AMD

AMD Opteron 2347 HE (B3)

AMD processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
68W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 4C / 4T
Base Clock 1900 GHz
L3 Cache 2 MB (shared)
TDP 68W
Architecture Zen 3
Socket AMD Socket Fr2
nm
Process 65 nm
Released Apr 2008

AMD Opteron 2347 HE (B3) Specifications

Opteron 2347 HE (B3) Core Configuration

Processing cores and threading

The AMD Opteron 2347 HE (B3) features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
2

Opteron 2347 HE (B3) Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Opteron 2347 HE (B3) benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron 2347 HE (B3) by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1900 GHz
Boost Clock
N/A
Multiplier
9.5x

AMD's Opteron 2347 HE (B3) Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Opteron 2347 HE (B3) processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron 2347 HE (B3)'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
2 MB (shared)

Zen 3 Architecture & Process

Manufacturing and design details

The AMD Opteron 2347 HE (B3) is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron 2347 HE (B3) incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3
Codename
Barcelona
Process Node
65 nm
Transistors
463 million
Die Size
285 mm²
Generation
Opteron (Barcelona)

Zen 3 Instruction Set Features

Supported CPU instructions and extensions

The Opteron 2347 HE (B3) by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2

Opteron 2347 HE (B3) Power & Thermal

TDP and power specifications

The AMD Opteron 2347 HE (B3) has a TDP (Thermal Design Power) of 68W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
68W

AMD Socket Fr2 Platform & Socket

Compatibility information

The Opteron 2347 HE (B3) uses the AMD Socket Fr2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket Fr2
Package
FC-LGA1207
DDR5

AMD Socket Fr2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Opteron 2347 HE (B3) define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron 2347 HE (B3) determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2 Depends on motherboard
Memory Bus
Dual-channel
Memory Bandwidth
10.7 GB/s
ECC Memory
Supported

Opteron 2347 HE (B3) Product Information

Release and pricing details

The AMD Opteron 2347 HE (B3) is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron 2347 HE (B3) by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Apr 2008
Launch Price
$377
Market
Server/Workstation
Status
End-of-life
Part Number
OS2347PAL4BGH

Opteron 2347 HE (B3) Benchmark Scores

No benchmark data available for this CPU.

About AMD Opteron 2347 HE (B3)

AMD Opteron 2347 HE (B3) is a 4-core, 4-thread server processor from AMD’s Barcelona generation, built on a 65 nm process with 463 million transistors on a 285 mm² die. Released in April 2008, this end-of-life part carries a launch MSRP of $377 and occupies the 50th percentile among all CPUs in the benchmark database, indicating a squarely mid-pack standing. With no direct benchmark scores or nearest rivals recorded in the current data set, the analysis below relies on architectural characteristics, memory subsystem specifications, and thermal envelope to position this processor within its server/workstation context.

Benchmark Performance

The benchmark database currently lists no recorded scores for the Opteron 2347 HE (B3), and its average benchmark score is reported as zero. Consequently, direct performance comparisons against other processors cannot be quantified with delta percentages or percentile deltas, as no nearestRivals entries exist. The absence of benchmark data does not imply absence of capability; rather, it reflects a lack of standardized test submissions for this particular SKU in the database. The processor’s 50th percentile rank, however, places it at the median of all CPUs tracked, suggesting that when measured, its performance likely falls in the middle of the distribution—neither a standout nor a laggard. For a 4-core part from 2008, this mid-pack position aligns with expectations for a power-optimized server chip of that era, where core counts were lower and per-core throughput was the primary driver of application performance. The lack of any boost clock means the 1900.00 MHz base clock is the sole operating frequency, a fixed point that simplifies thermal and power management but limits single-threaded headroom. In absence of measured scores, architectural features—such as the shared 2 MB L3 cache and per-core 512 KB L2—provide the only indirect evidence of performance, suggesting a design balanced for consistent, predictable throughput rather than peak burst capability.

Single-Thread vs Multi-Thread Behavior

With 4 cores and 4 threads, the Opteron 2347 HE (B3) offers no simultaneous multithreading, meaning each core handles exactly one thread. This configuration makes single-thread performance a direct function of the 1900.00 MHz clock and the per-core cache hierarchy: 64 KB of L1 and 512 KB of L2 per core. For legacy server workloads that were often single-threaded or lightly threaded—such as database transactions with low concurrency or single-threaded administrative scripts—the processor’s relatively modest clock speed would likely yield lower per-thread throughput compared to higher-clocked contemporaries. However, the 2 MB shared L3 cache acts as a buffer for frequently accessed data, potentially mitigating some latency penalties from the dual-channel DDR2 memory subsystem, which offers 10.7 GB/s of bandwidth. Multi-threaded behavior, in contrast, scales linearly with core count since there is no hyper-threading overhead; four independent threads can run without resource contention beyond shared L3 and memory bandwidth. The absence of a boost clock means multi-threaded workloads cannot benefit from temporary frequency increases on active cores, so sustained multi-core performance is strictly bound by the base clock and thermal limits. For server tasks that scale well with thread count—such as web serving with multiple worker processes or parallel batch jobs—the processor’s four cores provide a predictable, if modest, level of parallelism, but the 68 W TDP suggests a design prioritizing power efficiency over raw throughput, likely making it suitable for lightly loaded or power-constrained environments rather than compute-intensive HPC deployments.

