AMD

AMD Turion X2 RM-75

AMD processor specifications and benchmark scores

2
Cores
2
Threads
GHz Boost
35W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 2C / 2T
Base Clock 2.2 GHz
TDP 35W
Architecture K10
Socket AMD Socket S1
nm
Process 65 nm
Released Dec 2008

AMD Turion X2 RM-75 Specifications

Turion X2 RM-75 Core Configuration

Processing cores and threading

The AMD Turion X2 RM-75 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
2
SMP CPUs
1

Turion X2 RM-75 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Turion X2 RM-75 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Turion X2 RM-75 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
N/A
Multiplier
11x

AMD's Turion X2 RM-75 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Turion X2 RM-75 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Turion X2 RM-75's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
256 KB
L2 Cache
1 MB

K10 Architecture & Process

Manufacturing and design details

The AMD Turion X2 RM-75 is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Turion X2 RM-75 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K10
Codename
Griffin
Process Node
65 nm
Generation
Turion X2 (Griffin)

K10 Instruction Set Features

Supported CPU instructions and extensions

The Turion X2 RM-75 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSE4A
AMD64
AMD-V

Turion X2 RM-75 Power & Thermal

TDP and power specifications

The AMD Turion X2 RM-75 has a TDP (Thermal Design Power) of 35W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
35W

AMD Socket S1 Platform & Socket

Compatibility information

The Turion X2 RM-75 uses the AMD Socket S1 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket S1
Package
µPGA
DDR5

AMD Socket S1 Memory Support

RAM compatibility and speeds

Memory support specifications for the Turion X2 RM-75 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Turion X2 RM-75 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

AMD's Turion X2 RM-75 Integrated Graphics

Built-in GPU specifications

The AMD Turion X2 RM-75 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Turion X2 RM-75 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Turion X2 RM-75 Product Information

Release and pricing details

The AMD Turion X2 RM-75 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Turion X2 RM-75 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Dec 2008
Market
Mobile
Status
End-of-life
Part Number
TMRM75DAM22GG

Turion X2 RM-75 Benchmark Scores

No benchmark data available for this CPU.

About AMD Turion X2 RM-75

The AMD Turion X2 RM-75 is a dual-core mobile processor from AMD’s K10 architecture with the codename Griffin, running at a 2.20 GHz base clock and no listed boost clock. The database record shows 2 cores and 2 threads, a 35 W TDP, an AMD Socket S1 package, and a 65 nm process node. It lists an L1 cache of 256 KB, an L2 cache of 1 MB, and no L3 cache. The benchmark fields are empty, the average benchmark score is 0, and the processor sits at the 50th percentile among all CPUs tracked in this database. The nearestRivals list is also empty, so this record contains no direct competitor comparisons.

Single-Thread vs Multi-Thread Behavior

The RM-75’s thread model is straightforward: it has 2 cores and 2 threads, which means there is no simultaneous-multithreading present. A workload that is limited to a single thread can occupy one core and use the 2.20 GHz base clock as the only known clock speed in the data. Since no boost clock is listed, there is no higher advertised frequency to consider for short single-thread bursts. As a result, single-thread behavior is defined by the 2.20 GHz rate, the K10 architecture, and a cache hierarchy that stops at the L2 with no L3 available.

Multi-thread behavior, by contrast, is defined by exactly two physical execution contexts. Programs that can split into two threads can make use of both cores at the same time. Programs that need more than two threads will have to share those two hardware threads through operating-system scheduling, since the core and thread counts are equal. This is not a processor with spare logical threads; it is a pure dual-core design. The cache structure is also relevant for multi-threaded work: each core has access to the listed 256 KB L1 and the shared total L2 is 1 MB, with no L3 to back it.

For real workloads, the practical consequence is that the RM-75 fits tasks with modest parallelism and moderate single-thread requirements. Single-threaded tasks will depend on the 2.20 GHz figure, while multi-threaded tasks will gain only from two physical cores. The empty benchmark list means the database does not provide measured scores for either case. The 50th percentile placement is the only ranking information: it places the processor exactly at the midpoint of all CPUs in the database. That percentile is an ordinal position, not a performance score, so it should not be read as a specific speed advantage or deficit.

Power and Thermals

The only thermal design figure in the record is 35 W. That is the TDP assigned to the RM-75, and it is the sole power metric available for interpreting cooling requirements. The process node is 65 nm, and the market segment is Mobile, so the processor is positioned for portable systems rather than desktop chassis designs.

The record does not contain any cooler specifications, so a precise cooling tier cannot be selected from the data. What can be stated is that the 35 W TDP, together with a 2-core/2-thread design and a 2.20 GHz base clock, is the thermal context for platform design. The production status is end-of-life, which indicates the part is no longer an active shipping product, but the TDP class remains the relevant data point for existing systems that use it.

