AMD

AMD Sempron 180

AMD processor specifications and benchmark scores

2
Cores
2
Threads
GHz Boost
45W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 2C / 2T
Base Clock 2.4 GHz
TDP 45W
Architecture K10
Socket AMD Socket AM3
nm
Process 45 nm
Released Sep 2010

AMD Sempron 180 Specifications

Sempron 180 Core Configuration

Processing cores and threading

The AMD Sempron 180 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
2
SMP CPUs
1

Sempron 180 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron 180 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron 180 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.4 GHz
Boost Clock
N/A
Multiplier
12x

AMD's Sempron 180 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron 180 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron 180's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB (per core)
L2 Cache
512 KB (per core)

K10 Architecture & Process

Manufacturing and design details

The AMD Sempron 180 is built on AMD's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron 180 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K10
Codename
Regor
Process Node
45 nm
Transistors
234 million
Die Size
117 mm²
Generation
Sempron (Regor)

K10 Instruction Set Features

Supported CPU instructions and extensions

The Sempron 180 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSE4A
AMD64
AMD-V

Sempron 180 Power & Thermal

TDP and power specifications

The AMD Sempron 180 has a TDP (Thermal Design Power) of 45W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
45W

AMD Socket AM3 Platform & Socket

Compatibility information

The Sempron 180 uses the AMD Socket AM3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket AM3
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket AM3 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron 180 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron 180 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel

AMD's Sempron 180 Integrated Graphics

Built-in GPU specifications

The AMD Sempron 180 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron 180 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Sempron 180 Product Information

Release and pricing details

The AMD Sempron 180 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron 180 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2010
Market
Desktop
Status
End-of-life
Part Number
SDX180HDK22GM

Sempron 180 Benchmark Scores

No benchmark data available for this CPU.

About AMD Sempron 180

The AMD Sempron 180 is an end-of-life desktop processor from AMD, released in 2010. It uses the K10 architecture under the Regor codename, and the generation is listed as Sempron (Regor). The processor has 2 cores and 2 threads, with a base clock of 2.40 GHz and no recorded boost clock. It fits in AMD Socket AM3, supports DDR3 memory on a dual-channel bus, and does not support ECC memory. The process node is 45 nm, with 234 million transistors on a 117 mm² die. The database includes no benchmark entries for this CPU: the average benchmark score is 0, the percentile vs all CPUs is 50, and the nearestRivals list is empty.

Benchmark Performance

The central fact in this section is the absence of measured results. The benchmarks array is empty, so there are no raw scores, no multi-core scores, and no single-thread scores to place against any other processor. The only quantitative benchmark-related fields are an average benchmark score of 0 and a percentile vs all CPUs of 50. A zero aggregate score does not represent a measured outcome; it is the database state when no benchmark runs are associated with the CPU. The 50th percentile is a positional value, but with no scores behind it, that percentile cannot be interpreted as a speed ranking.

Because the nearestRivals array is empty, there are no rival names, no rival scores, and no deltaPct values available. This means none of the comparative language normally used in benchmark analysis can be applied to the Sempron 180 in this dataset. The processor is not recorded as being ahead of or behind any specific competitor. Any percentage-delta statement would require data that is not present here, so this analysis will not produce one. The benchmark section can only confirm that the processor is untested in this database and that its percentile sits at 50.

The absence of benchmark data does not remove the architectural facts from consideration. The processor has 2 cores, 2 threads, a 2.40 GHz base clock, and no boost clock. The memory interface is DDR3 dual-channel, the cache hierarchy consists of per-core L1 and L2 with no L3, and the platform interface is PCIe Gen 2. These are the structural details available for performance reasoning, but none of them are benchmark scores. The average benchmark score of 0 and the 50th percentile are the only benchmark-related numbers recorded.

Single-Thread vs Multi-Thread Behavior

The Sempron 180 is a 2-core, 2-thread processor. The thread count is equal to the core count, so there are no extra logical threads beyond the two physical cores. This is a direct consequence of the core and thread fields in the dataset. For single-thread behavior, the relevant number is the 2.40 GHz base clock. No boost clock is listed, so the only operating frequency in the data is that 2.40 GHz figure. A workload that depends on a single thread will run at that frequency, and the two-core configuration does not alter the single-thread ceiling.

Each core carries a private 128 KB L1 cache and a 512 KB L2 cache. No L3 cache is present, and the total L3 field is also null in the dataset. The cache hierarchy is therefore shallow: each core has its own local storage, and there is no shared large cache between the cores. For real workloads, this implies that data shared between cores must pass through the memory subsystem rather than a shared on-die cache. The listed memory support is DDR3 on a dual-channel bus, which is the interface that supplies data to both cores. The dataset does not list a memory bandwidth figure, so the dual-channel bus is the only memory throughput information available.

