AMD Opteron 43CX EE

The AMD Opteron 43CX EE is a compact server/workstation processor built around four physical cores and four threads. It uses the Piledriver architecture under the Seoul codename, belongs to the Opteron (Seoul) generation, and fits AMD Socket C32. The data sheet records a 2.20 GHz base clock, a 3.00 GHz boost clock, and a 35 W TDP. In the aggregate CPU ranking, the part sits at the 50th percentile against all CPUs, while its average benchmark score is zero and its nearest-rival list is empty. This means the database gives it a median overall position but no rival-specific deltas to compare. For a four-thread DDR3 server part, the defining facts are the low TDP, the 8 MB shared L3 cache, and the 3.00 GHz boost ceiling.

Platform and Compatibility

The processor uses AMD Socket C32, so platform compatibility begins with motherboards that implement that socket. The architecture is Piledriver, the codename is Seoul, and the generation field labels this as an Opteron (Seoul) part. The process node is 32 nm. The memory support field lists DDR3, but no memory bus width or memory bandwidth figure is recorded, so the data cannot specify memory channels or peak bandwidth. The ECC memory field is false, which means ECC is not marked as an enabled capability in this database. The PCIe field is also unset; no PCIe version, lane count, or topology is provided. On the upgrade path, the entry is defined as an Opteron (Seoul) generation part on 32 nm Piledriver silicon. The die contains 1,200 million transistors on a 315 mm² die. The multiplier is not unlocked, so user-controlled multiplier adjustment is not indicated by the data. The release date is 2012-12-03. The part number is OE43CXHPU4KHK. The server/workstation market segment is the only market placement recorded. The database does not list a chipset, and no memory channel count is present. Together, these facts locate the processor in a specific socket, memory, and generation context.

How It Compares

The nearestRivals field for this CPU is empty. There are therefore no named rival processors, no rival scores, and no deltaPct values to report. The only comparative metric available is percentileVsAllCpus: 50. That value places the Opteron 43CX EE at the midpoint of all CPUs tracked in the database, with an equal number of entries above and below that position in the aggregate ranking. Because the average benchmark score is 0, no score magnitude can be compared against those entries. In practical terms, the data supports only a median-level statement: the processor is not an outlier at either end of the distribution. For exact percentage comparison against a specific rival, the record is insufficient. A percentile of 50 cannot be translated into a lead or deficit over a particular CPU. The comparison picture is therefore coarse: median placement, no rival deltas, and no workload-specific ranking.

Who Should Consider It

The workload evidence in the data is structural rather than benchmark-driven. With four cores and four threads, the processor is suited to workloads that do not need more than four logical processors. The 2.20 GHz base clock and 3.00 GHz boost clock give it a clear serial frequency ceiling, which helps server tasks with latency-sensitive serial sections. For general server and workstation workloads, the 35 W TDP and 4 MB L2 / 8 MB L3 cache make it plausible for low-power environments. The DDR3 support field matters for system planning: the platform must be built around DDR3 memory. The database does not list integrated graphics, and no gaming benchmarks are attached, so gaming use cannot be validated from this record; any display or compute graphics output would have to come from a separate solution, though the data does not specify one. For creation workloads, the four-thread ceiling is the limiting factor; multi-threaded rendering or encoding will not find extra logical threads. For office-style productivity, the boost clock and four threads are the main assets. The market segment is Server/Workstation, and the data points to buyers who accept a four-thread footprint and need a low-power Socket C32 DDR3 part. The data does not include office or creation benchmark scores; the recommendation follows from the clock, cache, core count, and TDP profile.

FAQ

Q: What socket does the AMD Opteron 43CX EE use?

A: It uses AMD Socket C32. No other socket is listed for this part.

Q: What memory type is supported?

A: The memory support field lists DDR3. The database also marks ECC memory as false, and no memory bus width or bandwidth is recorded, so memory channels are not specified.

Q: How many cores and threads does it have?

A: It has 4 cores and 4 threads. The thread count equals the core count, so no additional logical threads are presented.

Q: What is the TDP?

A: The TDP is 35 W. It is the only power figure recorded; no idle power, load power, or cooler requirement is specified.

Q: What cache does it have?

A: The cache configuration is 192 KB L1, 4 MB L2, and 8 MB of shared L3. The L3 is explicitly shared in the data.

Q: When was it released?

A: The release date recorded in the database is 2012-12-03.

Benchmark Performance

The benchmark record contains no score entries, the average benchmark score is 0, and the nearest rivals list is empty. As a result, there are no exact score deltas or percentage comparisons to produce. The strong comparative signal is the 50th percentile against all CPUs. This percentile is a median ranking: the processor sits in the middle of the tracked CPU field. A median placement is useful for context—it is neither a bottom-tier nor a leading-edge result. However, because the average benchmark score is zero, the percentile cannot be cross-checked against a measured score. The zero average score could indicate that no aggregate benchmark was computed, but the data does not define the scale behind avgBenchmarkScore. The safest reading is to rely on the percentile for relative placement and to treat the score field as carrying no magnitude. Since the benchmark field is empty, performance discussions must lean on the clock, cache, core, and TDP data rather than on measured scores. No percentage delta can be computed from the nearestRivals list. The percentile is a relative position, not a speed score; it tells where the CPU sits in the distribution, not how fast it is in a given application.

Single-Thread vs Multi-Thread Behavior

The core and thread counts are identical: 4 cores and 4 threads. This means there are no extra logical threads beyond the four physical cores, so parallel workloads have a hard ceiling of four threads. Serial workloads can use the 3.00 GHz boost clock, which is the highest frequency recorded for the part. The base clock is 2.20 GHz, so lightly threaded bursts have frequency headroom above the base. The relationship between base and boost clocks defines the frequency range: 2.20 GHz at the low end and 3.00 GHz at the high end. The data does not record an all-core boost figure. For serial code, the top of that range is the best-case frequency. For multi-threaded code, all four cores share the part's power and thermal limits, but no all-core clock is listed. The cache hierarchy includes a 192 KB L1, a 4 MB L2, and an 8 MB shared L3. The L1 is the first-level cache, the L2 is the second-level cache, and the L3 is the shared third-level cache; the data describes a three-level cache hierarchy. The shared L3 is relevant for workloads that move data between threads, since they can draw on a common cache pool. The frequency figures are clocks; the data does not specify whether boost applies to all cores or fewer cores.

Power and Thermals

The TDP figure is 35 W, which places this processor in a low-power class for a server/workstation CPU. The 32 nm process and the 35 W TDP are the thermal-relevant facts in the data. A 35 W TDP implies a modest cooling tier; high-end cooling hardware is not necessary based on the data. The Socket C32 platform and Server/Workstation market segment align with system-level cooling rather than unlocked multiplier tuning. The multiplier is not unlocked, so the data does not present an overclocking path for thermal/power management. The 35 W envelope is the only power figure recorded; no idle power, load power, or cooler requirement is specified. The transistor count is 1,200 million and the die size is 315 mm², which provides structural context for the chip, but no thermal resistance or fan specification is recorded. The 32 nm process is the lithography for the chip, and the low TDP combined with the server/workstation segment points to a cooling solution designed for density rather than high heat removal.