AMD

AMD Sempron 3600+

AMD processor specifications and benchmark scores

1
Cores
1
Threads
โ€”
GHz Boost
62W
TDP
๐Ÿ–ฅ๏ธIntegrated GPU

AMD Sempron 3600+ Specifications

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Sempron 3600+ Core Configuration

Processing cores and threading

The AMD Sempron 3600+ features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1
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Sempron 3600+ Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron 3600+ benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron 3600+ by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
N/A
Multiplier
11x
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AMD's Sempron 3600+ Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron 3600+ processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron 3600+'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
128 KB
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K8 Architecture & Process

Manufacturing and design details

The AMD Sempron 3600+ is built on AMD's 90 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron 3600+ incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Albany
Process Node
90 nm
Transistors
69 million
Generation
Mobile Sempron (Albany)
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K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron 3600+ by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64
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Sempron 3600+ Power & Thermal

TDP and power specifications

The AMD Sempron 3600+ has a TDP (Thermal Design Power) of 62W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
62W
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AMD Socket 754 Platform & Socket

Compatibility information

The Sempron 3600+ uses the AMD Socket 754 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket 754
Package
ยตPGA
DDR5

AMD Socket 754 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron 3600+ define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron 3600+ determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Single-channel
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AMD's Sempron 3600+ Integrated Graphics

Built-in GPU specifications

The AMD Sempron 3600+ includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron 3600+ provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)
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Sempron 3600+ Product Information

Release and pricing details

The AMD Sempron 3600+ is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron 3600+ by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
May 2006
Market
Mobile
Status
End-of-life
Part Number
SMN3600BIX2BX

Sempron 3600+ Benchmark Scores

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No benchmark data available for this CPU.

About AMD Sempron 3600+

The AMD Sempron 3600+ CPU is a single-core processor designed for budget-friendly computing solutions. Manufactured on a 90 nm process, it delivers a base clock speed of 2.20 GHz and operates within a TDP of 62W, making it suitable for systems where power efficiency is a consideration. The AMD Sempron 3600+ fits into the AMD Socket 754 and is part of the Mobile Sempron family, specifically the Albany generation. Despite its modest specifications, it was aimed at entry-level users seeking basic performance for everyday tasks. The AMD Sempron 3600+ remains a product of its time, reflecting the hardware capabilities available in 2006. In terms of market segment, the AMD Sempron 3600+ targets cost-conscious consumers and older systems that require a reliable, low-power CPU. While no benchmark data is available to provide a detailed performance summary, its single-core design and 2.20 GHz clock speed suggest it is best suited for light computing needs. Upgrade considerations for the AMD Sempron 3600+ include checking compatibility with existing motherboards that support the AMD Socket 754. Users looking to enhance performance may benefit from replacing the AMD Sempron 3600+ with a more modern processor, provided the system hardware allows for such an upgrade.

The Intel Equivalent of Sempron 3600+

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel โ€ข 4 Cores

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