AMD

AMD Ryzen Embedded V3C16

AMD processor specifications and benchmark scores

6
Cores
12
Threads
3.8
GHz Boost
15W
TDP
🛡️ECC Memory

AMD Ryzen Embedded V3C16 Specifications

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Ryzen Embedded V3C16 Core Configuration

Processing cores and threading

The AMD Ryzen Embedded V3C16 features 6 physical cores and 12 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
6
Threads
12
SMP CPUs
1
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Embedded V3C16 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Ryzen Embedded V3C16 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Ryzen Embedded V3C16 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
3.8 GHz
Multiplier
20x
💾

AMD's Ryzen Embedded V3C16 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Embedded V3C16 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Ryzen Embedded V3C16's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
16 MB (shared)
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Zen 3+ Architecture & Process

Manufacturing and design details

The AMD Ryzen Embedded V3C16 is built on AMD's 6 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Embedded V3C16 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3+
Codename
Rembrandt
Process Node
6 nm
Foundry
TSMC
Generation
Ryzen Embedded (Zen 3+ (Rembrandt))
🔢

Zen 3+ Instruction Set Features

Supported CPU instructions and extensions

The Ryzen Embedded V3C16 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2
XFR 2
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Embedded V3C16 Power & Thermal

TDP and power specifications

The AMD Ryzen Embedded V3C16 has a TDP (Thermal Design Power) of 15W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
15W
Tj Max
105°C
Configurable TDP
10-25W
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AMD Socket FP7 Platform & Socket

Compatibility information

The Ryzen Embedded V3C16 uses the AMD Socket FP7 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket FP7
PCIe
Gen 4, 20 Lanes(CPU only)
Package
FP7r2
DDR5

AMD Socket FP7 Memory Support

RAM compatibility and speeds

Memory support specifications for the Embedded V3C16 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Ryzen Embedded V3C16 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Dual-channel
Memory Bandwidth
76.8 GB/s
ECC Memory
Supported
📦

Ryzen Embedded V3C16 Product Information

Release and pricing details

The AMD Ryzen Embedded V3C16 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Ryzen Embedded V3C16 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2022
Market
Desktop
Status
Active
Part Number
100-000000555

Ryzen Embedded V3C16 Benchmark Scores

📊

No benchmark data available for this CPU.

About AMD Ryzen Embedded V3C16

The AMD Ryzen Embedded V3C16 is a highly integrated system-on-chip (SoC) built upon AMD's advanced "Zen 3+" core architecture, codenamed Rembrandt. This places it within the modern generation of Ryzen Embedded processors, leveraging significant improvements in instructions per clock (IPC) over previous designs. Manufactured on an energy-efficient 6 nm process technology, the AMD Ryzen Embedded V3C16 achieves a balance of performance and power efficiency crucial for embedded applications. With a base clock speed of 2.0 GHz and a maximum boost clock of up to 3.8 GHz, it is engineered for responsive operation. The architecture includes a substantial 16 MB of shared L3 cache, which enhances data access speeds for the CPU cores. This combination of a modern process and architecture makes the V3C16 a compelling solution for demanding embedded workloads.

An official performance score overview is not available due to the specialized nature of the embedded market and a lack of standardized public benchmarks. However, key specifications provide clear indicators of the AMD Ryzen Embedded V3C16's capabilities for compute-intensive tasks. The processor's six cores and twelve threads, enabled by simultaneous multithreading (SMT), allow it to efficiently handle parallel workloads. The high turbo clock frequency ensures strong single-threaded performance when needed. The design's thermal design power (TDP) of just 15 watts highlights its exceptional performance-per-watt characteristics. This makes the processor suitable for space-constrained and thermally sensitive environments where consistent performance is required.

In terms of competitive positioning, the AMD Ryzen Embedded V3C16 occupies a unique niche with its combination of core count, thread count, and low power envelope. Its primary competitive advantages in the embedded space can be summarized as follows:

  1. The "Zen 3+" architecture provides a significant IPC uplift over competing architectures, leading to superior computational efficiency.
  2. The 15W TDP allows for deployment in fanless or passively cooled designs, offering acoustic and reliability benefits.
  3. The integrated AMD Radeon graphics, though not detailed in core specs, provide a modern visual output solution without a discrete GPU.
This positioning makes the AMD Ryzen Embedded V3C16 a strong candidate for applications requiring substantial processing power within strict power budgets.

For optimal system integration, several pairing suggestions should be considered to maximize the potential of the AMD Ryzen Embedded V3C16. System designers should select LPDDR5 or DDR5 memory to fully leverage the memory controller's capabilities and ensure high bandwidth. Storage should consist of modern NVMe PCIe drives to prevent bottlenecks and provide fast data access. The platform's longevity and reliability are supported by the durable AMD Socket FP7, which is designed for extended lifecycle requirements. Careful thermal solution design is paramount to maintain boost clocks under sustained load, even with the low 15W TDP. These considerations ensure that systems built around the processor will deliver consistent and reliable performance.

The Intel Equivalent of Ryzen Embedded V3C16

Looking for a similar processor from Intel? The Intel Core i5-13600KF offers comparable performance and features in the Intel lineup.

Intel Core i5-13600KF

Intel • 14 Cores

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