AMD

AMD Sempron LE-1100

AMD processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
45W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 1C / 1T
Base Clock 1900 GHz
TDP 45W
Architecture K8
Socket AMD Socket AM2
nm
Process 65 nm
Released Aug 2007

AMD Sempron LE-1100 Specifications

Sempron LE-1100 Core Configuration

Processing cores and threading

The AMD Sempron LE-1100 features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Sempron LE-1100 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron LE-1100 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron LE-1100 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1900 GHz
Boost Clock
N/A
Multiplier
9.5x

AMD's Sempron LE-1100 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron LE-1100 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron LE-1100's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
256 KB

K8 Architecture & Process

Manufacturing and design details

The AMD Sempron LE-1100 is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron LE-1100 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Sparta
Process Node
65 nm
Generation
Sempron (Sparta)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron LE-1100 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64

Sempron LE-1100 Power & Thermal

TDP and power specifications

The AMD Sempron LE-1100 has a TDP (Thermal Design Power) of 45W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
45W

AMD Socket AM2 Platform & Socket

Compatibility information

The Sempron LE-1100 uses the AMD Socket AM2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket AM2
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket AM2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron LE-1100 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron LE-1100 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

AMD's Sempron LE-1100 Integrated Graphics

Built-in GPU specifications

The AMD Sempron LE-1100 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron LE-1100 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Sempron LE-1100 Product Information

Release and pricing details

The AMD Sempron LE-1100 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron LE-1100 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Aug 2007
Market
Desktop
Status
End-of-life
Part Number
SDH1100IAA3DE

Sempron LE-1100 Benchmark Scores

No benchmark data available for this CPU.

About AMD Sempron LE-1100

The AMD Sempron LE-1100 is a desktop processor built on the K8 architecture, codenamed Sparta, and manufactured on a 65 nm process. It features a single core and a single thread, running at a fixed base clock of 1900.00 MHz with no boost capability. The chip carries a 45 W TDP, fits the AMD Socket AM2, and supports dual-channel memory. It has 128 KB of L1 cache and 256 KB of L2 cache, with no L3 cache. Integrated graphics are available on certain motherboards as a chipset feature, and the part supports PCIe Gen 2. Released in 2007, it is now end-of-life, with a part number of SDH1100IAA3DE. In the benchmark database, it holds a percentile of 50 among all CPUs, though its average benchmark score is 0 and no benchmark entries are recorded.

Single-Thread vs Multi-Thread Behavior

The data for this processor is unambiguous: it offers exactly one core and one thread. There is no simultaneous multithreading, no second physical core, and no boost clock to dynamically raise the 1900.00 MHz base frequency. This means every workload is confined to a single execution stream. The K8 architecture, while historically significant, was designed in an era when single-threaded performance was the primary metric, and this part reflects that focus. The 128 KB L1 cache and 256 KB L2 cache are modest by modern standards, but they are the only caching layers available—there is no L3 cache to buffer data between the core and the dual-channel memory bus.

For real-world applications, the single-thread, single-core design dictates a very narrow performance envelope. Tasks that are inherently sequential—such as opening a document, parsing a spreadsheet formula, or running a legacy single-threaded application—will execute at the fixed 1900.00 MHz rate. However, any workload that can leverage multiple threads will see no benefit, as the hardware cannot process more than one thread at a time. The dual-channel memory bus does provide a reasonable data path to system memory, but the small L2 cache (256 KB) means the core frequently has to fetch data from main memory, which can introduce latency. The percentile of 50 places this chip exactly at the median of all CPUs tracked in the database, but that placement is a relative indicator—without any recorded benchmark scores, the actual performance headroom cannot be quantified. The absence of a boost clock also means that under sustained load, the processor does not alter its frequency, so performance remains flat rather than adaptive.