The integrated graphics field is also relevant to thermals. It says “On certain motherboards (Chipset feature),” which means the graphics capability in this platform is tied to the motherboard chipset rather than listed as part of the CPU. In that configuration, the 35 W TDP covers the processor itself in the data record; the chipset’s graphics would be outside the CPU’s stated thermal envelope. No foundry, transistor count, or die size is provided, so those manufacturing details cannot inform the thermal picture further.

Who Should Consider It

The RM-75 is best considered for workloads that can operate within the limits of 2 cores, 2 threads, and a 2.20 GHz base clock. The database does not list any gaming benchmark scores, so there is no measured basis for a gaming recommendation. Similarly, the benchmark set contains no content-creation scores, so any creation workload guidance must come from the core and cache details alone. The two-thread ceiling means heavily multithreaded creation applications would be outside the processor’s main strength.

For office-type work, the data shows a dual-thread processor with a dual-channel memory bus and no ECC support. The memory support field is empty, so the specific RAM types and speeds accepted by this platform are not part of the record. The processor’s 50th percentile placement among all CPUs is the only relative ranking available, and the empty benchmark array means that ranking is not backed by workload-level numbers.

This part is aimed at mobile Socket S1 platforms. Its 35 W TDP makes it a low-power option in the database’s terms, and its end-of-life production status means it is relevant mainly for maintaining or updating existing systems rather than for new platform selection. Users who already have a compatible Socket S1 motherboard and need a dual-core 35 W processor without ECC memory are the audience indicated by the record. Buyers looking for measured performance scores, boost capability, or a current production part will not find those qualities in this data.

Platform and Compatibility

The RM-75 uses AMD Socket S1, and the architecture is K10 with the codename Griffin. The generation field is listed as “Turion X2 (Griffin).” The socket is a fixed compatibility boundary: the data does not list any alternate sockets for this processor, so the upgrade path is limited to Socket S1 platforms.

The memory controller path is described as dual-channel. ECC memory is not supported, as the eccMemory field is false. No specific memory support entries are provided, and the memory bandwidth field is null, so peak bandwidth cannot be cited from this record. That leaves the dual-channel bus as the only memory-related specification.

PCIe information is not present. The pcie field is null, so expansion capability through PCIe cannot be assessed from this data. Integrated graphics are listed as a chipset feature on certain motherboards, meaning the presence of display output depends on the motherboard chipset, not on the CPU.

The multiplier is not unlocked, per the multiplierUnlocked field set to false. The part number listed is TMRM75DAM22GG, and the release date is 2008-11-30. Production status is end-of-life, which affects the practicality of any long-term upgrade plan. The data does not include a series name, foundry, transistor count, or die size, so those platform details remain unspecified.

How It Compares

The nearestRivals field in the data is empty. There are no rival processor names, no rival scores, and no deltaPct values anywhere in the record. Because of that, no direct comparison against another specific CPU can be made from this FACT PACK.

The only comparative figure is the 50th percentile among all CPUs. That indicates a central position in the database’s overall ranking, but with no nearest rivals to anchor it, the percentile cannot be translated into a percentage margin over any named chip. No competitor can be said to be ahead or behind the RM-75 from this data.

FAQ

Q: How many cores and threads does the AMD Turion X2 RM-75 have?

A: It has 2 cores and 2 threads.

Q: What is the base clock speed?

A: The base clock is 2.20 GHz. No boost clock is listed in the data.

Q: What is the TDP?

A: The TDP is 35 W.

Q: What socket does it use?

A: It uses AMD Socket S1.

Q: What cache sizes are listed?

A: The data lists 256 KB of L1 cache, 1 MB of L2 cache, and no L3 cache.

Q: Does the database include benchmark scores for this processor?

A: No. The benchmark list is empty, the average benchmark score is 0, and no nearestRivals or deltaPct values are present.

Benchmark Performance

The RM-75 has no individual benchmark entries in the database. The benchmarks field is empty, and the listed average benchmark score is 0. That average score accompanies an empty benchmark array, so it does not function as a measured result from any specific workload. There is no way to break the processor’s performance into single-thread and multi-thread scores from the record.

The percentile vs all CPUs is 50. That value places the processor at the midpoint of the CPUs tracked in the database. It is the only quantitative ranking available for the RM-75. However, the percentile cannot be converted into an exact percentage lead or deficit because no nearest rivals are listed and no deltaPct values are present.

Because the nearestRivals field is empty, this analysis cannot state that the RM-75 is any percentage faster or slower than another named processor. There are no rival scores to subtract, no deltas to compare, and no benchmark entries to evaluate. The only benchmark-related numbers in the FACT PACK are the 0 average benchmark score and the 50th percentile. Those two figures represent the complete quantitative performance picture: a central ordinal position and no measured score data.

The Intel Equivalent of Turion X2 RM-75

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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