Multi-thread performance is limited by the two-thread boundary. Programs that can use exactly two threads will have both cores available, while programs with more than two threads cannot execute concurrently across additional hardware threads. The database does not include a measured multi-thread score, so the scaling behavior is unknown, but the architectural limit is set by the 2-thread count. The 2.40 GHz base clock applies to both cores because only one base clock is recorded and no boost clock is present. For lightly threaded office work, a single thread can carry the main load while a second thread handles background activity. For creation workloads that scale beyond two threads, the two-thread limit is a hard constraint, and the dataset provides no score to suggest otherwise.

Power and Thermals

The TDP is 45 W. This is the only power-related number in the dataset, and it places the Sempron 180 in a modest power class for a desktop processor. The manufacturing process is 45 nm, and the die is 117 mm² with 234 million transistors. These numbers define the thermal context: a 45 W power envelope implemented on a 45 nm process, with a die area of 117 mm² and a transistor count of 234 million. The implied cooling tier is accordingly modest. A 45 W TDP does not require high-end cooling; a standard air cooler is sufficient for this thermal class.

The socket is AMD Socket AM3, so cooling must be selected for that socket. No boost clock is recorded, so the thermal load is tied to the 2.40 GHz base clock rather than to a higher boost state. The multiplier is not unlocked, meaning the clock ratio cannot be adjusted through the multiplier. This limits user-driven power tuning. ECC memory is not supported, and the memory bus is dual-channel DDR3. The PCIe interface is Gen 2. Integrated graphics are listed as a chipset feature on certain motherboards, not as a processor component, so display output in such a system would come from the motherboard chipset rather than from the CPU die.

Because the production status is end-of-life, the processor is no longer in active production. Its thermal and power characteristics were established at its 2010 release and remain as recorded in the dataset. The 45 W TDP is the governing figure for cooling and system power planning. The 117 mm² die size and the 234 million transistor count are manufacturing-level facts, not runtime measurements, but they are the only physical details provided alongside the thermal design power.

Who Should Consider It

The AMD Sempron 180 is a desktop processor with 2 cores, 2 threads, and a 2.40 GHz base clock. Users with lightly threaded workloads are the most plausible audience. Office document editing, spreadsheet work, and web-based tasks typically use one or two active threads, which matches the 2-core, 2-thread topology. The database does not include benchmark scores to validate performance, but the specifications do not contradict that use case. The per-core caches are 128 KB of L1 and 512 KB of L2, and there is no L3 cache.

Users who run creation applications that scale beyond two threads should not look to this part for high multi-thread throughput. The two-thread limit is structural rather than a matter of benchmark interpretation. Video encoding, 3D rendering, and compilation workloads that can use four or more threads would be capped by the two available threads. No measured multi-core score exists in the dataset to quantify the impact, but the architecture itself sets the boundary. The absence of ECC support further limits server or workstation memory environments.

Gaming performance cannot be quantified from this dataset because there are no game benchmark scores. The relevant facts are the 2-core, 2-thread design, the 2.40 GHz base clock, the lack of L3 cache, and the DDR3 dual-channel memory interface. These indicate a platform with limited thread capacity and a memory interface from the DDR3 generation. However, without a measured gaming score, no frame-rate or relative performance statement can be made. The integrated graphics capability is a chipset feature on certain motherboards, so a system with one of those boards can produce display output without a separate graphics card; the processor itself has no listed integrated GPU.

The 45 W TDP and the desktop market segment point toward systems where low power draw and simple cooling are priorities. The end-of-life production status and the 2010 release year mean this processor belongs to an older Socket AM3 platform. The multiplier is not unlocked, so the 2.40 GHz base clock is fixed from the user’s perspective. There are no benchmark entries, so the dataset does not provide evidence for demanding gaming or creation workloads. The recommendation is therefore limited to lightly threaded, low-power desktop use.

How It Compares

The dataset lists no nearest rivals for the AMD Sempron 180. The nearestRivals array is empty, so there are no rival names, no rival scores, and no deltaPct values to report. As a result, this CPU has no exact percentage position relative to any specific competitor in this database. The only comparative data point is the 50th percentile vs all CPUs. That percentile is the middle of the database distribution, but it is based on an aggregate score of 0 rather than on measured performance.

Without nearestRivals, no rival-by-rival comparison paragraphs can be written. The absence of that field is itself the finding: the Sempron 180 is not bracketed by defined competitor processors in the dataset. Any comparison using rival names or percentages from outside the dataset would exceed the available information. The comparison section is therefore limited to the 50th percentile rank and the empty nearestRivals array. The data provides no basis for a benchmark-based competitive ranking.

The Intel Equivalent of Sempron 180

Looking for a similar processor from Intel? The Intel Core i5-580M offers comparable performance and features in the Intel lineup.

Intel Core i5-580M

Intel • 2 Cores

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