Power and Thermals

The 45 W TDP is a defining characteristic of this part. It indicates a low power draw, which directly implies a modest thermal output. The 65 nm process node is an older manufacturing technology, but the low TDP compensates for that, keeping heat generation in check. For cooling, this TDP class suggests a basic air cooler is sufficient—a small aluminum heatsink or a low-profile solution would handle the thermal load without difficulty. The lack of a boost clock means the processor does not spike to higher power states, so the thermal profile is steady and predictable. The end-of-life production status further suggests that this chip is intended for legacy systems or simple builds where power efficiency is prioritized over peak performance. The 45 W figure also means that system integrators do not need robust cooling infrastructure; a standard desktop chassis with adequate airflow will suffice. The socket AM2 platform is an older interface, but the low thermal requirements mean that even a compact or passively cooled design could theoretically be considered, though the data does not specify any such configurations. The dual-channel memory bus does not add significant power draw, and the integrated graphics, when enabled via the chipset on certain motherboards, would contribute to the overall system power, but the CPU's own 45 W envelope remains the primary thermal consideration.

How It Compares

The FACT PACK lists no nearest rivals for the AMD Sempron LE-1100. This is a significant omission, as it means there are no specific competing models with associated scores or deltaPct values to reference. Consequently, direct percentage comparisons against other CPUs are not possible from the available data. The only comparative metric provided is the percentile of 50, which indicates that this processor sits at the exact median of all CPUs in the benchmark database. This placement suggests that, in the absence of recorded performance data, it is neither a high-flying outlier nor a bottom-tier part—it is squarely in the middle of the distribution. The average benchmark score of 0 and the empty benchmarks array reinforce this lack of quantitative comparison. Without rival names or scores, any attempt to state "30% ahead of X" or "behind Y" would be pure fabrication, which the data does not support. The 50th percentile is a static, relative position, but it does not carry the weight of a measured delta. In practical terms, this means the Sempron LE-1100 cannot be positioned against contemporary or historical competitors using this dataset; its performance tier is only implied by its architecture, clock speed, and cache configuration, not by direct benchmark deltas.

Who Should Consider It

The workload recommendations for this processor are strictly dictated by its single-core, single-thread design and its 1900.00 MHz fixed clock. For office productivity—word processing, spreadsheet entry, email, and basic web browsing—the chip is adequate, as these tasks are largely single-threaded and do not demand high core counts. The 45 W TDP also makes it suitable for low-power or legacy desktop builds where energy efficiency is a priority. The integrated graphics, available on certain motherboards as a chipset feature, allow for basic display output without a discrete GPU, which simplifies system assembly for simple office or home use. However, for gaming, the single core and lack of multi-threading are severe limitations. Modern game engines are heavily multi-threaded, and this processor would bottleneck any such title, likely resulting in poor frame rates and stuttering. For content creation—video editing, 3D rendering, or audio production—the absence of multiple threads is equally disqualifying, as these workloads scale with core count and would leave the processor overwhelmed. The dual-channel memory bus provides some bandwidth benefit for memory-intensive tasks, but the 256 KB L2 cache is too small to hold large working sets, causing frequent memory accesses. The end-of-life status means it is not a candidate for new high-performance systems, but for retro builds, basic office machines, or embedded-like applications where single-threaded reliability is valued over speed, it remains a functional choice. The lack of a boost clock also means that performance is consistent, which can be a positive for deterministic tasks.

Benchmark Performance

The benchmark performance of the AMD Sempron LE-1100 is, according to the data, essentially undefined. The average benchmark score is 0, and the benchmarks array is empty, meaning no specific performance measurements have been recorded in this database. The only quantitative performance indicator is the percentile of 50, which places it at the median of all CPUs tracked. This is a relative ranking, not a raw score, and it does not translate into any specific operations per second or frames per second. The base clock of 1900.00 MHz is the sole clock frequency provided; there is no boost clock to consider. The lack of rival data—no names, no scores, no deltaPct values—means that no percentage comparisons can be made. The data shows a processor that, on paper, is a single-core, single-thread part with a 45 W TDP, 128 KB L1 cache, and 256 KB L2 cache, but without recorded benchmarks, its actual performance against any other CPU remains unknown. The 50th percentile is a placeholder that suggests it is not an extreme outlier, but it does not indicate whether it outperforms or underperforms specific competitors. The empty benchmarks array is a critical gap; it prevents any quantitative analysis of multi-core scaling, single-thread efficiency, or thermal throttling under load. In summary, the benchmark performance section must rely on the architecture and clock speed as proxies, but the definitive numbers—scores and deltas—are absent from the dataset. The 0 average score is a null value, not a measurement of zero performance, and it should be interpreted as a lack of data rather than a literal result.

The Intel Equivalent of Sempron LE-1100

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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