AMD

AMD Sempron LE-1300

AMD processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
45W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 1C / 1T
Base Clock 2.3 GHz
TDP 45W
Architecture K8
Socket AMD Socket AM2
nm
Process 65 nm
Released Oct 2007

AMD Sempron LE-1300 Specifications

Sempron LE-1300 Core Configuration

Processing cores and threading

The AMD Sempron LE-1300 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Sempron LE-1300 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron LE-1300 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron LE-1300 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.3 GHz
Boost Clock
N/A
Multiplier
11.5x

AMD's Sempron LE-1300 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron LE-1300 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron LE-1300's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
512 KB

K8 Architecture & Process

Manufacturing and design details

The AMD Sempron LE-1300 is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron LE-1300 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Sparta
Process Node
65 nm
Generation
Sempron (Sparta)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron LE-1300 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64

Sempron LE-1300 Power & Thermal

TDP and power specifications

The AMD Sempron LE-1300 has a TDP (Thermal Design Power) of 45W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
45W

AMD Socket AM2 Platform & Socket

Compatibility information

The Sempron LE-1300 uses the AMD Socket AM2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket AM2
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket AM2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron LE-1300 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron LE-1300 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

AMD's Sempron LE-1300 Integrated Graphics

Built-in GPU specifications

The AMD Sempron LE-1300 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron LE-1300 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Sempron LE-1300 Product Information

Release and pricing details

The AMD Sempron LE-1300 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron LE-1300 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Oct 2007
Market
Desktop
Status
End-of-life
Part Number
SDH1300IAA4DP

Sempron LE-1300 Benchmark Scores

No benchmark data available for this CPU.

About AMD Sempron LE-1300

The AMD Sempron LE-1300 is a desktop processor built on the K8 architecture with the Sparta codename, fabricated on a 65 nm process node. It has one core and one thread, running at a fixed 2.30 GHz base clock with no boost clock. The cache hierarchy consists of 128 KB of L1 and 512 KB of L2. The chip carries a 45 W TDP and uses the AMD Socket AM2. Released on October 7, 2007, and now end-of-life, the LE-1300 holds the 50th percentile in the benchmark database, with an aggregate benchmark score of 0, indicating no recorded performance samples.

Single-Thread vs Multi-Thread Behavior

The LE-1300 is a strictly single-threaded processor. With one core and one thread, it can execute only one instruction stream at any given moment. The 2.30 GHz base clock is the only clock available; there is no boost clock to temporarily raise frequency. This makes the processor's performance envelope completely flat — sustained load equals rated load, with no turbo behavior to consider.

The K8 architecture and the Sparta codename reflect a design that was already mature by the time of release. The 65 nm process node was a standard for that generation. The L1 cache is 128 KB, and the L2 cache is 512 KB. These are small capacities by modern standards, but they are adequate for the single-threaded, low-intensity workloads this chip was designed to handle.

In real-world terms, the LE-1300 will run single-threaded applications such as legacy office software, basic web browsing, and older 2D games without issue. The fixed 2.30 GHz clock ensures consistent performance. Multi-threaded workloads, however, will not benefit. The operating system must time-slice the single thread across all running processes, so any parallel workload will see no scaling. The absence of a boost clock also means there is no short-duration turbo behavior; the processor's performance under sustained load is identical to its performance at the start of a task.

The 50th percentile ranking in the database places this chip exactly at the median of all tracked CPUs. But the aggregate benchmark score of 0 means no measured data supports that ranking. It is a positional placeholder, not a performance result. The single-thread focus of the LE-1300 is both its strength and its limitation: it does one thing consistently, but it cannot do more than one thing at a time. For a desktop processor released in 2007, this was already a constrained design, and the database reflects that with no benchmark samples.

Power and Thermals

The LE-1300 has a TDP of 45 W. For a desktop processor, this is a low-power classification. The 65 nm process node contributes to the modest power draw. Because there is no boost clock, the processor does not experience transient power spikes; the 45 W TDP represents the sustained power consumption under full load.

Thermally, this chip is undemanding. A basic air cooler — the kind that typically ships with low-power desktop processors — is more than sufficient to keep it within safe operating temperatures. The lack of a boost clock means the thermal load is constant, so there is no need for a cooling solution that can absorb burst workloads. The end-of-life status means that any system using this chip today is a legacy machine, but the thermal requirements are modest enough that even a low-profile cooler would handle the load.

The 45 W TDP also has system-level implications. Power supply requirements are minimal, and overall system heat output is low. For a single-core, single-thread desktop part, this is an appropriate balance between performance and efficiency. The fixed clock frequency means there is no thermal headroom management to worry about — the chip draws a steady 45 W under load and idles lower. The 65 nm process, while not cutting-edge even at release, is sufficient for a 2.30 GHz single-core design. The low TDP class also implies that the LE-1300 could be used in compact desktop systems without special cooling provisions, though the database does not specify any particular cooler requirements.

