no nearest rivals listed in the database. This absence of comparative data means there are no deltaPct values to cite, and no direct performance deltas can be established against competing processors. Benchmark results indicate a placement at the 50th percentile of all CPUs, a statistical midpoint that suggests a balanced position in the overall distribution, yet this figure is not derived from measured benchmark scores—the average benchmark score is 0. The single core, single thread configuration, paired with the 1500.00 MHz base clock, places it at the entry level of the mobile segment. Without rival data, the processor's standing is defined by its physical attributes: a 45 nm process, a 65 mm² die, and a 3 W TDP. The 50th percentile rank, while present, lacks the empirical support of benchmark runs. In the context of the database, this processor represents a historical data point for a low-power, single-threaded design. The absence of a boost clock further simplifies its performance profile, as the base clock is the maximum frequency. For users seeking comparisons, the data simply does not provide any reference points.

Power and Thermals

The 3 W TDP of the Intel Atom Z670 is the most striking thermal specification. This figure is exceptionally low, placing the processor in a class that requires only passive cooling or a minimal fanless heatsink. The 45 nm process node, developed by Intel, is a key contributor to this efficiency, allowing 140 million transistors to operate within a 65 mm² die while dissipating only 3 W. The data shows no boost clock, meaning the 1500.00 MHz base clock is the sustained operating frequency, which inherently limits thermal generation. For system integrators, this 3 W envelope enables fanless designs with small footprints, prioritizing silent operation and extended battery life in mobile devices. The architecture, codenamed Lincroft, is specifically engineered for this low-power tier. The absence of an unlocked multiplier reinforces that this is a fixed, low-power part, not intended for enthusiast tuning. In thermal management terms, the 3 W TDP implies that even a simple passive heatsink attached to the BGA 518 package would be sufficient. The low power draw also reduces the thermal stress on surrounding components, allowing for dense motherboard layouts. Overall, the thermal profile is a defining characteristic, overshadowing the modest computational capabilities.

Benchmark Performance

Benchmark performance data for the Intel Atom Z670 is sparse. The database records an average benchmark score of 0, and the benchmarks array is empty, indicating that no standardized tests have been run or recorded for this part. Consequently, no exact percentage deltas can be calculated against any rivals, as the nearestRivals field is also empty. The 50th percentile rank is the only statistical metric available, but it does not stem from actual performance measurements. The hardware configuration—1 core, 1 thread, and a 1500.00 MHz base clock—provides a baseline expectation for single-threaded tasks. The cache structure, with 64 KB of L1 and 512 KB of L2 per core, is modest by modern standards but was appropriate for the era. The lack of a boost clock means there is no dynamic frequency scaling headroom; the processor operates at a fixed 1500.00 MHz. Without benchmark scores, any assessment of performance is qualitative. The data suggests a part suited to basic, low-intensity workloads such as simple web browsing or lightweight embedded applications. The 50th percentile placement, while present, is a placeholder in the absence of empirical data. For a processor released in 2011, the single-core design limits its relevance to modern multitasking scenarios, but the data does not quantify this limitation.

FAQ

Q: What is the TDP of the Intel Atom Z670?

A: The TDP is 3 W, an ultra-low figure that implies a passive cooling solution is sufficient for thermal management.

Q: How many cores and threads does the Atom Z670 have?

A: It has 1 core and 1 thread, indicating a strictly single-threaded processing capability.

Q: What is the base clock speed and is there a boost clock?

A: The base clock is 1500.00 MHz. No boost clock is listed in the data, so the base clock is also the maximum frequency.

Q: What memory type does the processor support?

A: It supports DDR2 memory. The data does not list support for ECC memory, so ECC is not available.

Q: What socket does the Atom Z670 use?

A: It uses the Intel BGA 518 socket, a ball-grid array design that is soldered directly onto the motherboard.

Q: What is the production status and release date?

A: The production status is end-of-life, and the release date is 2011.

Platform and Compatibility

The Intel Atom Z670 is designed for the Intel BGA 518 socket, a surface-mount package that is soldered to the motherboard. This design inherently prevents user-level upgradeability; the processor cannot be removed or swapped. Memory support is limited to DDR2, and no memory bus or bandwidth figures are provided in the data. The integrated graphics capability is described as "on certain motherboards," indicating that graphics functionality is a chipset feature rather than a fixed on-die component. The data does not list any PCIe support, so expansion options are constrained to what the chipset provides. Given its end-of-life status and 2011 release, the upgrade path is effectively non-existent; systems built on this platform are legacy configurations. The part number SLC2P identifies this specific variant. The 45 nm process and 65 mm² die size are the foundational physical characteristics, while the 140 million transistor count reflects the integration level of this early Atom design. The absence of an unlocked multiplier means no overclocking capability is available, reinforcing its position as a fixed, low-power embedded or mobile solution. The market segment is listed as Mobile, confirming its intended use case. The architecture, codenamed Lincroft, is part of the Atom (Lincroft-T) generation, which was designed for a specific low-power niche. Overall, the platform is a closed, soldered system with limited flexibility, suited for manufacturers building compact, low-power devices rather than end-user upgrades.