AMD Phenom II X6 1090T BE
AMD processor specifications and benchmark scores
Unlocked
Integrated GPU
ECC MemoryAt a Glance
AMDAMD Phenom II X6 1090T BE Specifications
Phenom II X6 1090T BE Core Configuration
Processing cores and threading
The AMD Phenom II X6 1090T BE features 6 physical cores and 6 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Phenom II X6 1090T BE Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Phenom II X6 1090T BE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Phenom II X6 1090T BE by AMD can dynamically adjust its frequency based on workload and thermal headroom.
AMD's Phenom II X6 1090T BE Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Phenom II X6 1090T BE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Phenom II X6 1090T BE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
K10 Architecture & Process
Manufacturing and design details
The AMD Phenom II X6 1090T BE is built on AMD's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phenom II X6 1090T BE incorporate advanced branch prediction and out-of-order execution for optimal performance.
K10 Instruction Set Features
Supported CPU instructions and extensions
The Phenom II X6 1090T BE by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Power & Thermal
TDP and power specifications
The AMD Phenom II X6 1090T BE has a TDP (Thermal Design Power) of 125W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
AMD Socket AM3 Platform & Socket
Compatibility information
The Phenom II X6 1090T BE uses the AMD Socket AM3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
AMD Socket AM3 Memory Support
RAM compatibility and speeds
Memory support specifications for the Phenom II X6 1090T BE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Phenom II X6 1090T BE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
AMD's Phenom II X6 1090T BE Integrated Graphics
Built-in GPU specifications
The AMD Phenom II X6 1090T BE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Phenom II X6 1090T BE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Product Information
Release and pricing details
The AMD Phenom II X6 1090T BE is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Phenom II X6 1090T BE by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.
About AMD Phenom II X6 1090T BE
The AMD Phenom II X6 1090T BE is an end-of-life desktop processor in the AMD Phenom II X6 (Thuban) generation, built on the K10 architecture at GlobalFoundries' 45 nm node. It contains 904 million transistors on a 346 mm² die, uses AMD Socket AM3, and was released on 2010-04-26 with a launch MSRP of $295. The chip has 6 cores and 6 threads, with a 3.20 GHz base clock and a 3.60 GHz boost clock, and it carries a 125 W TDP. In the database it sits at the 50th percentile of all CPUs, but its average benchmark score is recorded as 0, and the nearestRivals list is empty.
Benchmark Performance
The FACT PACK contains no individual benchmark scores. The only ranking-related entries are the 50th-percentile position among all CPUs and an average benchmark score of 0. Because the nearestRivals array is empty, there are no rival names, no rival scores, and no deltaPct values from which percentage deltas could be derived. The data therefore does not support statements such as "ahead by a percentage" or "behind by a percentage"; the absence of comparison data is a constraint of the record. The raw score field being 0 means the database currently has no accumulated benchmark result for the chip.
What remains available are the specification-level factors. The CPU provides 6 physical cores and 6 threads. Its base clock is 3.20 GHz and its boost clock is 3.60 GHz. The cache hierarchy is listed as 128 KB of L1 per core, 512 KB of L2 per core, and 6 MB of shared L3. These numbers describe the processing resources but not measured performance. The 45 nm process, 904 million transistor count, and 346 mm² die size are structural properties of the silicon and can inform expectations about the platform, yet they are not performance scores. The 50th-percentile rank places the chip in the middle of the database ranking, though the percentile is only meaningful when scores exist; with a 0 average score, the rank should be interpreted cautiously. No additional benchmark fields are included in the data set.
Single-Thread vs Multi-Thread Behavior
The thread count equals the core count: 6 threads and 6 cores. This indicates a single logical thread per physical core, with no simultaneous multithreading described. A workload that fits into a single thread can use one core at the highest listed frequency, 3.60 GHz, while a workload that spreads across threads can engage all six cores at the base clock of 3.20 GHz or possibly higher when boost conditions are met; however, the pack does not specify how many cores are active during boost operation. The K10 architecture and Thuban codename are the design identifiers listed.