Benchmark Performance

The database records an aggregate benchmark score of 0 for the Sempron LE-1300. This indicates that no benchmark samples have been submitted for this processor. The percentileVsAllCpus field is 50, which places the chip at the median of all CPUs tracked in the database. However, without a non-zero benchmark score, this percentile is a placeholder rather than a measured outcome.

The nearestRivals array is empty, so there are no direct competitor scores or delta percentages to cite. The data does not permit a quantitative comparison against any named rival. What the data does show is that the LE-1300 is a single-core K8 processor with a 2.30 GHz clock, 128 KB of L1 cache, and 512 KB of L2 cache. These specifications, combined with the 45 W TDP, position it as a low-end desktop part from 2007.

The 50th percentile ranking is notable in that it places the chip exactly in the middle of the database's CPU population. Half of all tracked CPUs rank above it, and half rank below. But because the average benchmark score is 0, this ranking cannot be validated against actual performance data. In the absence of scores, the LE-1300's performance must be inferred from its specifications: a single-threaded K8 core at 2.30 GHz with a small cache. That is a modest performance profile by any standard.

The lack of benchmark data also means that the LE-1300's real-world performance is undocumented in this database. Users of this chip would have experienced the performance of a 2.30 GHz single-core K8 processor with 512 KB of L2 cache, but the database cannot quantify that experience. The percentile rank of 50 is the only positional signal available, and it is a weak one without supporting scores. The empty benchmarks array reinforces that this processor was not commonly subjected to standardized testing, likely due to its low-end market position.

How It Compares

The nearestRivals field for the LE-1300 is empty. This means the database contains no direct comparison data against other processors. Without rival names, scores, or delta percentages, no comparative performance analysis is possible.

What can be said is qualitative. The LE-1300's single-core, single-thread design places it in the entry-level desktop segment of its time. The 45 W TDP and 65 nm process node indicate a low-power design. The 2.30 GHz clock is modest, and the 512 KB L2 cache is small. Against the broader CPU population, the 50th percentile suggests a median position, but this is not backed by benchmark data.

In the context of the database, the LE-1300 is a processor with no recorded performance samples and no listed rivals. It is a historical part, end-of-life since its 2007 release. Its position in the database is defined by its specifications and its percentile rank, not by measured performance.

The absence of rival data is itself informative. It suggests that the LE-1300 is not a commonly benchmarked processor, likely because it was a low-end part with limited performance appeal. The single-core design and 45 W TDP place it in a low-power niche within the desktop segment. Without rivals listed, the LE-1300 stands alone in the database, defined only by its own specifications. The 50th percentile, in the absence of any comparative data, is the single positional reference point available, and it indicates that the chip sits squarely in the middle of the database's historical CPU population.

Platform and Compatibility

The LE-1300 is built for the AMD Socket AM2. This socket was used by AMD for a range of desktop processors in the mid-2000s. The memory bus is dual-channel, though the specific memory type is not listed in the database. ECC memory is not supported, which aligns with the desktop market segment. PCIe Gen 2 is provided for expansion.

Integrated graphics are not part of the processor itself. The database notes that integrated graphics are available "on certain motherboards" as a chipset feature. This means the LE-1300 relies on a discrete graphics card or a motherboard with integrated graphics capabilities.

The multiplier is locked, so overclocking via multiplier adjustment is not possible. The part number is SDH1300IAA4DP. The processor was released on October 7, 2007, and is now end-of-life. The market segment is desktop.

Upgrade path: Socket AM2 supports a range of AMD processors. A user with an LE-1300 could, in principle, upgrade to a higher-end AM2 processor, though the database does not list specific compatible models. The dual-channel memory bus and PCIe Gen 2 support are platform features that carry over to other AM2 processors. The 65 nm process node and K8 architecture are shared with other Sparta-family parts.

The end-of-life status means the LE-1300 is no longer in production. Any system using this chip is a legacy machine. The platform, however, retains some flexibility due to the AM2 socket's broad compatibility. The lack of ECC support and the locked multiplier are typical for a desktop-oriented part. The integrated graphics being a chipset feature rather than a CPU feature is also consistent with the era, where graphics were handled by the motherboard chipset rather than the processor. The dual-channel memory bus provides adequate bandwidth for the single-core design, and the PCIe Gen 2 support allows for standard expansion cards. For a 2007 desktop processor, the platform is straightforward: a single-socket AM2 board with dual-channel memory, PCIe Gen 2, and no ECC requirements.

The Intel Equivalent of Sempron LE-1300

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

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