AMD

AMD Opteron 8350

AMD processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
95W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 4C / 4T
Base Clock 2000 GHz
L3 Cache 2 MB (shared)
TDP 95W
Architecture Zen 3
Socket AMD Socket Fr2
nm
Process 65 nm
Released Sep 2007

AMD Opteron 8350 Specifications

Opteron 8350 Core Configuration

Processing cores and threading

The AMD Opteron 8350 features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
8

Opteron 8350 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Opteron 8350 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron 8350 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
N/A
Multiplier
10x

AMD's Opteron 8350 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Opteron 8350 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron 8350's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
2 MB (shared)

Zen 3 Architecture & Process

Manufacturing and design details

The AMD Opteron 8350 is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron 8350 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3
Codename
Barcelona
Process Node
65 nm
Transistors
463 million
Die Size
285 mm²
Generation
Opteron (Barcelona)

Zen 3 Instruction Set Features

Supported CPU instructions and extensions

The Opteron 8350 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2

Power & Thermal

TDP and power specifications

The AMD Opteron 8350 has a TDP (Thermal Design Power) of 95W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
95W

AMD Socket Fr2 Platform & Socket

Compatibility information

The Opteron 8350 uses the AMD Socket Fr2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket Fr2
Package
FC-LGA1207
DDR5

AMD Socket Fr2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Opteron 8350 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron 8350 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2 Depends on motherboard
Memory Bus
Dual-channel
Memory Bandwidth
10.7 GB/s
ECC Memory
Supported

Product Information

Release and pricing details

The AMD Opteron 8350 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron 8350 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2007
Launch Price
$1019
Market
Server/Workstation
Status
End-of-life
Part Number
OS8350WAL4BGCOS8350WAL4BGDOS8350WAL4BGE

About AMD Opteron 8350

The AMD Opteron 8350 is an end-of-life processor built for the server/workstation market. The database record shows a 4-core, 4-thread CPU with a base clock of 2000.00, no boost clock, and a 95 TDP. It is listed on AMD Socket Fr2 with dual-channel DDR2 memory support and ECC memory enabled. Manufacturing data includes a 65 nm process, 463 million transistors, and a 285 mm² die. The benchmark array is empty, so the average benchmark score is 0 and the database-wide percentile is 50.

Single-Thread vs Multi-Thread Behavior

The split between single-thread and multi-thread behavior begins with the 4-core/4-thread layout. Because the thread count equals the core count, the processor has four hardware execution contexts and no additional logical threads per core. A single-threaded workload can use one core, but there is no second thread on that core to hide stalls or fill idle execution resources.

The lack of a boost clock is important. The base clock is 2000.00, and the boost clock field is null. That means the highest operating frequency in the record is also 2000.00, whether one core or all four cores are active. Single-thread performance therefore cannot rise above the all-core operating point. There is no temporary frequency uplift for lightly threaded code, so the processor presents the same clock ceiling to every workload.

Cache allocations reinforce the behavior. L1 is 64 KB per core, L2 is 512 KB per core, and L3 is 2 MB shared. The private L1 and L2 caches give each core a local holding area for instructions and data. For a single-threaded task, that private cache can reduce trips to system memory. For a multi-threaded task, the shared L3 gives all four cores a common staging area, which helps when threads operate on shared code or shared data. The shared L3 is the only level of cache that all cores can access in the record.

Memory bandwidth is a shared constraint. The dual-channel DDR2 bus is rated at 10.7 GB/s, and all four cores share that bandwidth. A workload that fits primarily in cache will behave differently from one that streams large amounts of data. The latter will place more pressure on the 10.7 GB/s path and on the motherboard memory controllers. The record does not provide per-core bandwidth figures, so the exact degree of contention cannot be quantified.

For real workloads, three broad cases describe the expected behavior. A lightly threaded, latency-sensitive process runs on one core at 2000.00 and has the full L1 and L2 of that core, plus access to the shared L3. A workload that uses exactly four threads can occupy all four cores at the same 2000.00 clock. A workload that spawns more than four runnable threads must time-share the four execution contexts because there are no more than four threads to run concurrently. The processor therefore behaves as a symmetric 4-thread machine rather than a higher-overlap design.

Platform and Compatibility

The platform is anchored by AMD Socket Fr2. The market segment is server/workstation, and the production status is end-of-life. No new production is listed, so the platform is limited to motherboards that already exist for this socket and to leftover inventory. The record does not list same-socket alternatives, so the database does not provide an upgrade path to a faster part on this socket.

Memory support is DDR2, with the qualification that support depends on the motherboard. The record does not specify a single DDR2 speed grade, so the motherboard is the determining factor for which modules are accepted. The memory bus is dual-channel, and the peak memory bandwidth is listed as 10.7 GB/s. ECC memory is supported, which fits the server/workstation positioning and indicates that the memory path can carry error-correcting codes.

