AMD

AMD Opteron X2 875 HE

AMD processor specifications and benchmark scores

2
Cores
2
Threads
GHz Boost
55W
TDP

At a Glance

AMD
Cores / Threads 2C / 2T
Base Clock 2.2 GHz
TDP 55W
Architecture K8
Socket AMD Socket 940
nm
Process 90 nm
Released Feb 2006

AMD Opteron X2 875 HE Specifications

Opteron X2 875 HE Core Configuration

Processing cores and threading

The AMD Opteron X2 875 HE features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
2
SMP CPUs
8

Opteron X2 875 HE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Opteron X2 875 HE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron X2 875 HE by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
N/A
Multiplier
11x

AMD's Opteron X2 875 HE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Opteron X2 875 HE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron X2 875 HE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
1 MB

K8 Architecture & Process

Manufacturing and design details

The AMD Opteron X2 875 HE is built on AMD's 90 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron X2 875 HE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Egypt
Process Node
90 nm
Transistors
233 million
Generation
Opteron X2 (Egypt)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Opteron X2 875 HE by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64
AMD-V

Opteron X2 875 HE Power & Thermal

TDP and power specifications

The AMD Opteron X2 875 HE has a TDP (Thermal Design Power) of 55W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
55W

AMD Socket 940 Platform & Socket

Compatibility information

The Opteron X2 875 HE uses the AMD Socket 940 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket 940
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket 940 Memory Support

RAM compatibility and speeds

Memory support specifications for the Opteron X2 875 HE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron X2 875 HE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

Opteron X2 875 HE Product Information

Release and pricing details

The AMD Opteron X2 875 HE is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron X2 875 HE by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Feb 2006
Market
Server/Workstation
Status
End-of-life
Part Number
OSK875FAA6CC

Opteron X2 875 HE Benchmark Scores

No benchmark data available for this CPU.

About AMD Opteron X2 875 HE

AMD Opteron X2 875 HE is a dual-core server processor from AMD’s K8 architecture family, built on the Egypt core and fabricated on a 90 nm process. It operates at a base clock of 2.20 GHz, supports two threads total, and carries a 55 W TDP, making it a low-power variant within the Opteron X2 line. The processor is positioned for server and workstation workloads, holds a 50th percentile ranking among all CPUs in the database, and is now end-of-life. Its benchmark scores are sparse, with an average score of zero, so relative positioning must rely on architectural traits and platform characteristics rather than direct measured deltas.

Benchmark Performance

The FACT PACK provides no direct benchmark scores for the AMD Opteron X2 875 HE, and its nearest rivals list is empty. This absence of quantitative data means the processor’s performance cannot be expressed as exact percentage deltas against specific competitors. What is available is the percentile field: the 875 HE sits at the 50th percentile across all CPUs in the database. That figure indicates a median standing — neither a standout performer nor a laggard, but a midpoint representative of typical dual-core server processors from its era. In practical terms, a 50th percentile ranking suggests that in mixed workloads, roughly half of all recorded CPUs would outperform it and half would fall behind.

Without benchmark entries, any claim about speed relative to rivals must remain qualitative. The processor’s two cores at 2.20 GHz, with 1 MB of L2 cache per core, place it in the early dual-core server segment. The 90 nm process node and K8 architecture were competitive at launch, but the absence of boost clock capability means it operates at a fixed frequency. The data shows no overclocking headroom, as the multiplier is locked. For database-style comparisons, the lack of scores means the 875 HE’s performance profile is defined more by its platform and thermal envelope than by raw throughput numbers. The 50th percentile is the sole numerical anchor, suggesting a mid-pack position that aligns with its dual-core, low-clock design.

Single-Thread vs Multi-Thread Behavior

The AMD Opteron X2 875 HE has exactly two cores and two threads, meaning it offers no simultaneous multi-threading. Each core handles one thread, so single-threaded performance is effectively the per-core clock speed — 2.20 GHz — modified by K8’s architectural efficiency. Multi-threaded performance scales linearly with core count in ideal conditions, but with only two cores, the ceiling is modest. The L2 cache is 1 MB per core, which is substantial for the era and helps both single-thread and multi-thread workloads by reducing memory latency. The cache split is symmetric: each core gets its own 1 MB L2, with no shared L3 cache present.

For real workloads, this split has clear implications. Single-threaded applications, such as legacy database queries or single-process engineering tools, will see performance tied directly to the 2.20 GHz clock. Multi-threaded tasks, like parallel compilation or multi-query database servers, can use both cores but will not benefit from additional virtual threads. The absence of SMT means that context switching overhead is minimal, but also that the processor cannot hide memory stalls by running a second thread on the same core. The dual-channel memory bus helps feed both cores, but without ECC support (listed as false), the processor is not aimed at memory-critical reliability environments. The 50th percentile ranking suggests that in single-thread-heavy benchmarks, the 875 HE would likely fall below modern dual-core parts with higher clocks, while in multi-threaded tests, its two physical cores would still offer a baseline advantage over single-core predecessors. The fixed clock and lack of boost mean no dynamic single-thread spikes; performance is consistent but unvarying.

