AMD

AMD Opteron 2350 HE

AMD processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
79W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 4C / 4T
Base Clock 2000 GHz
L3 Cache 2 MB (shared)
TDP 79W
Architecture Zen 3
Socket AMD Socket Fr2
nm
Process 65 nm
Released Oct 2008

AMD Opteron 2350 HE Specifications

Opteron 2350 HE Core Configuration

Processing cores and threading

The AMD Opteron 2350 HE features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
2

Opteron 2350 HE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Opteron 2350 HE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron 2350 HE by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
N/A
Multiplier
10x

AMD's Opteron 2350 HE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Opteron 2350 HE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron 2350 HE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
2 MB (shared)

Zen 3 Architecture & Process

Manufacturing and design details

The AMD Opteron 2350 HE is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron 2350 HE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3
Codename
Barcelona
Process Node
65 nm
Transistors
463 million
Die Size
285 mm²
Generation
Opteron (Barcelona)

Zen 3 Instruction Set Features

Supported CPU instructions and extensions

The Opteron 2350 HE by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2

Opteron 2350 HE Power & Thermal

TDP and power specifications

The AMD Opteron 2350 HE has a TDP (Thermal Design Power) of 79W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
79W

AMD Socket Fr2 Platform & Socket

Compatibility information

The Opteron 2350 HE uses the AMD Socket Fr2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket Fr2
Package
FC-LGA1207
DDR5

AMD Socket Fr2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Opteron 2350 HE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron 2350 HE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2 Depends on motherboard
Memory Bus
Dual-channel
Memory Bandwidth
10.7 GB/s
ECC Memory
Supported

Opteron 2350 HE Product Information

Release and pricing details

The AMD Opteron 2350 HE is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron 2350 HE by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Oct 2008
Launch Price
$316
Market
Server/Workstation
Status
End-of-life
Part Number
OS2350PAL4BGH

Opteron 2350 HE Benchmark Scores

No benchmark data available for this CPU.

About AMD Opteron 2350 HE

The AMD Opteron 2350 HE is an end-of-life server/workstation processor for the AMD Socket Fr2 platform. It has 4 cores and 4 threads, a 2000.00 MHz base clock, no boost clock, and a launch MSRP of $316. The fact pack assigns it the architecture label Zen 3, the codename Barcelona, and the generation Opteron (Barcelona).

Who Should Consider It

The immediate answer is constrained by the fact pack: the benchmarks array is empty, and the average benchmark score is 0. There are therefore no measured gaming, creation, or office scores to cite. Workload placement has to be inferred from the part’s market segment, cache layout, and memory features rather than from performance results.

The data shows a 4-core, 4-thread server/workstation part. That points toward workloads that can be contained within four threads and toward platforms that need ECC memory. The ECC memory support is enabled, and the memory path is dual-channel with a listed bandwidth of 10.7 GB/s. These are structural server/workstation signals, not consumer gaming or office indicators.

The cache hierarchy is also part of that structural picture: 64 KB of L1 and 512 KB of L2 per core, plus 2 MB of shared L3. With 4 cores and 4 threads, the processor exposes one thread per core. No boost clock is listed, so the 2000.00 MHz base clock is the only frequency datum available. For an unmeasured part, the safest use case is a legacy or replacement server/workstation system built around this socket and TDP class.

Because the database contains no benchmark scores, any specific gaming, creation, or office recommendation would go beyond the facts. A neutral reading is that the processor is positioned in the server/workstation segment, supports ECC memory, uses a 4-thread layout, and end-of-life production status.

How It Compares

The nearestRivals array in the FACT PACK is empty. Consequently, there are no rival names, scores, or deltaPct values to quote. No per-rival paragraph can be written because the data does not include any rival entries.

The only global comparative marker is percentileVsAllCpus: 50. That places the Opteron 2350 HE at the midpoint of all CPUs tracked in the database. However, with an average benchmark score of 0, this percentile is not connected to a measured performance sample. It cannot be read as a validated ranking against named competitors. The absence of nearest rivals means the database has no local comparison context for this part.

Power and Thermals

The Opteron 2350 HE is rated at a TDP of 79. That is the only power or thermal number in the fact pack. No cooling tier, cooler model, or thermal solution is specified.

The manufacturing data around the power envelope is available: the process node is 65 nm, the transistor count is 463 million, and the die size is 285 mm². These are the physical parameters that accompany the 79 W rating. Since there is no boost clock, the frequency range has a single data point, 2000.00 MHz. The database does not include idle or load power measurements, so the thermal position can only be described by the 79 W TDP figure.

FAQ

Q: What socket does the Opteron 2350 HE use?

A: It uses AMD Socket Fr2.

Q: How many cores and threads does it have?

A: It has 4 cores and 4 threads.

Q: Does it support ECC memory?

A: Yes, the ECC memory field is true.

Q: What is the memory configuration?

A: DDR2 support depends on the motherboard, with a dual-channel memory bus and 10.7 GB/s bandwidth.

Q: Does it have an unlocked multiplier?

A: No, the multiplier is locked.

Q: Does it have integrated graphics?

A: No, the integrated graphics field is null.

Platform and Compatibility

The platform anchor is AMD Socket Fr2. Memory support is DDR2 and is listed as depending on the motherboard. The memory bus is dual-channel, with a bandwidth of 10.7 GB/s, and ECC memory is supported.

The fact pack does not include PCIe information, so no PCIe capability can be stated from this entry. The integrated graphics field is null, meaning display output is not listed as part of the processor package.

The production status is end-of-life. The multiplier is locked, so no unlocked multiplier is available. The part number is OS2350PAL4BGH. No series is assigned in the data, and no foundry is listed. Upgrade path information is not present in the fact pack; the only platform-related clues are the socket, the end-of-life status, and the memory dependency on the motherboard.

The architecture field is Zen 3, the codename is Barcelona, and the generation is listed as Opteron (Barcelona). The data does not explain the relationship between these labels, but all three are present in the fact pack.

Single-Thread vs Multi-Thread Behavior

Four cores and four threads means one thread is exposed per core. There are no separate single-thread and multi-thread benchmark scores in the fact pack, so the behavior split cannot be expressed in performance deltas.

The base clock is 2000.00 MHz, and there is no boost clock, so no higher single-thread frequency is listed. Caches are split as 64 KB of L1 and 512 KB of L2 per core, with 2 MB of shared L3. The shared L3 is the only cache level common to all four cores.

A structural reading follows: if an application needs more than four simultaneous threads, this processor cannot provide them. If it needs fewer, it can run them on separate cores, each with private L1 and L2 and access to the shared 2 MB L3. The database does not supply measurements for how that layout behaves in real single-threaded or multi-threaded workloads.

Benchmark Performance

This entry contains no entries in the benchmarks array, and the average benchmark score is 0. There are no scores to compare, and the nearestRivals array is empty, so no names or deltaPct values exist. Exact percentage deltas cannot be calculated from the provided data.

The lone relative figure is percentileVsAllCpus at 50. That indicates a halfway position in the database’s overall CPU distribution. However, because the average benchmark score is 0, the percentile is not tied to any measured performance sample.

The structural numbers—2000.00 MHz base clock, 4 cores, 4 threads, 2 MB shared L3, 64 KB L1 per core, 512 KB L2 per core, and 10.7 GB/s memory bandwidth—define the part’s theoretical position. They do not define benchmark results. Any workload ranking for this processor would require external measurements, which the fact pack does not include.

The Intel Equivalent of Opteron 2350 HE

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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