AMD Phenom II X3 740 BE
AMD processor specifications and benchmark scores
AMD Phenom II X3 740 BE Specifications
Phenom II X3 740 BE Core Configuration
Processing cores and threading
The AMD Phenom II X3 740 BE features 3 physical cores and 3 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Phenom II X3 740 BE Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Phenom II X3 740 BE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Phenom II X3 740 BE by AMD can dynamically adjust its frequency based on workload and thermal headroom.
AMD's Phenom II X3 740 BE Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Phenom II X3 740 BE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Phenom II X3 740 BE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
K10 Architecture & Process
Manufacturing and design details
The AMD Phenom II X3 740 BE is built on AMD's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phenom II X3 740 BE incorporate advanced branch prediction and out-of-order execution for optimal performance.
K10 Instruction Set Features
Supported CPU instructions and extensions
The Phenom II X3 740 BE by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Phenom II X3 740 BE Power & Thermal
TDP and power specifications
The AMD Phenom II X3 740 BE has a TDP (Thermal Design Power) of 95W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
AMD Socket AM3 Platform & Socket
Compatibility information
The Phenom II X3 740 BE uses the AMD Socket AM3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
AMD Socket AM3 Memory Support
RAM compatibility and speeds
Memory support specifications for the Phenom II X3 740 BE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Phenom II X3 740 BE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
AMD's Phenom II X3 740 BE Integrated Graphics
Built-in GPU specifications
The AMD Phenom II X3 740 BE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Phenom II X3 740 BE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Phenom II X3 740 BE Product Information
Release and pricing details
The AMD Phenom II X3 740 BE is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Phenom II X3 740 BE by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.
Phenom II X3 740 BE Benchmark Scores
No benchmark data available for this CPU.
About AMD Phenom II X3 740 BE
AMD Phenom II X3 740 BE Hardware Breakdown
The AMD Phenom II X3 740 BE, nicknamed the "Heka" core, represents a robust triple-core design from AMD's Phenom II X3 lineup that emerged in 2009. At its core, it leverages the 45 nm manufacturing process to pack functionality into a diminutive package. The triple-core configuration, though non-uniform in some earlier Phenom II variants, ensures three active processing engines that can execute tasks simultaneously when supported by the OS and applications. Its base clock speed of 3.00 GHz forms the foundation for real-world performance, while the 95W TDP signifies a balanced energy-to-performance ratio suitable for mainstream desktop systems. Socket AM3 compatibility opens the door for future upgrades to quad-core processors or even new-generation CPUs, confirming its forward compatibility. Performance frequencies for the 740 BE are straightforward yet effective 3.00 GHz provides a solid baseline for everyday computing, multitasking, and moderate gaming needs. The thermal design, capped at 95W, demands that cooling solutions like decent air coolers or efficient low-profile heatsinks are employed to maintain stable operation under sustained loads. The 6 MB shared L3 cache system enhances data access efficiency, particularly beneficial for workloads involving large datasets or applications that benefit from cache coherency across cores. In essence, the 740 BE excels in scenarios where resource efficiency, thermal management, and core count synergy are paramount.Performance and System Synergy
The AMD Phenom II X3 740 BE, also known as the "740 BE" or simply "Heka triple-core," is engineered to thrive in a range of workloads stretching from productivity tasks to light gaming. Its architecture supports multiple threads via hyper-threading emulation (three threads), though this is primarily a software-level optimization rather than a true hardware-level thread execution. The cache hierarchy, with its 6 MB shared L3 cache, plays a pivotal role in speeding up access to frequently used data, which directly impacts application responsiveness and overall system snappiness. Its ideal workloads include office applications, media playback, moderate gaming (especially at lower resolutions), and content creation tasks like photo editing where multi-threaded efficiency is useful but not critical. For users prioritizing a balanced approach to performance and power consumption, the 740 BE delivers a compelling mix. Its 45 nm process allows for stable operation even with modest cooling, while the TDP-conscious design makes it an economical choice for budget-oriented builds. When pushing the envelope, applications that leverage multi-core processing will see the full benefit of the three active cores, making it a versatile performer in environments where thermal and power constraints must be managed judiciously. Overall, the 740 BE stands as a testament to AMDโs engineering efforts to deliver efficiency and capability in the mid-range CPU segment during its era.- Triple-core processor: Three active cores for parallel processing tasks.
- 45 nm manufacturing process: Ensures efficiency and stability under load.
- 3.00 GHz base clock: Provides a solid foundation for daily computing.
- 95W thermal design power: Balanced cooling requirements for mainstream systems.
- 6 MB shared L3 cache: Enhances memory access speed and application responsiveness.
- Socket AM3: Compatible with both existing and future AMD CPU upgrades.
The Intel Equivalent of Phenom II X3 740 BE
Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.
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