AMD Sempron 130

The AMD Sempron 130 is a 1-core, 1-thread desktop processor from the K10 architecture, codename Sargas and Sempron (Sargas) generation. It is built on a 45 nm process with 234 million transistors on a 117 mm² die. The base clock is 2.60 GHz; no boost clock is listed. The processor uses AMD Socket AM3, has a 45 W TDP, and supports DDR3 memory through a dual-channel bus. Its production status is end-of-life, and the release date is in July 2011. The database lists an empty benchmarks array, an average benchmark score of 0, and percentileVsAllCpus of 50.

Single-Thread vs Multi-Thread Behavior, what the split means for real workloads

The Sempron 130 has 1 core and 1 thread. There is no second thread for background work, and no boost clock is listed above the 2.60 GHz base frequency. Thus the single-thread/multi-thread split collapses: every workload on this processor is a single-thread workload, with no parallel execution path. The cache is 128 KB L1 per core and 512 KB L2 per core; with 1 core, these are also the total cache amounts. No L3 cache is listed.

The K10 architecture and Sargas codename identify the core design, but the empty benchmarks array and the average benchmark score of 0 mean no measured single-thread or multi-thread results exist. The only concrete execution facts are the 1-thread count and the 2.60 GHz base clock. Multi-threaded workloads will not scale, because the CPU cannot process more than one instruction stream. Single-thread workloads have the 2.60 GHz clock as their performance anchor, and the lack of a boost clock removes any higher temporary frequency.

The 50th-percentile rank is a relative position against all CPUs, but it cannot be split into single-thread and multi-thread components without benchmark scores. In practice, the operating system, foreground application, and background activity all share the same thread. The 128 KB L1 and 512 KB L2 are local to that single thread, and no L3 cache is available as a fallback. The dual-channel DDR3 memory bus can provide memory bandwidth, but it cannot create additional threads. The data thus shows a single-thread-only behavior.

Power and Thermals, TDP class, what cooling tier it implies

The Sempron 130 is rated at a 45 W TDP. That is a low TDP class for a desktop processor, so the cooling requirement is modest. The 45 nm process, 234 million transistors, and 117 mm² die size are the physical parameters behind this TDP. A capable air cooler is sufficient for a 45 W part. The base clock is 2.60 GHz, and with no boost clock there is no higher frequency state to increase power draw.

With 1 core and 1 thread, the 45 W envelope is dissipated by one active core, but the TDP class still points to low-power cooling. The cache is compact at 128 KB L1 per core and 512 KB L2 per core, and no L3 cache is listed, so there is no large cache array adding heat. The data includes no power or temperature measurements; the average benchmark score of 0 and the 50th-percentile rank are not thermal readings. Therefore, the thermal conclusion rests on the 45 W TDP: a modest cooling solution is adequate. The DDR3 dual-channel memory bus is part of the platform, but no memory bandwidth figure is listed to quantify memory-side power. Overall, the 45 W TDP defines the cooling tier.

Who Should Consider It, workload-based recommendations (gaming, creation, office) grounded in the scores

The database has no measured scores for the Sempron 130. The benchmarks array is empty, and the average benchmark score is 0. The only score-like field is percentileVsAllCpus at 50, but that is not a workload score. Recommendations must come from the architectural fields: 1 core, 1 thread, 2.60 GHz base clock, 45 W TDP, AM3 socket, DDR3 dual-channel support.

For gaming, the 1-thread design means the CPU executes only one instruction stream; any game component requiring parallel execution cannot use this processor for that work. The 2.60 GHz base clock may fit lightweight single-threaded game scenarios, but no benchmark score supports a performance claim. For creation workloads, the 1-thread ceiling is decisive; applications that split work across threads will have only 1 thread available. The small 128 KB L1 and 512 KB L2 per core, plus the absence of L3, further constrain data-heavy creation tasks. For office use, single-threaded tasks may align with the 2.60 GHz clock, but the CPU cannot run foreground and background tasks simultaneously. The dual-channel DDR3 memory bus offers memory bandwidth, but bandwidth does not replace threads.

The desktop segment and end-of-life production status make this a candidate for a legacy AM3 system needing a low-power 45 W part. However, the empty benchmark record means no measured evidence exists for gaming, creation, or office performance. The 50th-percentile rank is not a substitute. The data supports consideration only for workloads that fit within one 2.60 GHz thread, and even that is unconfirmed by a score.

How It Compares, position vs each nearest rival, one short paragraph per rival

The nearestRivals field for the Sempron 130 is empty. There are no rival names, rival scores, or comparison percentages in the entry. Therefore, a rival-by-rival comparison cannot be written from the provided data. The only positional value is percentileVsAllCpus: 50. That 50th-percentile rank places the CPU at the midpoint of the database's CPU distribution, but the average benchmark score of 0 and the empty benchmarks array leave the rank without a measured score behind it.

The rank cannot be traced to any single-thread or multi-thread result. Without nearestRivals, it is impossible to state whether the Sempron 130 is ahead of or behind any specific processor. The data contains no comparison percentages. This comparison section is a record of absence: no rivals, no scores, no comparison values. The architectural facts, 1 core, 1 thread, 2.60 GHz, 45 W TDP, 45 nm, 234 million transistors, 117 mm², 128 KB L1, 512 KB L2, no L3, are not comparison metrics. The AM3 socket, DDR3 dual-channel memory, and PCIe Gen 2 are platform details, not rival comparisons. The 50th-percentile rank is the only “vs all CPUs” number, and it is unsupported by the zero average score. The empty nearestRivals list prevents any comparative conclusion.

Platform and Compatibility, socket, memory support, PCIe, upgrade path

The Sempron 130 is built for AMD Socket AM3. It supports DDR3 memory through a dual-channel bus. ECC memory support is not listed, so compatible memory is non-ECC. The PCIe interface is Gen 2. Integrated graphics are described as a chipset feature on certain motherboards, not as part of the CPU. The multiplier is not unlocked, so multiplier-based overclocking is unavailable. The production status is end-of-life, and the release date is in July 2011. The market segment is desktop.

Because the socket is AM3, any CPU upgrade would have to remain within the AM3 ecosystem; the data does not list a specific upgrade part. The memory bus is dual-channel DDR3, and no memory bandwidth figure is listed. The PCIe Gen 2 interface is the available expansion interface. The 1-core, 1-thread design means the platform is not oriented toward high thread-count workloads. The 45 W TDP makes it a low-power occupant for an AM3 motherboard. With end-of-life status, the support window is closed.

The cache hierarchy is 128 KB L1 per core, 512 KB L2 per core, and no L3. The base clock is 2.60 GHz, no boost clock is listed, and the 45 nm process and 117 mm² die are manufacturing facts. The dual-channel memory bus provides a wider memory path, while the single thread limits parallel execution. The lack of ECC support narrows memory choices to non-ECC modules. The locked multiplier removes one overclocking route. In upgrade terms, the AM3 socket and DDR3 support tie this CPU to a legacy platform; the empty nearestRivals list means no compared successor is offered. The July 2011 release date and 45 nm process place it in an earlier desktop platform generation.