AMD Opteron 8346 HE (B3)
AMD processor specifications and benchmark scores
At a Glance
AMDAMD Opteron 8346 HE (B3) Specifications
Opteron 8346 HE (B3) Core Configuration
Processing cores and threading
The AMD Opteron 8346 HE (B3) features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
Opteron 8346 HE (B3) Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Opteron 8346 HE (B3) benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron 8346 HE (B3) by AMD can dynamically adjust its frequency based on workload and thermal headroom.
AMD's Opteron 8346 HE (B3) Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the Opteron 8346 HE (B3) processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron 8346 HE (B3)'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Zen 3 Architecture & Process
Manufacturing and design details
The AMD Opteron 8346 HE (B3) is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron 8346 HE (B3) incorporate advanced branch prediction and out-of-order execution for optimal performance.
Zen 3 Instruction Set Features
Supported CPU instructions and extensions
The Opteron 8346 HE (B3) by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
Opteron 8346 HE (B3) Power & Thermal
TDP and power specifications
The AMD Opteron 8346 HE (B3) has a TDP (Thermal Design Power) of 68W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
AMD Socket Fr2 Platform & Socket
Compatibility information
The Opteron 8346 HE (B3) uses the AMD Socket Fr2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
AMD Socket Fr2 Memory Support
RAM compatibility and speeds
Memory support specifications for the Opteron 8346 HE (B3) define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron 8346 HE (B3) determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Opteron 8346 HE (B3) Product Information
Release and pricing details
The AMD Opteron 8346 HE (B3) is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron 8346 HE (B3) by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.
Opteron 8346 HE (B3) Benchmark Scores
No benchmark data available for this CPU.
About AMD Opteron 8346 HE (B3)
The AMD Opteron 8346 HE (B3) is a 4-core, 4-thread Server/Workstation processor from AMD. The data lists its base clock at 1800.00 MHz and provides no boost clock. The architecture field is Zen 3, the codename is Barcelona, and the generation is Opteron (Barcelona). The chip is built on a 65 nm process, contains 463 million transistors on a 285 mm² die, and carries a 68 W TDP. It uses AMD Socket Fr2. The launch MSRP is $698.
Who Should Consider It
This is a server/workstation part, not a consumer desktop processor. It has no integrated graphics listed, so any video output requires a separate graphics device. With 4 cores and 4 threads, the processor can run only four concurrent threads. That thread ceiling makes it a candidate for workloads that fit within four threads, but not for workloads that scale beyond them.
The dataset contains no benchmark entries and reports an average benchmark score of 0. There are no positive scores for gaming, office, or creation workloads to cite. The 50th percentile rating among all CPUs places the part at the midpoint of the database distribution, not in a high-performance tier. For gaming, the absence of integrated graphics and the lack of any game benchmark data mean the database offers no evidence that it is suited to that role. A discrete GPU would be required for any display output, and the 4-thread design would be the ceiling for game-related processing.
For office-style productivity, the relevant features are the 1800.00 MHz base clock, 4 cores, and per-core cache. Those features could support lightly threaded office work, but no benchmark score confirms any specific application behavior. For creation workloads, the restriction is more severe. The average benchmark score is 0, and the dataset shows no rendering, encoding, or compilation scores. The 50th percentile ranking does not suggest top-end performance. The strongest listed attributes for the intended market segment are ECC memory support, dual-channel DDR2 memory, and a 2 MB shared L3 cache. Those are reliability and server-oriented features rather than gaming or high-end creation features.
The data therefore points toward a narrow recommendation: legacy server or workstation systems on Socket Fr2 that need ECC DDR2 memory, four processing threads, and a 68 W TDP envelope. The processor is not presented by the data as a high-score gaming chip or a multi-threaded creation powerhouse.
Power and Thermals
The TDP is 68 W. That is the only power figure recorded, and it defines the thermal class of the processor. A 68 W TDP implies a modest cooling tier; the data does not specify any particular cooler, but this power level is not in the range that would demand exotic cooling hardware. There is no boost clock listed, so there is no turbo frequency to consider for transient power beyond the 1800.00 MHz base operating point.
The physical information in the dataset supports that thermal profile. The process node is 65 nm, the transistor count is 463 million, and the die size is 285 mm². The combination of four cores and a 65 nm process is the recorded basis for the 68 W figure. No separate thermal limits beyond TDP are provided. The production status is end-of-life, so the thermal and power characteristics are historical specifications rather than active product claims.
Platform and Compatibility
The processor uses AMD Socket Fr2. Memory support is DDR2, and the dataset notes that memory support depends on the motherboard. The memory bus is dual-channel, with a listed memory bandwidth of 10.7 GB/s. ECC memory is supported, which matters for server and workstation workloads that need memory error checking.
No PCIe information is recorded in the dataset. No integrated graphics is listed. Expansion and display capabilities are therefore left to the motherboard and add-in cards. The multiplier is locked, so the 1800.00 MHz base clock is the fixed operating point according to the data; no overclocking support is listed. The part number is OS8346PAL4BGH. The release date is 2008-04-30, and the production status is End-of-life. No series name is recorded, and no foundry is recorded.
The upgrade path is constrained by the platform data. The socket is AMD Socket Fr2, and the production status is end-of-life. The dataset does not list a successor processor or a forward upgrade route. Compatibility is tied to Socket Fr2 boards, and memory support is tied to motherboard DDR2 capability. The locked multiplier and absent boost clock also limit any performance adjustment flexibility.
How It Compares
The data includes no nearestRivals entries. There are no rival names, no comparison scores, and no deltaPct values to report. The only comparative metric in the dataset is the percentile vs all CPUs, which is 50. That places the Opteron 8346 HE (B3) exactly at the midpoint of the database distribution.
The average benchmark score is 0, and the benchmark list is empty. Without benchmark scores or rival deltas, a numeric market-positioning statement cannot be made. What can be compared is the recorded feature set: 4 cores, 4 threads, 1800.00 MHz base clock, 68 W TDP, Socket Fr2, DDR2 memory support, dual-channel memory bus, 10.7 GB/s memory bandwidth, ECC memory, and a 2 MB shared L3 cache. No rival paragraphs can be written because the dataset supplies no rival entries for this processor.
Single-Thread vs Multi-Thread Behavior
The processor has 4 cores and 4 threads, so it does not support simultaneous multithreading. Multi-threaded workloads are limited to exactly one thread per core. The base clock is 1800.00 MHz, and there is no boost clock, so the single-thread frequency is the base frequency. The locked multiplier reinforces this fixed operating point.
The cache hierarchy is split between per-core and shared resources. Each core has 64 KB of L1 and 512 KB of L2. The L3 cache is 2 MB and shared across all cores. For single-thread workloads, a core can use its private L1 and L2 plus the shared L3. For multi-thread workloads, all four cores share the L3 and access the dual-channel 10.7 GB/s DDR2 memory path.
The dataset does not provide separate single-thread or multi-thread benchmark scores. The average benchmark score is 0, so there is no measured performance split to compare against other processors. The architecture is listed as Zen 3, but no per-clock performance metric is included. Based on the thread count, this is a four-concurrent-thread design with no boost headroom. Workloads that require more than four threads will not receive additional logical processors, because none are present. The shared 2 MB L3 can help cores cooperate, but the overall thread count remains the hard boundary for multi-threaded scaling.
The Intel Equivalent of Opteron 8346 HE (B3)
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