Platform and Compatibility

The Opteron 2347 HE (B3) uses the AMD Socket Fr2, a platform specific to the Barcelona generation of Opteron processors. Memory support is DDR2, with the actual type and capacity depending on the motherboard, as indicated by the "Depends on motherboard" note. The integrated memory controller operates in dual-channel mode, providing a theoretical memory bandwidth of 10.7 GB/s—a figure that underscores the era’s transition from DDR to DDR2 but also highlights the bandwidth limitations compared to modern platforms. ECC memory is supported, which is critical for server reliability, allowing error correction in memory-intensive workloads such as large databases or virtualized environments. The platform does not list PCIe support in the fact pack, suggesting that expansion capabilities are either legacy (e.g., PCI-X) or motherboard-dependent, which is typical for server platforms of this vintage. The processor’s production status is end-of-life, meaning no new systems are being built with it, and upgrade paths are limited to other Socket Fr2 processors within the same Barcelona generation. The multiplier is locked, preventing overclocking, which aligns with its server market segment where stability and consistent operation are prioritized over enthusiast tuning. For existing systems, the upgrade path is constrained to swapping among compatible Barcelona Opterons, but the 68 W TDP class (HE, or High Efficiency) suggests that this SKU is positioned for power-sensitive deployments, potentially allowing upgrades to higher-TDP parts only if the motherboard’s power delivery and cooling support them—though such details are not specified in the current data.

How It Compares

Since the nearestRivals array is empty, there are no direct comparative benchmarks available for the Opteron 2347 HE (B3) against specific competing processors. The database does not list any rival names, scores, or deltaPct values, so a positional analysis relative to other CPUs must rely on the 50th percentile ranking. This percentile indicates that the processor sits exactly at the median of all CPUs in the database, meaning half of all tracked processors are expected to outperform it and half to underperform it. In practical terms, this places the Opteron 2347 HE (B3) in the lower half of server processors from its era, given that many contemporary server chips offered higher core counts (6 or 8 cores) or higher clock speeds. The 4-core, 4-thread configuration with a 1900.00 MHz clock is likely competitive with entry-level server SKUs of the time but would trail higher-end Barcelona parts with more cores or faster clocks. The absence of benchmark data prevents any quantitative deltas, but the architectural specifications—65 nm process, 463 million transistors, 2 MB shared L3—suggest a design optimized for moderate workloads with a focus on power efficiency (68 W TDP) rather than maximum performance. For organizations running legacy applications that are not thread-hungry, this processor could deliver adequate performance within a constrained power budget, but for modern workloads, it would be significantly outpaced by even entry-level current processors, which typically offer higher clocks, more cores, and faster memory.

Power and Thermals

The Opteron 2347 HE (B3) carries a 68 W thermal design power (TDP), a figure that explicitly positions it in the "High Efficiency" (HE) tier of AMD’s Opteron lineup. This low TDP for a 4-core server processor from 2008 indicates a strong emphasis on power conservation, making it suitable for dense server deployments where heat dissipation and electricity costs are primary concerns. The 65 nm process node, while not cutting-edge for its time, contributes to the power envelope; the 463 million transistors operating at 1900.00 MHz are managed within a 68 W budget, suggesting careful voltage and frequency tuning. For cooling, this TDP class implies that a standard passive heatsink or a low-profile active cooler designed for 1U servers would suffice, as the thermal output is modest compared to higher-TDP server parts that might require larger heat sinks or forced-air cooling in chassis with limited airflow. The HE designation also means that this processor is likely to maintain stable operation under sustained load without thermal throttling, provided the system’s cooling solution meets the motherboard’s specifications. In a multi-socket configuration, the 68 W TDP per socket would allow for more processors per chassis without exceeding power delivery or cooling limits, a key advantage in blade servers or high-density rack units. However, this efficiency comes at the cost of raw performance, as the low clock speed and lack of boost capability limit the processor’s ability to handle sudden bursts of compute-intensive activity. For workloads that are continuous and predictable, the Opteron 2347 HE (B3) offers a balanced trade-off between power consumption and throughput, but for performance-critical applications, a higher-TDP sibling with more cores or a faster clock would be more appropriate, assuming the platform’s thermal design can accommodate it.

The Intel Equivalent of Opteron 2347 HE (B3)

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

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