AMD

AMD Opteron 2347 (B3)

AMD processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
95W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 4C / 4T
Base Clock 1900 GHz
L3 Cache 2 MB (shared)
TDP 95W
Architecture Zen 3
Socket AMD Socket Fr2
nm
Process 65 nm
Released Apr 2008

AMD Opteron 2347 (B3) Specifications

Opteron 2347 (B3) Core Configuration

Processing cores and threading

The AMD Opteron 2347 (B3) features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
2

Opteron 2347 (B3) Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Opteron 2347 (B3) benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Opteron 2347 (B3) by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1900 GHz
Boost Clock
N/A
Multiplier
9.5x

AMD's Opteron 2347 (B3) Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Opteron 2347 (B3) processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Opteron 2347 (B3)'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
2 MB (shared)

Zen 3 Architecture & Process

Manufacturing and design details

The AMD Opteron 2347 (B3) is built on AMD's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Opteron 2347 (B3) incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3
Codename
Barcelona
Process Node
65 nm
Transistors
463 million
Die Size
285 mm²
Generation
Opteron (Barcelona)

Zen 3 Instruction Set Features

Supported CPU instructions and extensions

The Opteron 2347 (B3) by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2

Opteron 2347 (B3) Power & Thermal

TDP and power specifications

The AMD Opteron 2347 (B3) has a TDP (Thermal Design Power) of 95W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
95W

AMD Socket Fr2 Platform & Socket

Compatibility information

The Opteron 2347 (B3) uses the AMD Socket Fr2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket Fr2
Package
FC-LGA1207
DDR5

AMD Socket Fr2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Opteron 2347 (B3) define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Opteron 2347 (B3) determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2 Depends on motherboard
Memory Bus
Dual-channel
Memory Bandwidth
10.7 GB/s
ECC Memory
Supported

Opteron 2347 (B3) Product Information

Release and pricing details

The AMD Opteron 2347 (B3) is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Opteron 2347 (B3) by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Apr 2008
Launch Price
$316
Market
Server/Workstation
Status
End-of-life
Part Number
OS2347WAL4BGH

Opteron 2347 (B3) Benchmark Scores

No benchmark data available for this CPU.

About AMD Opteron 2347 (B3)

Launched on 2008-04-08 with a launch MSRP of $316, the AMD Opteron 2347 (B3) is an end-of-life server/workstation processor. It combines four cores and four threads, a base clock of 1900.00 MHz, and no boost clock. The chip is built on a 65 nm process with 463 million transistors on a 285 mm² die, and the database labels its architecture as Zen 3, its codename as Barcelona, and its generation as Opteron (Barcelona). It targets the AMD Socket Fr2 platform and carries a TDP of 95. Memory support is dual-channel DDR2 with ECC and a listed bandwidth of 10.7 GB/s. In the benchmark database, the processor sits at the 50th percentile of all CPUs, and its average benchmark score is 0, which means no usable speed measurement has been recorded.

How It Compares

The nearestRivals field is empty; therefore, there are no per-rival paragraphs to report. The only comparative figure in the data is percentileVsAllCpus, and that value is 50, placing the Opteron 2347 (B3) exactly at the midpoint of every CPU in the database.

The average benchmark score is 0, so this midpoint position cannot be confirmed by actual test runs; it is an assigned rank in the aggregate distribution. With four cores and four threads, the processor is a four-thread performer, and the 1900.00 MHz base clock is the only speed state in the records. No boost clock and no unlocked multiplier mean there is no documented path to a higher frequency from the processor's own settings. Because the nearestRivals array contains no names, scores, or deltaPct values, the data cannot support claims such as "ahead of a specific rival by a percentage" or "behind a specific rival by a particular margin."

The correct reading is a middle-of-distribution placement without any measured benchmark evidence. The zero score and the empty rival list are consistent: this processor has no verified performance runs in the database. The 50th percentile means that, in the ranking scheme behind the database, the part sits exactly in the middle: half of the CPUs in the population are at or below its placement and half are at or above it. This is a useful orientation, but it is not a substitute for a benchmark score. The data supplies a configuration profile, not a validation score.

Power and Thermals

Thermal design power is stated as 95. That places the processor in a mid-range thermal tier, rather than a low-power or high-power class. The physical parameters behind that tier are the 65 nm process, the 285 mm² die, and the 463 million transistors on the package. Since no boost clock is listed, the thermal budget does not need to cover a higher transient frequency; 1900.00 MHz is the only clock state in the data. The multiplier is locked, so the 95 TDP is not meant to be expanded through a processor frequency multiplier.