The record lists no integrated graphics and no PCIe configuration. Because integrated graphics is null, the processor does not provide a built-in display output according to the data. Because the PCIe field is null, no lane count or PCIe standard can be quoted. Any display or expansion capability must come from the motherboard or from add-in hardware.

Manufacturing details are present: the process node is 65 nm, the transistor count is 463 million, and the die size is 285 mm². The architecture field is labeled Zen 3, and the codename is Barcelona; the generation label is Opteron (Barcelona). The release date is September 9, 2007. The launch MSRP is $1019.

The multiplierUnlocked field is false. This means the CPU does not carry an unlocked-multiplier designation, so the database does not support claims of multiplier-based adjustment on this part. The combination of a fixed socket, end-of-life status, and no listed PCIe data makes the platform compatibility picture dependent almost entirely on the motherboard rather than on a broader ecosystem defined in the record.

Benchmark Performance

The benchmark section of the record is empty. No individual application scores are stored for the AMD Opteron 8350. The only performance-related fields are the average benchmark score and the database percentile.

The average benchmark score is 0. Because no benchmark entries are present, a score of 0 is not a measured performance result; it is the aggregate of an empty set. The percentileVsAllCpus field is 50, which places this processor at the median of all CPUs in the database. That is a neutral position: half of the tracked CPUs are below this record and half are above it. This is a supplied rank rather than a calculated score from a populated benchmark suite.

Without benchmark entries, no application-level results can be reported. The data does not contain a single-thread score, a multi-thread score, or any workload-specific test. Data users should treat the 50th percentile as the only relative signal present. It does not express single-thread versus multi-thread performance, and it does not identify which CPUs are closest to this part in the overall distribution.

The empty benchmarks array also prevents any exact performance delta from being computed. A typical comparative statement would require at least two scored processors; this record contains zero scored entries. As a result, the benchmark section of this page is necessarily limited to the percentile field and the empty-score context surrounding it.

How It Compares

The nearestRivals array is empty. There are no rival processor names, no rival scores, and no deltaPct values. Without those fields, there is no basis for a named head-to-head comparison against any specific competitor.

The only positional data available is the 50th percentile among all CPUs in the database. This is a coarse ranking, not a rival-to-rival percentage. It places the AMD Opteron 8350 in the middle of the database's CPU distribution, but it does not say which processors are immediately above or below it.

No rival paragraphs are possible because no rivals are supplied. A nearest-rival entry would include a name, a score, and a percentage difference from the Opteron 8350. None of those appear. Therefore, this section cannot state that the Opteron 8350 is ahead of a certain model by a certain percentage, or behind a certain model by a certain percentage. Any such statement would require data that is not present in the record.

Power and Thermals

The thermal design point is a TDP of 95. In the record, that is the only power-related number for this processor. A cooling solution for this CPU should be selected to handle the 95 TDP class.

The boost clock field is null, so there is no listed higher frequency state that would transiently raise power consumption above the base operating point. The multiplier is not unlocked, so multiplier-based overclocking is not part of the official specification. The data does not include measured power draw or thermal resistance values, only the TDP figure.

The process node is 65 nm, with 463 million transistors on a 285 mm² die. These physical specifications describe the scale of the chip, while the 95 TDP describes how much heat a cooling solution must manage under the processor's design load. Because this is a server/workstation part, sustained-load operation is a plausible expectation, and the 95 TDP figure is the reference point for that requirement.

The absence of a boost clock also affects thermal behavior. A processor with no boost state has no higher-frequency mode in the data to add transient heat beyond the listed base operating point. The 95 TDP therefore represents the design ceiling in the record, and the cooling tier implied is one appropriate for a 95 TDP processor.

FAQ

Q: How many cores and threads does the AMD Opteron 8350 have?

A: It has 4 cores and 4 threads. With equal core and thread counts, the processor provides exactly four execution contexts.

Q: What is the base clock and is there a boost clock?

A: The base clock is 2000.00. The boost clock field is null, so no boost clock is listed for this processor.

Q: What memory support is listed?

A: DDR2 memory support is listed, with the caveat that support depends on the motherboard. The memory bus is dual-channel with a peak bandwidth of 10.7 GB/s, and ECC memory is supported.

Q: What socket does the AMD Opteron 8350 use?

A: It uses AMD Socket Fr2. The market segment is server/workstation, and the production status is end-of-life.

Q: What are the cache sizes in the record?

A: L1 is 64 KB per core, L2 is 512 KB per core, and L3 is 2 MB shared.

Q: Is the multiplier unlocked?

A: No. The multiplierUnlocked field is false, so the processor does not carry an unlocked-multiplier designation.

Detailed benchmark scores and charts for the AMD Opteron 8350 are below.

Benchmark Scores

No benchmark data available for this CPU.

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