AMD

AMD Phenom II X3 740 BE

AMD processor specifications and benchmark scores

3
Cores
3
Threads
GHz Boost
95W
TDP
Unlocked Integrated GPU ECC Memory

At a Glance

AMD
Cores / Threads 3C / 3T
Base Clock 3 GHz
L3 Cache 6 MB (shared)
TDP 95W
Architecture K10
Socket AMD Socket AM3
nm
Process 45 nm
Released Sep 2009

AMD Phenom II X3 740 BE Specifications

Phenom II X3 740 BE Core Configuration

Processing cores and threading

The AMD Phenom II X3 740 BE features 3 physical cores and 3 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
3
Threads
3
SMP CPUs
1

Phenom II X3 740 BE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Phenom II X3 740 BE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Phenom II X3 740 BE by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3 GHz
Boost Clock
N/A
Multiplier
15x (Unlocked)

AMD's Phenom II X3 740 BE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Phenom II X3 740 BE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Phenom II X3 740 BE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
6 MB (shared)

K10 Architecture & Process

Manufacturing and design details

The AMD Phenom II X3 740 BE is built on AMD's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Phenom II X3 740 BE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K10
Codename
Heka
Process Node
45 nm
Foundry
GlobalFoundries
Transistors
758 million
Die Size
258 mm²
Generation
Phenom II X3 (Heka)

K10 Instruction Set Features

Supported CPU instructions and extensions

The Phenom II X3 740 BE by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSE4A
AMD64
AMD-V

Phenom II X3 740 BE Power & Thermal

TDP and power specifications

The AMD Phenom II X3 740 BE has a TDP (Thermal Design Power) of 95W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
95W

AMD Socket AM3 Platform & Socket

Compatibility information

The Phenom II X3 740 BE uses the AMD Socket AM3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket AM3
Chipsets
AMD 700 Series, AMD 800 Series, AMD 900 Series, nForce 630a, nForce 700a, nForce 900a
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket AM3 Memory Support

RAM compatibility and speeds

Memory support specifications for the Phenom II X3 740 BE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Phenom II X3 740 BE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2, DDR3
Memory Bus
Dual-channel
Memory Bandwidth
21.3 GB/s
ECC Memory
Supported

AMD's Phenom II X3 740 BE Integrated Graphics

Built-in GPU specifications

The AMD Phenom II X3 740 BE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Phenom II X3 740 BE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Phenom II X3 740 BE Product Information

Release and pricing details

The AMD Phenom II X3 740 BE is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Phenom II X3 740 BE by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2009
Market
Desktop
Status
End-of-life
Part Number
HDZ740WFK3DGIHDZ740WFGIBOX

Phenom II X3 740 BE Benchmark Scores

No benchmark data available for this CPU.

About AMD Phenom II X3 740 BE

Platform and Compatibility

The AMD Phenom II X3 740 BE is a desktop processor built on the K10 architecture with the Heka codename, manufactured on a 45 nm process at GlobalFoundries. It uses the AMD Socket AM3 platform, which provides compatibility with a broad range of motherboards from the late-2000s era. The chip integrates 758 million transistors on a 258 mm² die, reflecting the density and power characteristics typical of its generation.

Memory support is dual-channel, with compatibility for both DDR2 and DDR3 modules. This flexibility allows the processor to be paired with either older DDR2-based AM2+ boards or newer DDR3-based AM3 boards, depending on the motherboard's memory controller implementation. The memory bus operates at a rated bandwidth of 21.3 GB/s, which is a fixed figure for the platform and does not vary with memory type. ECC memory is supported, making the chip viable in entry-level workstation or server scenarios where error-correcting memory is a requirement.

The processor provides PCIe Gen 2 connectivity, which was the standard for its release era. Integrated graphics are not part of the CPU die; instead, the FACT PACK notes that graphics are available "on certain motherboards (Chipset feature)," meaning any visual output depends on the motherboard's integrated chipset GPU or a discrete graphics card. The processor has an unlocked multiplier, allowing overclocking through the motherboard's BIOS or software utilities.

Upgrade path considerations are limited by the platform's age. The AM3 socket supports both AM3 and some AM2+ processors, but the Phenom II X3 740 BE sits in the middle of that compatibility range. Users with an AM3 board can potentially upgrade to higher-core-count Phenom II X4 or X6 parts, though the exact support depends on the motherboard's BIOS revision and power delivery design. The production status is end-of-life, so new units are no longer manufactured, and availability is limited to the used market.

How It Compares

The FACT PACK lists no nearest rivals and no benchmark scores for this processor. The percentileVsAllCpus field indicates a value of 50, which places it at the median of all CPUs in the benchmark database. The avgBenchmarkScore is 0, meaning no performance data has been recorded for this specific SKU. Without rival comparisons or benchmark results, the positional analysis must rely on the architectural and specification data provided.

The Phenom II X3 740 BE has 3 cores and 3 threads, with a base clock of 3.00 GHz and no boost clock. This places it as a mid-range triple-core offering from AMD's K10 generation. Compared to dual-core processors of the same era, the extra core provides a theoretical 50% increase in parallel compute capacity, but the lack of SMT (Simultaneous Multi-Threading) means each core handles exactly one thread. In multi-threaded workloads, the chip can outperform dual-core parts, but it will trail quad-core parts by a similar margin.