The dataset contains no measured temperature or power consumption numbers, so the 95 TDP is the only thermal figure available for system design. The data does not specify a heatsink size, fan requirement, or thermal solution. What it does specify is the 95 TDP figure, the 65 nm process, the 285 mm² die, and the 463 million transistor count. These are the input variables a system designer would combine with chassis airflow to choose a cooler. Because no boost clock is listed, the thermal design does not have to accommodate a second, higher clock state. Because the multiplier is locked, the heat load cannot be increased by a multiplier change. ECC memory support and the server/workstation market segment complete a picture of a reliability-oriented thermal envelope. In the absence of measured thermals, the 95 TDP remains the definitive cooling-tier number.

Who Should Consider It

The available data contains no benchmark scores for gaming, creation, or office applications, so recommendations must be built from the configuration. Four cores and four threads map directly to applications that can use four concurrent tasks. The cache hierarchy provides 64 KB of L1 per core, 512 KB of L2 per core, and 2 MB of shared L3; these are the resources a creation or office thread would feed on. The dual-channel DDR2 memory bus moves data at 10.7 GB/s, and ECC support is present for memory reliability. The base clock is 1900.00 MHz with no boost clock, so the processor's maximum speed in any single-threaded phase is that fixed value.

For creation workloads, the four threads can be kept busy across cores, while the shared L3 gives the four threads a small common pool; the fixed clock is the ceiling on per-thread progress. For office workloads, the combination of four threads, dual-channel DDR2, and ECC is the relevant profile; the database offers no office benchmark score, but the memory reliability features are concrete. For gaming, the data is even more sparse: no integrated graphics is listed, no boost clock is listed, and no gaming score is recorded. A discrete graphics device would be required for display output, and the fixed 1900.00 MHz base clock is the only processor-speed fact available to bound game performance.

The market segment is explicitly server/workstation, which is more restrictive than a generic desktop label. That segment, combined with the four-thread ceiling, narrows the intended use to server software written for a small number of threads. The ECC support and motherboard-dependent DDR2 memory suggest a system integrator who values memory stability over maximum bandwidth. The 95 TDP and end-of-life status also affect who should consider the part: a builder with an existing Socket Fr2 board can match it to the board's DDR2 support and 95 TDP cooling tier, but a new build would be entering a legacy platform. The 50th percentile rank and the average score of 0 reinforce that this part has no measured performance claim. Therefore, the best candidate for this processor is someone running a four-thread server or workstation workload on a Socket Fr2 platform with a 95 TDP cooling solution.

FAQ

Q: What is the core and thread configuration?

A: The Opteron 2347 (B3) has four cores and four threads. It can run one thread per core, with no simultaneous multithreading listed.

Q: What memory support does the platform provide?

A: Memory support is dual-channel DDR2 and depends on the motherboard. The listed memory bandwidth is 10.7 GB/s, and ECC memory is supported.

Q: What is the socket and power class?

A: It uses AMD Socket Fr2 and has a TDP of 95. The multiplier is locked, so the operating frequency is not user-adjustable through the CPU multiplier.

Q: What are the clock speeds?

A: The base clock is 1900.00 MHz; no boost clock is listed.

Q: What is the cache geometry?

A: L1 cache is 64 KB per core, L2 is 512 KB per core, and L3 is 2 MB shared.

Q: What is the release and production status?

A: The release date is 2008-04-08, and the production status is end-of-life.

Platform and Compatibility

The platform is defined by the AMD Socket Fr2 interface. Memory support is DDR2 and depends on the motherboard, using a dual-channel bus at 10.7 GB/s. ECC memory is supported. PCIe information is not listed in the dataset, so expansion-lane capacity cannot be stated. The processor has four cores and four threads on a 65 nm process, with a 285 mm² die and 463 million transistors. The architecture is labeled Zen 3 and the codename is Barcelona; the generation is Opteron (Barcelona). The production status is end-of-life and the release date is 2008-04-08, which together define the platform as a legacy server/workstation socket.

The upgrade path is constrained by the end-of-life status and by the motherboard-dependent DDR2 support; no other sockets or compatible processors are named in the data. The locked multiplier and the absent boost clock mean the frequency is fixed at 1900.00 MHz, while the TDP of 95 fixes the cooling requirement. There is no integrated graphics, so any display must come from a separate device. The average benchmark score of 0 and the 50th percentile provide no evidence for or against a specific workload on this platform. The memory bandwidth of 10.7 GB/s is the only bandwidth figure in the data, and it is tied to the dual-channel DDR2 interface. No PCIe field is present, so the data cannot confirm how many expansion lanes are available; a system planner should not infer lane counts from other components. The architecture field in the data is Zen 3, while the codename is Barcelona; neither label changes the socket, memory, or thermal facts. A system built around this processor would be a Socket Fr2, DDR2, ECC-capable, 95 TDP server/workstation machine, with no documented PCIe specification and no measured performance score.

The Intel Equivalent of Opteron 2347 (B3)

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