For single-thread behavior, the relevant per-core resources are 128 KB of L1 and 512 KB of L2. For multi-thread behavior, the relevant resource is the pool of six cores and the shared 6 MB L3. The shared L3 is a common cache for the six cores, separate from the per-core L1 and L2. The database does not include per-thread or single-thread benchmark entries, so no numerical single-thread versus multi-thread split can be made. The average benchmark score of 0 further prevents any workload-pattern comparison. The unlocked multiplier means a user can change frequency settings, but no overclocking results are recorded in the pack. Therefore, the behavior section can only describe the hardware configuration rather than measured execution.
Platform and Compatibility
The processor is designed for AMD Socket AM3. Memory support covers DDR2 and DDR3, through a dual-channel memory bus with a listed bandwidth of 21.3 GB/s. ECC memory support is enabled. The PCIe interface is Gen 2. Integrated graphics are not listed as part of the CPU; the pack says "On certain motherboards (Chipset feature)". The market segment is Desktop, and the production status is End-of-life. The part number is HDT90ZFBK6DGRHDT90ZFBGRBOX. The package was released on 2010-04-26. The processor base architecture is K10, codename Thuban, part of the Phenom II X6 (Thuban) generation. The foundry is GlobalFoundries using a 45 nm process. The die is 346 mm² in area and holds 904 million transistors. The multiplier unlocked field is true, so the CPU is marked BE in the product name and permits clock multiplier adjustment.
The socket and memory support define the platform boundaries: an AM3 motherboard is required, and the memory controller accepts both DDR2 and DDR3. The data does not name specific chipsets or motherboards beyond the chipset feature for integrated graphics. The production status end-of-life indicates the product is no longer active, and no forward upgrade path is included in the FACT PACK. The cache resources are 128 KB L1 per core, 512 KB L2 per core, and 6 MB shared L3. With the memory bandwidth listed at 21.3 GB/s, the platform has a defined ceiling for moving data to and from memory.
How It Compares
The nearestRivals field in the FACT PACK is empty. There are no nearest-rival records to report. As a result, this record contains no rival names, no rival scores, and no deltaPct percentages. The only comparative field is percentileVsAllCpus, which is 50. The average benchmark score is 0, meaning there is no measured score to place next to any other product. In this data set, the CPU's position is therefore limited to a middle percentile ranking and the product specifications already listed. No numerical claims about other processors can be made from this FACT PACK. If rival data existed, the deltaPct values would be the source for percentage comparisons; no such values are present. The absence of comparison entries is the determining data condition.
Power and Thermals
The TDP listed for the AMD Phenom II X6 1090T BE is 125 W. This is a fixed specification in the FACT PACK and establishes the power class for the CPU. The chip is built on GlobalFoundries' 45 nm process with 904 million transistors and a 346 mm² die. Those structural characteristics are relevant to thermals, but the pack does not include a maximum operating temperature, measured power draw, or cooling package. The 125 W TDP implies that a cooling solution appropriate for a 125 W class processor is required. No cooler size or type is listed, so the analysis cannot be more specific. The product is end-of-life, and no engineering sample or thermal validation data is included. The CPU uses an AMD Socket AM3 package, and its architecture is K10 with the Thuban codename. The base clock is 3.20 GHz and the boost clock is 3.60 GHz, both of which affect thermal output under load, but the pack does not quantify frequency-dependent power. In short, the only absolute power/thermal number is 125 W.
FAQ
Q: What socket does the AMD Phenom II X6 1090T BE use?
A: It uses AMD Socket AM3.
Q: How many cores and threads does it have?
A: It has 6 cores and 6 threads, so each core has a single logical thread.
Q: What memory support and bandwidth are listed?
A: The memory support is DDR2 and DDR3, dual-channel, with a listed bandwidth of 21.3 GB/s and ECC memory support.
Q: Does the CPU include integrated graphics?
A: Integrated graphics are listed as a chipset feature on certain motherboards, not as part of the CPU specification.
Q: Is the multiplier unlocked?
A: Yes, the multiplierUnlocked field is true, matching the BE suffix in the product name.
Q: What are the production status and release date?
A: Production status is end-of-life, and the release date is 2010-04-26.
Detailed benchmark scores and charts for the AMD Phenom II X6 1090T BE are below.
Benchmark Scores
No benchmark data available for this CPU.
Compare with Other CPUs
Select another CPU to compare specifications and benchmarks side-by-side.
Browse CPUs