The 6 MB shared L3 cache is a notable advantage over older AMD chips with smaller or no L3, as it reduces memory latency for frequently accessed data. The 128 KB L1 and 512 KB L2 per core are standard for the architecture. The 95 W TDP indicates a moderate power draw, requiring a capable air cooler but not an exotic liquid solution.

Who Should Consider It

The data indicates this processor is best suited for users running legacy software that benefits from three physical cores but does not require high thread counts. Office productivity tasks such as word processing, spreadsheet work, and web browsing will run adequately, given the 3.00 GHz base clock and 6 MB L3 cache. The ECC memory support makes it a candidate for a low-cost file server or home lab where data integrity is prioritized over raw speed.

For gaming, the triple-core configuration can handle titles from the late-2000s and early-2010s, but modern games that scale beyond two cores may show stuttering or lower frame rates. The lack of a boost clock means the processor always runs at its maximum rated frequency, which helps consistency but limits single-threaded burst performance. The integrated graphics option (via motherboard chipset) is not suitable for gaming; a discrete GPU is required for any serious 3D workload.

Content creation workloads, such as video encoding or 3D rendering, will use all three cores effectively, but the absence of a fourth core and the lack of SMT will result in slower completion times compared to quad-core alternatives. The 21.3 GB/s memory bandwidth is sufficient for these tasks, though modern processors exceed this by a wide margin. Users running older software that was optimized for triple-core CPUs—such as certain early DirectX 10 games—may find this chip a reasonable match.

FAQ

Q: What socket does the AMD Phenom II X3 740 BE use?

A: It uses the AMD Socket AM3.

Q: Does this processor support ECC memory?

A: Yes, ECC memory is supported.

Q: What is the base clock speed of the Phenom II X3 740 BE?

A: The base clock is 3.00 GHz, with no boost clock available.

Q: How much L3 cache does the processor have?

A: It has 6 MB of shared L3 cache.

Q: Is the multiplier unlocked for overclocking?

A: Yes, the multiplier is unlocked.

Q: What memory types are compatible with this CPU?

A: It supports both DDR2 and DDR3 memory, in dual-channel configuration.

Q: Does the processor have integrated graphics?

A: No, integrated graphics are only available on certain motherboards as a chipset feature, not on the CPU itself.

Benchmark Performance

The FACT PACK provides no benchmark scores, no nearest rivals, and an avgBenchmarkScore of 0. The only performance-related metric is the percentileVsAllCpus value of 50, which indicates that the processor sits exactly at the median of all CPUs in the database. This is a neutral ranking, meaning half of all recorded processors are faster and half are slower. However, this percentile is based on the entire database, which includes modern multi-core processors, so the absolute performance level is likely low by current standards.

Without benchmark data, the performance analysis must be inferred from the specification sheet. The 3-core, 3-thread configuration with a 3.00 GHz base clock suggests a processor that excels in lightly threaded tasks but lags in heavily parallel workloads. The 6 MB L3 cache helps mitigate the memory latency penalty that smaller caches might impose, but the dual-channel memory bus at 21.3 GB/s is a bottleneck compared to later platforms with higher bandwidth.

In single-threaded workloads, the 3.00 GHz clock is respectable for its era, but modern CPUs with higher IPC (instructions per cycle) will outperform it despite similar or lower clock speeds. The K10 architecture was known for decent integer performance but weaker floating-point throughput compared to Intel's Core 2 and Nehalem designs of the same period. The lack of a boost clock means there is no headroom for transient frequency increases, so the processor's performance is entirely predictable.

Multi-threaded performance is bounded by the three cores. Compared to a dual-core processor with the same clock speed, the 740 BE offers a 50% increase in thread count, which translates to near-linear scaling in well-parallelized workloads like video encoding or scientific computing. However, compared to a quad-core processor, the 740 BE loses by about 25% in ideal scaling scenarios. The absence of SMT means that each core can only handle one thread, so the effective thread count equals the core count.

The 95 W TDP is moderate for a triple-core chip of its generation. This power envelope allows for quiet cooling solutions and modest power supply requirements, but the 45 nm process node is less efficient than modern nodes, so performance per watt is low by contemporary standards. The memory bandwidth of 21.3 GB/s is shared between all three cores, which may cause contention in memory-intensive applications.

The percentile rank of 50 is the only quantitative performance indicator available. It suggests that in the context of the entire benchmark database—which spans many generations and market segments—the 740 BE is an average performer. This is consistent with its position as a mid-range desktop processor from 2009. Users considering this chip today should set expectations accordingly: it will handle basic tasks and legacy software, but it will struggle with modern multi-threaded applications and high-end gaming. The ECC memory support and unlocked multiplier provide some value for niche use cases, but the lack of benchmark data and the end-of-life status make it a specialist choice rather than a general-purpose recommendation.

The Intel Equivalent of Phenom II X3 740 BE

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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