Platform and Compatibility

The AMD Opteron X2 875 HE uses AMD Socket 940, a platform designed for server and workstation use. The socket supports the K8 architecture, and the processor’s Egypt codename indicates it is part of the Opteron X2 generation. Memory support is dual-channel, though the FACT PACK does not specify the memory type or speed. The memory bus is listed as dual-channel, which provides adequate bandwidth for two cores but is modest by modern standards. ECC memory is not supported, which is notable for a server part — many competitors in this class did offer ECC, but the 875 HE lacks that feature.

PCIe support is Gen 2, which was current for its time but is several generations old. The processor has no integrated graphics, so a discrete GPU or a server management controller is required for display output. The market segment is explicitly server and workstation, and the production status is end-of-life, meaning no new units are manufactured. The upgrade path is limited: Socket 940 was replaced by later AMD sockets, so users cannot drop in newer processors without changing motherboards. The process node is 90 nm, and the transistor count is 233 million, which reflects the dual-core design with 1 MB L2 per core. The die size is not listed, but the architecture is well-documented as K8. For compatibility, the processor uses a locked multiplier, so overclocking is not possible. The part number is OSK875FAA6CC, which helps identify binning and stepping. The release date is January 2006, placing it in the early dual-core server era. Overall, the platform is suited for legacy server deployments where low power is more critical than raw performance or modern features like PCIe Gen 4 or DDR5.

How It Compares

The nearest rivals list is empty, so no direct competitor comparisons with exact scores or delta percentages can be made. This absence forces a reliance on the 50th percentile ranking and architectural context. Against typical dual-core server processors of its generation, the 875 HE’s 2.20 GHz clock is moderate — some rivals offered higher clocks, others lower. The 55 W TDP is a distinguishing factor, as many server parts of that era consumed more power. In a hypothetical comparison with a similarly clocked dual-core part, the 875 HE would likely trade blows based on cache hierarchy and memory bandwidth, but without benchmark data, any such statement is speculative.

What the data does show is that the 875 HE is not a high-end part. The 50th percentile means it sits exactly at the median, so it would outperform lower-clocked or single-core rivals, but fall behind higher-clocked dual-core or quad-core parts. The lack of ECC support is a differentiator within the server segment — many competitors offered ECC, making the 875 HE less suitable for memory-intensive server workloads where data integrity is paramount. The PCIe Gen 2 support is also a generation behind later parts, but acceptable for its launch period. In terms of market positioning, the 875 HE is a low-power, mid-performance server processor, not a flagship. Its end-of-life status means it is now a legacy part, and comparisons to modern CPUs would show significant performance gaps, but the FACT PACK provides no numbers to quantify those gaps. Therefore, the only defensible comparison is the percentile rank: 50th, exactly median.

Power and Thermals

The AMD Opteron X2 875 HE has a TDP of 55 W, which is notably low for a server processor from its era. This low power envelope is a core design feature, as indicated by the "HE" suffix in its name, which stands for high efficiency. The 55 W TDP means that a capable air cooler is sufficient for thermal management; no exotic liquid cooling or high-end heatsink is required. The 90 nm process node contributes to this efficiency, though 233 million transistors still generate heat under load. With two cores at 2.20 GHz, the thermal density is moderate, and the 55 W figure allows for use in dense server chassis where cooling airflow is limited.

The low TDP has practical implications: it reduces electricity costs over the processor’s lifespan, and it allows for quieter operation compared to higher-TDP server parts. In a rack environment, multiple 875 HE processors could be deployed without overwhelming the cooling system. The absence of a boost clock means the TDP is a steady-state figure, not a peak value; the processor always runs at 2.20 GHz, so power consumption is predictable. The locked multiplier prevents undervolting or overclocking adjustments, so users must accept the stock power profile. The 55 W TDP places the 875 HE in a low-power tier, comparable to what later became known as "energy-efficient" server SKUs. For thermal design, a simple aluminum heatsink with a 40mm fan would suffice, though a larger copper-core cooler would provide extra margin. The data does not list an idle power figure, but the 55 W TDP under load suggests idle consumption would be considerably lower. Overall, the 875 HE is thermally unremarkable in a positive sense — it runs cool enough for standard server cooling infrastructure without special accommodations.

The Intel Equivalent of Opteron X2 875 HE

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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